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The German automotive supplier said the facility, formally inaugurated on 8 October, already employs more than 120 engineers and is expected to increase its workforce to more than 300 over the coming years. It did not specify a deadline for reaching that target or disclose the investment involved.

Engineers at the Pune centre are working on software, hardware, systems engineering and mechanical development for customers internationally. Their responsibilities include embedded software, functional safety, cybersecurity and technologies associated with the next generation of steering and chassis systems.

The operation will collaborate with Thyssenkrupp’s development teams in other countries throughout product development, rather than concentrating exclusively on projects for the domestic vehicle market. The company described the facility as an integrated part of its global research and development organisation.

Viktor Molnar, chief operating officer of Thyssenkrupp Automotive Technology, said software, electronics and collaboration between engineering teams across countries were becoming increasingly important to the automotive industry. The Pune operation would provide additional development capacity for customers worldwide, he said.

The expansion reflects changes in vehicle engineering as software increasingly controls functions previously handled primarily through mechanical components. Steering and chassis systems now require developers to coordinate electronic hardware, embedded code and physical components while meeting stringent safety and security requirements.

Functional safety work concerns the identification and control of hazards arising from failures in electrical and electronic systems. Cybersecurity engineering addresses vulnerabilities that could expose connected vehicle functions to interference or unauthorised access. Both are integral to the development of more digitally controlled automotive systems.

The Pune engineers will contribute to customer programmes at different stages of development, including systems design and integration. Thyssenkrupp has not identified individual vehicle manufacturers whose programmes will be handled at the new location, nor has it disclosed specific contracts associated with the expansion.

Björn Erbe, a senior research and development executive in Thyssenkrupp Automotive Technology’s chassis business, said the intention was to establish a significant engineering operation integrated with the group’s international teams. Combining expertise based in Pune with the company’s existing technical resources would enable it to expand development activities, he said.

The centre is situated at Solitaire Business Hub 2 in Pune’s Baner-Balewadi business district. The company identified the city’s established automotive manufacturing sector, universities, engineering businesses and availability of software specialists as factors behind its choice of location.

Recruitment is expected to concentrate initially on software, hardware and mechanical engineering, with specialist capabilities added according to technical needs and customer demand. The company has also indicated that it sees opportunities to work with universities and the wider engineering community in Pune.

The company’s move also places engineering functions and prospective customer engagement in the same city, although it has not yet publicly said whether the new sales organisation will operate from the engineering premises. The plans for sourcing and sales are separate from the confirmed staffing figures for the development centre.

The engineering investment forms part of a broader plan to expand Thyssenkrupp Automotive Technology’s activities in India. The company is strengthening its sourcing operations and establishing a sales team in Pune to build relationships with vehicle manufacturers and pursue business locally.

Manufacturing is not included in the newly inaugurated engineering centre. Thyssenkrupp said it envisages establishing production capabilities in India only if it secures suitable customer projects. No factory location, investment commitment or production timetable has been announced.

The distinction means the confirmed expansion concerns engineering capacity, while local manufacturing remains conditional on commercial demand. The company has similarly not given a precise timetable for the next phase of staffing at the Pune development site.

Plans for the facility were first announced in 2025, and engineering operations were progressively established before the formal opening. The inauguration therefore marks an expansion of an existing development team rather than the beginning of work at an entirely unstaffed location.

Thyssenkrupp’s steering business also announced a partnership with L&T Technology Services in June 2025 for a Pune software development hub dedicated to safety-critical steering applications. That agreement provided for L&T Technology Services to establish and manage the hub on the steering business’s behalf. The latest inauguration announcement did not specify whether the two Pune operations share facilities or personnel.

Su held talks with Young Hyun Jun, Samsung’s vice chairman and chief executive of its Device Solutions division, during a visit to South Korea that also included discussions with SK Hynix chief executive Kwak Noh-jung. The meetings placed high-bandwidth memory, broader DRAM supplies and possible foundry co-operation at the centre of AMD’s efforts to secure capacity for its expanding AI business.

Speaking to reporters in Seoul, Su said AMD continued to explore opportunities with Samsung across both memory and contract chip manufacturing. She described Samsung and SK Hynix as critical partners for AMD’s data-centre ambitions and urged memory producers to add capacity as quickly as possible.

The talks come as shortages across parts of the memory market complicate expansion plans for chip designers and data-centre operators. Demand for high-bandwidth memory, or HBM, has surged because AI accelerators require substantially greater memory bandwidth than conventional computing processors, while strong demand has also tightened supplies of standard DRAM products.

