SpaceX plans to begin testing artificial intelligence data centres in orbit by late 2027, accelerating Elon Musk’s push to turn the company’s satellite and launch network into a new layer of global computing infrastructure. The programme would move part of the AI computing race beyond land-based data centres, where power shortages, grid constraints, cooling costs and local opposition have become major obstacles for technology companies. The first […]
Intel has used Computex 2026 to present a broader artificial intelligence strategy built around rack-scale systems, new Xeon data-centre processors and industry partnerships aimed at the fast-expanding market for inference and agentic AI workloads. The announcements in Taipei marked a deliberate shift in emphasis for the company, from selling individual chips to supplying integrated platforms that combine processors, accelerators, networking and software. Intel’s pitch rests on the […]
The agreements involve SK Telecom, SK Hynix, Naver, Doosan Group, LG Group, Hyundai Motor Group and continued discussions with Samsung Electronics, linking Nvidia’s graphics processors, AI factory architecture and robotics platforms with South Korea’s strengths in memory chips, telecoms, manufacturing, cloud services and industrial automation.
The deals were unveiled during Nvidia chief executive Jensen Huang’s Seoul visit, which has underlined how South Korea is moving from being a supplier of critical memory chips to a broader AI infrastructure hub. The push comes as governments and large companies seek sovereign computing capacity, tighter control over data, and dedicated facilities capable of training and running advanced AI models.
SK Telecom plans to build a gigawatt-scale AI cloud in South Korea using Nvidia’s DSX platform, with the first AI factory expected to come online in 2027. The infrastructure is designed to support enterprise AI, robotics, industrial automation and agentic AI services, using SK Telecom’s network, data centre and corporate technology base.
Naver, one of South Korea’s leading internet and cloud companies, is expanding its sovereign AI infrastructure with Nvidia, starting with 55 megawatts of capacity and a plan to move towards gigawatt scale. The collaboration is aimed at serving businesses, public-sector users and industries seeking locally controlled AI platforms.
SK Hynix, already a key supplier of high-bandwidth memory for Nvidia’s AI accelerators, has entered a multi-year technology partnership to develop next-generation memory for global AI data centres. The agreement strengthens the role of high-bandwidth memory as one of the most important bottlenecks in the AI hardware supply chain, with demand rising sharply as large models require faster data movement between processors and memory.
Samsung Electronics remains part of the wider conversation around next-generation foundry and memory cooperation. Its semiconductor leadership held talks with Nvidia on advanced chip manufacturing and future high-bandwidth memory, including technologies beyond the current HBM4 generation. Samsung is also involved in manufacturing AI accelerator chips for other customers, keeping it central to Nvidia’s broader supply chain calculations even as SK Hynix maintains a strong position in premium memory.
Doosan Group’s cooperation with Nvidia extends the agreements beyond data centres into physical AI. Doosan Robotics is working with Nvidia’s simulation, robotics and on-device AI platforms to develop an agentic robot operating system, while Doosan Enerbility is expected to support power infrastructure for AI factories. Doosan Corporation’s electronics materials unit is also positioned to support next-generation data centre hardware through advanced materials used in AI accelerators.
LG Group is working with Nvidia on an AI factory focused on physical AI, mobility and data centre technologies. The partnership is expected to support LG’s work in robotics, autonomous driving, smart manufacturing and GPU cloud services, giving the conglomerate a platform for applying AI across consumer electronics, industrial systems and vehicle technologies.
Hyundai Motor Group’s cooperation with Nvidia is centred on mobility, manufacturing and robotics, including support for Hyundai’s AI Valley project in Saemangeum. The group’s ownership of Boston Dynamics gives it a strong position in humanoid and industrial robotics, while Nvidia’s platforms can support simulation, model training and factory deployment.
South Korea’s national AI strategy gives the corporate agreements wider significance. The country had already announced plans to secure more than 260,000 Nvidia GPUs, with more than 50,000 intended for public AI infrastructure and the rest allocated to major companies including Samsung, SK Group, Hyundai Motor Group and Naver. The latest agreements suggest that those commitments are moving into more defined industrial projects.
The expansion also reflects a shift in Nvidia’s business model. The company is no longer selling chips only as components; it is promoting full-stack AI factories that combine processors, networking, software, reference architecture and operations. That approach gives Nvidia deeper influence over how data centres are designed and operated, while offering partners faster deployment at a time when AI capacity remains constrained.