Su said the supply environment remained tight and AMD was working with customers to optimise their memory requirements so available capacity could support more computing. She said the company had built a strong supply chain but was working with suppliers to accelerate its expansion.

AMD expects demand for AI computing to remain elevated for several years and plans to increase chip supply substantially in 2027. Su said during a stop in Taiwan this week that the company had extended its capacity-planning horizon from one or two years to between three and five years as it works with manufacturing partners.

That planning encompasses advanced wafers, packaging, substrates and memory, all of which have become potential constraints as companies race to build AI infrastructure. AMD has been expanding its Instinct accelerator business as it competes with Nvidia for spending by cloud providers and other large data-centre customers.

Samsung already occupies an important position in AMD’s supply plans. The companies signed a memorandum of understanding in March covering next-generation AI memory and computing technologies, with Samsung designated a primary HBM4 supplier for AMD’s Instinct MI455X graphics processor.

Their agreement also covers advanced DRAM products for AMD’s sixth-generation EPYC processors, code-named Venice, and its Helios rack-scale AI platform. Samsung has supplied HBM3E memory for AMD’s MI350X and MI355X accelerators, extending a technology relationship between the companies that spans graphics, mobile and computing products.

HBM4 is particularly important to the next generation of AI hardware because increasingly powerful accelerators need faster transfers of enormous datasets while controlling energy consumption. Memory manufacturers have consequently directed more investment towards HBM, leaving capacity across other memory categories under pressure.

Samsung has been seeking to increase its position in the high-margin HBM market while SK Hynix remains another major supplier to AI chip developers. Strong AI demand has supported memory prices and earnings, though the pace of conventional DRAM price increases is expected to moderate after steep gains earlier this year.

AMD’s discussions with Samsung could also extend beyond memory. Their March agreement provided for talks on a possible foundry partnership under which Samsung could manufacture future AMD products. Su said on Wednesday that AMD was continuing to examine opportunities in that area, without announcing a manufacturing contract.

The possibility would give AMD another potential production option as advanced semiconductor capacity remains heavily sought after. Taiwan Semiconductor Manufacturing Co remains a central manufacturing partner for AMD, and Su met suppliers in Taiwan before travelling to South Korea as part of her capacity discussions.

The Hangzhou-based AI developer released Ascend versions of several key components on September 30, including its DeepGEMM matrix-multiplication library and DeepEP communications software. The projects are designed to work with Huawei’s Ascend processors while keeping public interfaces aligned with versions built around Nvidia hardware, reducing the amount of code developers may need to rewrite when moving workloads.

That portability targets a critical part of Nvidia’s competitive advantage. Nvidia’s CUDA software platform has become deeply embedded in AI development, giving programmers mature libraries, tools and optimisation techniques built over years. Competing chips therefore have to overcome not only differences in raw computing performance but also the cost and complexity of shifting software away from CUDA.

DeepSeek’s DeepJIT project takes a further step by providing a shared runtime interface for Nvidia CUDA graphics processors and Huawei Ascend neural-processing units. It handles compilation, caching, loading and launching of specialised AI kernels while retaining backend-specific code where necessary. The approach does not make the two architectures interchangeable, but it can reduce friction for developers maintaining software for both.

DeepGEMM-Ascend is fully API-compatible with DeepSeek’s original DeepGEMM package and supports BF16, FP8 and FP4 calculations used in demanding AI workloads. DeepSeek says the library uses Ascend-specific optimisation methods to approach the hardware’s performance limits while shielding programmers from lower-level complexities including memory layouts, alignment constraints and address calculations.

Its DeepEP-Ascend library similarly aligns its public buffer interfaces with the Nvidia version while using Huawei’s communications technologies underneath. DeepSeek has also added Ascend support to DeepSelect, a specialised component used for sparse-attention and sampling operations, and released Ascend sparse-attention kernels for its model infrastructure.

Huawei, meanwhile, has been opening more of the software surrounding Ascend. Its CANN platform — the company’s counterpart to the programming infrastructure required to exploit AI accelerators — supports frameworks including PyTorch and works with open-source projects such as Triton, vLLM and veRL.

Huawei said last month that CANN had moved to sustained community-driven open-source development, with external programmers accounting for 61 per cent of its CANN developers. The company said the community had more than 5,200 monthly active developers, while more than 40 models had been natively pre-trained using Ascend and CANN.

The combination matters because China’s challenge to Nvidia has increasingly shifted from producing an alternative accelerator to assembling a usable full computing stack. Hardware can win orders only if model developers can train and run workloads efficiently without sacrificing too much engineering time or performance.

DeepSeek’s software also gives Huawei an influential independent developer helping test and improve that stack. The AI laboratory became prominent for building capable models with an emphasis on computational efficiency, and its infrastructure code is closely watched by developers seeking lower-cost approaches to training and inference.

The effort comes as US export controls continue to restrict China’s access to Nvidia’s most advanced processors, creating stronger incentives for technology groups to adopt domestic alternatives. Those restrictions have helped expand the strategic importance of Huawei’s Ascend line, even though China still faces constraints in advanced semiconductor manufacturing.

Nvidia nevertheless retains formidable advantages. CUDA has a vast installed developer base and an extensive collection of mature libraries, while Nvidia’s leading accelerators remain central to major AI training systems outside China. Compatibility layers and open-source libraries also require sustained testing, documentation and optimisation before they can match the reliability of an established platform across diverse workloads.

Richard Yu joined Huawei in 1993, working on early developments like the first-generation program-controlled switch and participating in the establishment of Huawei’s wireless communications business, which started with GSM. Over the past decade, Yu has led Huawei’s consumer business with the vision to deliver a seamless AI life experience to all consumers across five key scenarios: HIMA-powered Smart Travel, HarmonyOS Office, Smart Home, Fitness & Health, and Entertainment, which he said is also the long-term strategy for Huawei’s consumer business over the next 10 years.

Between 2007 and 2025, Huawei invested more than CNY1.8 trillion into R&D shifting from roughly 10% of annual revenue in early years to over 20% recently. Huawei has continued to increase investment into the core technologies of the ICT domain and basic research, which has translated into robust core capabilities, extensive intellectual property, and a vast patent portfolio, and helped with achieving a series of breakthroughs in technological innovation.

The Mate 90 series smartphones Huawei just launched come with the latest Kirin 9050 Pro chip. The overall device performance is 31% higher than the previous generation. The Balong modem, image sensor processor (ISP), mobile security processor (MSP), Lingxi CPU, Maleoon GPU, and the NPU that adopts Huawei’s Da Vinci architecture for AI processing are all designed by Huawei. They offer higher energy efficiency and deliver much-improved overall system-level performance.

Even though Yu admitted that Huawei has limited access to advanced semiconductor processes, Huawei recently made a new breakthrough in the semiconductor domain – the LogicFolding technology under the Tau Scaling Law. Unveiled by He Tingbo, head of Huawei’s Semiconductor Business Department this May, this technology vertically stacks the logic layers of chips and restructures the circuit layout through inter-layer high-density interconnect to shorten critical paths and reduce latency. This technology was adopted on Kirin 9050 Pro chip, which shows very strong AI processing power. The Mate 90 series powered by this chip can run a 30B MoE on-device AI model.

In the AI domain, Yu talked about the Ascend compute foundation that Huawei provides, by remarking Huawei’s large models called openPangu, AI capabilities for intelligent driving, and HarmonyOS Celia, which is similar to Gemini in the Google Android ecosystem. Huawei is also using AI to improve the O&M of communications network equipment. By combining AI computing power with domestic open-source large models, Huawei’s vision is to help enterprises and industries around the world to become more productive and bringing more convenience to everyone.

In the past years, Huawei has launched a broad series of products and solutions, including smartphones, PCs, tablets, wearables, TWS audio products, Smart TVs, home routers, smart home control solutions, as well as intelligent electric vehicles together with partners. Underlying these products and solutions are Huawei’s chip hardware platform and HarmonyOS – another OS ecosystem after iOS from Apple and Android from Google that Huawei developed to support all the smart devices and smart hardware across all scenarios.

Development of HarmonyOS began in 2019. Before that, Huawei was a major contributor to the Android community as well as the entire Android ecosystem. Now, more than 90 million devices, including smartphones, PCs, and tablets, currently run on HarmonyOS 6 and HarmonyOS 7. This figure is expected to hit the 100 million mark by the end of this year. The number of apps and services in the HarmonyOS ecosystem has already exceeded 450,000. Its global registered developer count has reached 11 million, and Huawei now has over 23,000 app innovation partners. Expressing his special thanks to all partners and developers for their trust and support, Yu also pointed out that Huawei is considering gradually bringing HarmonyOS to the global market in the future.

Globalization is another topic of the conversation. Yu mentioned that Huawei had very good collaboration with many companies from the US, Europe, Japan, South Korea, and Taiwan, delivering huge business value and benefits to those partners. When it comes to the difficulties that Huawei overcame since 2019, Yu said that relying on homegrown technologies and capabilities, Huawei gradually designed its own operating system and developed basic tools and software by themselves, putting a domestic supply chain in place. In 2023, Huawei started to manufacture the chips used by smartphones domestically again. With these chips and HarmonyOS, and by relying on China’s domestic supply chain, materials, and process nodes, Huawei has basically gotten rid of the dependence on US technologies.