South Korea’s Science and ICT Ministry is also seeking priority access to Nvidia’s Vera Rubin GPUs, amid expectations that next-generation chip supply could face delays. The effort shows how advanced AI processors have become strategic assets for countries competing in model development, cloud infrastructure and industrial automation.
The agreements carry risks as well as opportunity. AI factories require vast power supplies, expensive cooling systems and long-term commitments from corporate customers. Heavy dependence on one US chip supplier may also raise questions over supply security and bargaining power, even for a country with world-class semiconductor companies.
For Nvidia, the South Korean partnerships strengthen memory access, broaden its AI factory customer base and create new demand in robotics, cloud services and industrial AI. For South Korean companies, the deals offer a faster route into high-value AI infrastructure at a time when global competition is shifting from model development to the computing systems needed to run them at scale.
Under the MOU, the collaboration will focus on embodied AI research, robot manipulation, sim-to-real transfer, edge AI deployment, and validation of humanoid systems in real-world environments. Both companies will also explore opportunities to integrate The Skild Brain, Skild AI’s omnibodied AI software, into VinDynamics’ humanoid robots. The Skild Brain runs directly on robotic hardware and enhances the adaptability, efficiency, and reliability of humanoid systems in practical applications.
Additional areas under discussion may include knowledge exchange related to robot intelligence and real-world deployment, as well as potential cooperation in software, model, and hardware development, alongside the potential manufacturing of humanoid robots at scale.
The partnership brings together VinDynamics’ robotics engineering, manufacturing capabilities, and real-world deployment ecosystem with Skild AI’s foundation model technology. Together, the companies aim to accelerate the development and deployment of humanoid robots capable of operating in complex and dynamic environments, while supporting growing demand for intelligent robotic systems across industries including manufacturing, logistics, hospitality, and commercial services.
Prof. La Manh Hung, President, VinDynamics, said: “This partnership represents an important step for VinDynamics as we continue building scalable humanoid robotics platforms for real-world deployment. Skild AI brings the most exciting advances in embodied AI today. Combined with our robotics platform and manufacturing capabilities, we believe this partnership can accelerate the deployment of humanoid robots in complex environments.”
Mr. Deepak Pathak, Co-Founder and CEO of Skild AI, said: “The future of robotics depends on combining scalable physical systems with adaptable, general-purpose intelligence. VinDynamics brings strong engineering capabilities, manufacturing scale, and access to real-world deployment environments through the Vingroup ecosystem. We are excited to work together to advance embodied AI for practical applications.”
Established in September 2025, VinDynamics is a pioneering company in the field of humanoid robotics within Vingroup. The company is dedicated to developing versatile, human-centric robots capable of seamless integration into everyday life, with the scalability to support global deployment.
Hashtag: #VinDynamics
The issuer is solely responsible for the content of this announcement.
VinDynamics is a technology company under Vingroup, dedicated to the research, development, and manufacturing of advanced robotics and automation solutions, particularly in the field of humanoid robots. Leveraging cutting-edge technologies such as artificial intelligence, mechatronics, and motion control, VinDynamics aims to deliver intelligent, safe, and cost-effective robotic products that enhance productivity and improve quality of life.
Learn more at: 
https://vindynamics.net/en
Founded in 2023, Skild AI builds a general-purpose foundation model for robotics. Backed by SoftBank Group, NVIDIA Ventures, Jeff Bezos, Lightspeed, Coatue, Sequoia Capital, Felicis, and others, the company is valued at over $14 billion. Offices in Pittsburgh, the San Francisco Bay Area, and Bengaluru.
Learn more at: https://www.skild.ai/
Britain is preparing to use public procurement to support domestic artificial intelligence chipmakers, offering to buy semiconductor equipment from UK-based technology companies as ministers seek to stop promising hardware firms from shifting capital, talent and production plans overseas. Technology Secretary Liz Kendall is expected to outline the plan at London Tech Week, where the government will position strategic purchases as part of a broader effort to give […]
Since its official inclusion in NVIDIA’s approved and recommended vendor lists for server chassis and rack components in September 2025, Karrie has continually advanced its collaborations based on the NVIDIA MGX architecture and DGX-related platforms. During COMPUTEX this year, Karrie’s relevant server products and mechanical solutions have been featured prominently across the booths of major technology giants, showcasing its milestone achievements spanning from front-end R&D and collaborative design to back-end precision manufacturing. As highlighted by Karrie’s official statement during the exhibition: “We are proud to support NVIDIA MGX™ and be part of the ecosystem shaping the next generation of AI factories.”
Mechanical Technology Upgrade: Transitioning from Traditional Chassis to Full-Scale AI Mechanical Integration to Accelerate Hardware Deployment
As the industry undergoes this generational technological shift, mechanical engineering has become a critical part of system readiness. Behind every advanced AI computing platform is a robust, precise, and production-ready mechanical foundation—from rack-level structures and server chassis to key brackets, frames, and other precision assemblies that support system integration, serviceability, and large-scale deployment.
Leveraging decades of experience in server chassis, precision metal and plastic components, tooling development, automation, and high-volume manufacturing, Karrie consistently turns complex AI server and rack-level requirements into practical, production-ready, and deployment-flexible mechanical solutions. These capabilities support customers in accelerating their infrastructure rollouts based on the NVIDIA MGX architecture and the next-generation NVIDIA Vera Rubin platform.
Deeply Aligned with the Core Supply Chain: Early Engineering Involvement Empowers Tech Leaders Toward Volume Deployment
At COMPUTEX 2026, in addition to NVIDIA, multiple system integrators and ODM partners also showcased Karrie’s 1U, 2U, and 6U series AI chassis and rack-related products developed based on the MGX architecture. This extensive display fully demonstrates Karrie’s executive capability in delivering comprehensive engineering solutions and rapid prototyping, solidifying its position as a highly engaged mechanical engineering partner in the global AI supply chain.
Strategic Positioning for the Future of Intelligent Computing: Serving as a Trusted Mechanical Partner to Build the Physical Foundation for Accelerated Computing
As AI factories continue to scale worldwide, Karrie is committed to serving as a trusted mechanical engineering strategic partner for global technology leaders. The Group will continue to deepen its collaboration with world-class chipmakers, server brands, and cloud service providers to build the ultimate physical foundation for the accelerated computing ecosystem.
Karrie — A Leading Mechanical Partner for Global AI Computing Infrastructure.
Hashtag: #嘉利 #Karrie #COMPUTEX2026 #NVIDIA
http://www.karrie.com/
https://www.linkedin.com/company/karrie-industrial-co–ltd-/
https://www.youtube.com/@karrieinternational8734
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Bitget has added 15 tokenised stocks and exchange-traded funds as eligible margin assets for futures trading, extending the role of equity-linked digital assets from spot exposure into collateral management inside its unified trading system. The change took effect on June 4, UTC+8, and applies to the exchange’s Unified Trading Account and Multi-Asset Mode for USDT-M Futures. It allows users to deploy selected tokenised equities and ETFs as […]
Washington has moved to close a sensitive gap in its China technology controls after Trump administration officials concluded that overseas units of Chinese companies may have been able to buy Nvidia’s most advanced artificial intelligence chips without the export licences required for direct shipments to China. The Commerce Department’s Bureau of Industry and Security issued guidance on 31 May clarifying that licence requirements for advanced computing items […]
Arabian Post Staff -Dubai Computex 2026 has turned the personal computer market into a three-way contest over AI laptops, handheld gaming and mid-range graphics, with Nvidia, Intel and AMD using Taipei to push new silicon into segments long shaped by Apple’s Mac ecosystem and AMD-powered portable consoles. Nvidia’s RTX Spark platform drew the sharpest attention after the company positioned it as a Windows-based alternative for developers, creators […]
HONG KONG SAR – Media OutReach Newswire – 4 June 2026 – TrendAI™, the enterprise AI security leader from Trend Micro Incorporated (TYO: 4704; TSE: 4704), today announced its participation in Project Glasswing, an initiative focused on helping organizations identify and address vulnerabilities in critical software systems.
As part of the program, TrendAI™ will use Anthropic’s Claude Mythos Preview to support the review and analysis of software code, helping threat intelligence researchers turn accelerated vulnerability discovery into coordinated disclosure, prioritized remediation, and measurable risk reduction through vulnerability shielding and virtual patching.