While Huawei’s global market share was once No. 1, nowadays it only sells several million units of smartphones outside China every year. However, Yu revealed that Huawei is trying to return to the overseas market step by step.

Taking wearables as an example, Huawei is No. 1 in terms of the market share both in China and globally. Other innovative products such as TWS earphones, are also growing fast and have reached No. 1 in many countries. While Huawei’s tablet and PC business was greatly affected after it was denied access to Windows and Intel x86 chips, the HarmonyOS-based tablets are now performing strongly. Another example would be CPE, which is a mobile router that provides connectivity to the unconnected in remote and rural areas. These products are also very well received across many regions outside China, helping more people connect to the rest of the world and live better lives.

Question: Both the Huawei XT 2 and the two most advanced models of the Mate 90 series use a LogicFolding chip. Will LogicFolding chips be used for more phones in the future? We understand that Huawei’s chip production capacity is still limited. Huawei has launched SuperPoDs, and AI infrastructure is a huge business. They are both very important in China. How do you secure a larger share of the chip supply internally?

Richard Yu: We started introducing the chip that adopts the LogicFolding technology powered by the Tau Scaling Law to the Mate XT 2 tri-fold phone. To answer your question, yes, more of our phones will definitely use these LogicFolding chips in the future.

Currently, the production capacity for advanced semiconductors in China still cannot meet the rapidly growing demand. Huawei’s Ascend chips for the AI domain also use such capacity. But we have developed a requirement plan, which also covers the chip requirements of smartphones.

The sharp price increase for memory components over the past two years has somewhat limited the smartphone sales volume. Even though the production capacity remains tight right now, generally it is sufficient to meet our market shipment needs.

We hope that production capacity will ramp up in China’s semiconductor industry so that we can manufacture more advanced products for consumers in the Chinese market as well as the overseas market in the future.

To read the full Q&A session:
https://www.apmultimedianewsroom.com/multimedia-newsroom/continuous-innovation-securing-our-competitive-edge-through-technological-breakthroughs

Hashtag: #Huawei

The issuer is solely responsible for the content of this announcement.

Richard Yu, Executive Director of Huawei, Director of the Investment Review Board, and Chairman of the Huawei Consumer BG, stated: “The HUAWEI Mate 90 Series is equipped with the flagship Tau chipset across the entire series. Through vertical integration of hardware, software, chips, and cloud, we have achieved a comprehensive evolution in design, performance, imaging, reliability, and smart user experience. Today, we step into a new era of brilliance.”

Between 2007 and the end of 2025, Huawei invested a total of CNY1.8 trillion into R&D. Today’s product breakthroughs are the direct result of long-term R&D investment and a foundation of core technology. Huawei is turning foundational advancements in Kirin, HarmonyOS, and beyond into tangible product experiences that consumers can truly feel.

Meticulously Crafted, Radiant at First Sight

The HUAWEI Mate 90 Series introduces a refined, seamless design, pairing a glossy mid-frame with a matte metal rear cover.

In terms of durability, the Mate 90 Pro and higher models are built on the full-body Kunlun Xuanwu architecture. The camera cover introduces the industry’s first Optical Kunlun Glass, delivering 20x better drop resistance, while the front display is protected by 3rd-gen Kunlun Glass, offering a 50% improvement in impact resistance. The Pro Max Premium Edition and RS ULTIMATE DESIGN go further with upgraded Xuanwu Kunlun Glass, cutting reflections by 70% and boosting scratch resistance by 16x. The entire lineup supports IP68 dust and water resistance up to 6 meters alongside IP69 resistance against high-temperature, high-pressure water jets.

Powered by LogicFolding Tau Chip: A Massive Leap in Performance

At the heart of the HUAWEI Mate 90 Pro Max is the LogicFolding Tau Chip, built on an innovative architecture that drastically compresses critical path latency to enable 5 million signal transmission bonds and an impressive 125 TB/s inter-die bandwidth. The Pro Max Premium Edition and RS ULTIMATE DESIGN are powered by the Kirin 9050 Pro chip, delivering a 31% increase in overall performance. Meanwhile, the Pro model’s Kirin 9035 chip brings a 20% performance boost, and the standard edition’s Kirin 9030 chip offers a 27% gain in performance.