AI is dramatically accelerating vulnerability discovery. TrendAI™ views this as a positive signal for the industry – it is part of the broader, collaborative ecosystem TrendAI™ has been actively contributing to for decades alongside organizations like Anthropic.
Rachel Jin, Chief Platform and Business Officer, Head of TrendAI™: “We’re aligned with Anthropic’s goals of using AI to make all software more secure. Organizations increasingly depend on software that operates at tremendous scale and supports critical business functions. Project Glasswing represents an important opportunity to explore how advanced AI can help software providers identify vulnerabilities earlier and improve the security and resilience of the systems customers depend on every day.”
TrendAI™ joins a growing community of organizations participating in Project Glasswing to better understand how frontier and advanced AI models can support defensive security efforts and improve the security of critical software infrastructure.
Insights gained through the program will contribute to informing the broader industry efforts to strengthen the security of the digital ecosystem.
Hashtag: #trendai #trendmicro #trendvisionone #visionone #trendaivisionone
https://www.trendaisecurity.comhttps://www.linkedin.com/company/trendai-security
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The issuer is solely responsible for the content of this announcement.
Anthropic is an AI safety and research company dedicated to building reliable, interpretable, and steerable AI systems. Its Claude family of models enables advanced capabilities across a wide range of applications, including code understanding and security analysis.
TrendAI™, the global AI security leader and enterprise business unit of Trend Micro, empowers organizations with full AI visibility and consolidated security that inspires confidence, drives innovation, and eliminates risk. Trusted by the largest enterprises and governments across 185 countries, TrendAI™ secures the entire organization, from identities to infrastructure to data. Global Fortune 500 companies rely on TrendAI™ to cut risk and stop threats up to three months earlier, powered by world-leading threat and attack intelligence. Through deep ecosystem partnerships with market leaders like NVIDIA, Anthropic, AWS, Google, and Microsoft, TrendAI™ empowers your organization to securely drive forward at the speed of AI. AI Fearlessly. Learn more at trendaisecurity.com.
Nvidia and Microsoft have introduced RTX Spark-powered Windows PCs designed to run personal AI agents locally, marking a major escalation in the race to make artificial intelligence a core feature of everyday computing rather than a cloud-based add-on. The systems, unveiled around Computex and Nvidia GTC Taipei, are expected to arrive this autumn from major PC makers including Asus, Dell, HP, Lenovo, Microsoft Surface and MSI, with […]
BrainCo expects a sharp rise in sales of its robotic hands this year as China’s humanoid robotics industry pushes beyond laboratory demonstrations into factory trials, logistics pilots and commercial component sourcing. The Hangzhou-based prosthetics and neurotechnology developer, founded in 2015, is seeing demand broaden from medical bionic hands to dexterous hands designed for humanoid robots. Its latest Revo hand models place the company in a fast-growing supply […]
Positron AI has opened its first office outside the United States at Dubai International Financial Centre, placing the AI infrastructure developer inside one of the region’s fastest-growing technology and financial ecosystems. The move gives the US-based company a licensed presence in DIFC as it seeks to expand demand for AI inference systems across the Middle East, Africa and South Asia. Positron AI has raised more than $300 […]
Nvidia is moving into the Windows laptop processor market with a new chip designed to challenge Intel and AMD at the centre of personal computing, extending its reach beyond graphics processors and data-centre AI accelerators into one of the industry’s most contested hardware segments. The move marks a direct attempt to reshape the premium PC market around artificial intelligence, battery efficiency and on-device processing. Nvidia’s planned Windows […]
The memorandum of understanding, signed by the Government of Odisha, Intel and 3DGS, covers an advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region. The project is expected to focus on substrates used in next-generation chip packaging, a part of the semiconductor supply chain that has gained strategic importance as artificial intelligence, high-performance computing and advanced data-centre processors demand larger, faster and more power-efficient packages.
The agreement places Odisha in a stronger position within India’s semiconductor map, which has so far been led by assembly, testing, marking and packaging projects, outsourced semiconductor assembly facilities, compound semiconductor proposals and early-stage fabrication investments. The planned plant would add a specialised layer to that ecosystem by targeting glass-core substrates and high-density interconnect technologies, areas that are increasingly viewed as critical for advanced packaging.
Intel’s role is expected to centre on technology know-how, process expertise and ecosystem support, while 3DGS brings specialisation in glass-based integration platforms. 3DGS, a US-based company, has developed glass-centric technologies for radio-frequency, photonics and semiconductor packaging applications. Its involvement gives the Odisha plan a sharper focus than conventional electronics manufacturing projects, as glass-core substrates remain an emerging technology rather than a mature commodity segment.
Glass substrates are attracting industry attention because conventional organic substrates face physical limits as chip packages become larger and denser. Advanced processors now often combine multiple chiplets, memory stacks and interconnect layers in one package. That increases pressure on the base material to carry more power and data connections while reducing warpage, signal loss and thermal stress. Glass offers better dimensional stability, finer interconnect potential and the ability to support larger package sizes, though yield, tooling and commercial-scale production remain challenges.
Intel has publicly positioned glass substrates as a key packaging technology for the second half of this decade. The company has argued that glass could help extend system-level performance gains beyond the limits of transistor scaling, particularly for artificial intelligence accelerators and high-performance computing chips. For India, participation in this segment could move the country beyond back-end assembly into a more advanced part of the global chip supply chain.
The Odisha project is also politically significant. The signing was witnessed by Union electronics and information technology minister Ashwini Vaishnaw and Odisha chief minister Mohan Charan Majhi, alongside senior executives from Intel and 3DGS. The state has been pushing to attract electronics, data centre and semiconductor-linked investments as part of a broader industrial strategy aimed at diversifying beyond metals, mining and ports.
The proposed facility is expected to be developed over several years, with industry estimates placing the build-out period at five to six years. Employment projections point to high-skilled roles across engineering, materials science, process control, quality systems and equipment maintenance, while indirect jobs could emerge through chemicals, gases, logistics, clean-room services and precision component suppliers.
The investment comes as India seeks to reduce dependence on overseas semiconductor supply chains after pandemic-era shortages exposed vulnerabilities in electronics, automotive and defence manufacturing. The Union government’s semiconductor programme has already backed projects by Tata Electronics, Micron Technology, CG Power and Kaynes, while several states are competing to attract design, packaging and manufacturing facilities. Gujarat and Assam have emerged as early beneficiaries, while Odisha’s Intel-3DGS agreement signals a broader geographic spread of the chip ecosystem.
For Intel, the deal fits into a wider effort to strengthen its foundry and advanced packaging credentials at a time when the global chip industry is being reshaped by artificial intelligence demand. The company has been investing in packaging platforms such as EMIB and Foveros, while also promoting glass substrates as a future enabling technology. Its broader turnaround remains under scrutiny because of competitive pressure from Nvidia, AMD, TSMC and Samsung, but advanced packaging offers a route to relevance in custom accelerators and multi-die systems.
The project will still have to pass execution tests before it becomes a production anchor. Semiconductor substrate manufacturing requires tight process control, specialised equipment, stable utilities, skilled technical labour and reliable supply of materials. Glass-core technology also needs commercial validation at scale, as the industry has not yet shifted from established organic substrate supply chains in volume applications.
Samsung Electronics has begun shipping samples of its HBM4E memory chips to global customers, moving faster than rivals in the race to supply the next generation of high-bandwidth memory for artificial intelligence servers. The 12-layer HBM4E product delivers bandwidth of up to 3.6 terabytes per second per stack, with stable pin speeds of 14 gigabits per second and scalability to 16 gigabits per second. The chip is […]
The California-based server maker said the equipment had first been sold through an authorised reseller before being deceptively acquired and targeted for illicit diversion. Its statement framed the case as a successful intervention rather than a failure of internal controls, stressing that it had worked with Taiwan authorities to stop the movement of high-value systems used in artificial intelligence data centres.
The case has drawn attention because Supermicro sits at the centre of the AI infrastructure boom, supplying servers that integrate advanced graphics processors and networking components used to train and run large AI models. Such systems have become strategically sensitive as Washington, Taipei and allied governments tighten oversight of technology flows to mainland China, Hong Kong and Macau.
Taiwan prosecutors have been investigating suspects accused of falsifying export documents for high-end AI servers containing Nvidia chips. The servers were allegedly routed through Japan as part of an attempt to move restricted technology onwards to China-linked buyers. The seizure of 50 systems, though small compared with global AI server demand, is significant because it shows authorities are now pursuing hardware diversions beyond the better-known routes through Southeast Asia.