Vertically integrated with HarmonyOS 7 across hardware, software, chips, and the cloud, the Kirin 9050 Pro CPU supports hyper-threading technology for effortless, ultra-smooth operations. Mobile gaming also reaches new heights with hardware-accelerated ray tracing, capable of rendering up to 55 million rays per second.

Second-Generation Linglong Display: A Screen That Truly Stands Out

The HUAWEI Mate 90 Pro introduces the second-generation Linglong Display, reaching an unprecedented peak brightness of 12,000 nits at 1% APL. Built on an enhanced Tandem OLED Architecture, panel lifespan is extended by 138%. The HUAWEI Mate 90 Pro Max and RS ULTIMATE DESIGN debut the Full-color Linglong Display. Leveraging its 12,000-nit ultra-high brightness and full BT.2020 end-to-end color management, over 60 mainstream apps can now upsample P3 content to vibrant, full-color BT.2020 quality. Eye care technology also receives a major upgrade, featuring industry-first ambient light detection and a 1-nit ultra-low brightness eye-comfort mode for a seamless, strain-free viewing experience.

Breakthrough Connectivity & Reliable Outdoor Utility

Connectivity gets a total overhaul. The industry-first Wi-Fi and cellular converged antenna architecture boosts signal gain by 2 dB. The entire lineup supports eSIM, with the Pro Max pioneering four-SIM, three-standby functionality. With multi-device communication sharing, photo and video upload speeds are boosted by up to 40% in congested environments like crowded concerts or remote outdoor areas.

XMAGE True-to-Color Portrait

The entire series comes equipped with True-to-Color Camera 3.0, featuring full-focal-length infrared optical coating for the first time, which advances overall color accuracy by 37% and skin-tone accuracy by 62%. The updated XMAGE True-to-Color Portrait engine introduces four versatile shooting modes: Portrait original, Soft light portrait, Dazzling fireworks, and Starburst, delivering striking, authentic portraits that speak directly to the heart.

The Pro Max features a powerful 18 EV ultra-HDR main camera, a large-sensor 200 MP RYYB telephoto camera, and CIPA 7.5-rated hardware image stabilization, guaranteeing crisp, steady shots even beyond 20x zoom. The lineup also introduces a dedicated live-streaming optimization mode, making it an ideal companion for content creators.

Additionally, the HUAWEI XMAGE Z10 Modular Camera features a 1-inch large sensor, 24–240 mm continuous optical zoom, and a maximum aperture of f/2.0 to f/4.5, providing pristine, studio-quality imagery across every focal length.

HarmonyOS AI: Smarter, Proactive, and Seamless

Powered by the 30B MoE full-modal on-device foundation model on the Pro Max and higher models, next-generation AI features come to life. Celia Memories seamlessly syncs and organizes content from over 50 mainstream apps, while the Celia navigation bar proactively suggests over 30 context-aware actions based on on-screen content. For everyday tasks, Celia Call 2.0 handles automated call answering, call summaries, and real-time translation, while the Celia Gallery Assistant enables intuitive voice- or text-driven photo editing and instant video generation. Furthermore, HarmonyOS Interconnect brings distance-free remote Huawei Share and allows one-tap sharing to multiple HarmonyOS devices simultaneously.

Committed to taking the harder but right path, Huawei provides users and developers with a powerful alternative in HarmonyOS. Today, HarmonyOS 6 and HarmonyOS 7 power over 90 million devices, including smartphones, PCs, and tablets, and are on track to pass the 100 million mark by the end of this year. At the same time, Huawei’s global registered developer community has grown to over 11 million.

ULTIMATE DESIGN: See the Extraordinary

The HUAWEI Mate 90 RS ULTIMATE DESIGN evolves the iconic Star Diamond camera module aesthetic and debuts Dynamic Lenticular Kunlun Glass, elevating high-durability materials into an expression of premium design. The rear cover showcases an all-new Ascending Texture available in Red, White, and Black. Under the hood, it packs the Kirin 9050 Pro chip, Full-color Linglong Display, Tiantong Satellite Communications, BeiDou Satellite Messaging, four-SIM three-standby, and the advanced True-to-Color Camera 3.0 with an 18 EV ultra-HDR main camera, delivering ultimate design, technology, imaging, and experience.

The series starts at CNY5,999 for the HUAWEI Mate 90, CNY6,999 for the HUAWEI Mate 90 Pro, CNY9,499 for the HUAWEI Mate 90 Pro Max, and CNY12,999 for the HUAWEI Mate 90 RS ULTIMATE DESIGN.

Hashtag: #Huawei

The issuer is solely responsible for the content of this announcement.