Supermicro’s response is also shaped by a separate and larger US criminal case that has placed the company under scrutiny. In March, US prosecutors charged three people linked to Super Micro Computer, including co-founder Yih-Shyan “Wally” Liaw, in an alleged conspiracy to divert about $2.5bn worth of AI server technology to China in violation of export controls. Liaw and another defendant were arrested, while a third defendant was listed as a fugitive. Super Micro Computer itself was not named as a defendant.
That case alleged a sophisticated scheme involving shell companies, false shipping documents, repackaging and dummy servers designed to mislead compliance checks. Prosecutors said controlled AI server technology was moved from the United States to Taiwan before being redirected through intermediary locations to reach Chinese customers. The allegations intensified questions over how manufacturers, distributors and resellers monitor the final destination of advanced hardware once it leaves controlled channels.
Supermicro has denied institutional wrongdoing and has said the conduct alleged in the US case violated company policies. The latest Taiwan-linked statement attempts to reinforce that message by presenting the firm as a partner to investigators. It thanked law-enforcement and legal officials, while saying industry and government must work together to strengthen safeguards and improve supply-chain visibility.
The timing matters for investors. Supermicro has been one of the most closely watched hardware suppliers during the AI build-out, benefiting from surging demand for rack-scale servers used by cloud providers, enterprises and sovereign AI projects. That growth has made export-control compliance a material business risk. A single enforcement case can raise concerns about sales screening, reseller audits, customer identification and shipment tracking, even when the company is not accused of direct wrongdoing.
Nvidia’s position adds another layer to the issue. Its most advanced AI processors remain central to global data-centre expansion, and restrictions on sales to China have forced chipmakers and server companies to navigate a shifting regulatory environment. Nvidia has repeatedly said it follows export rules and does not support unlawfully exported products. Its chief executive, Jensen Huang, has also underlined that server vendors must maintain their own compliance standards when handling systems containing restricted chips.
The Taiwan action highlights a broader enforcement shift. Authorities are no longer focused only on chip shipments; fully assembled AI servers are now a priority because they can be more difficult to trace after integration. Servers may contain restricted processors, specialised networking, memory and cooling systems that together create the computing power needed for frontier AI workloads. Once such systems are broken into multiple shipments or passed through resellers, detecting diversion becomes more complex.
OpenRouter has raised $113 million in Series B funding, marking one of the strongest investor endorsements yet for the fast-growing layer of artificial intelligence infrastructure that helps developers and companies route work across competing AI models rather than rely on a single provider. CapitalG, Alphabet’s independent growth fund, led the round, with participation from NVentures, the venture capital arm of NVIDIA, as well as ServiceNow Ventures, MongoDB […]
Arabian Post Staff -Dubai MarsLab Pte Ltd has introduced a Singapore-based roadmap for AI inference infrastructure, positioning the company around enterprise and edge deployment at a time when organisations are shifting from model experimentation to production-scale artificial intelligence systems. The roadmap, announced on 28 May, centres on what MarsLab describes as a system-first approach to inference, the stage at which trained AI models generate outputs in live […]
ByteDance is weighing capital expenditure of as much as $70 billion this year as the TikTok owner accelerates an artificial intelligence push aimed at strengthening its position in China’s intensifying technology contest. The Beijing-based group is discussing one of the largest spending programmes by a private technology company outside the United States, with funds expected to go into data centres, AI chips, networking equipment and model development. […]
The summit signaled a clear “cross‑border restructuring.” With computing power collaboration entering a new phase, AI competition is expanding from single‑model parameters to industrial scenarios like math, life sciences, financial risk control, and complex macro decisions. Chow Kit Hui argues that extensive competition based on capital and model scale is shifting to refined competition—the future AI ecosystem hinges on integrating technology, data, and scenarios.
At the summit, Chow Kit Hui and NVIDIA launched a new strategic collaboration on algorithm optimization, AI training architecture, vertical data assets, and decision‑model integration, aiming to boost computing efficiency and drive deployment of industry‑level AI agents and autonomous reasoning in complex scenarios.
Chow Kit Hui unveiled his strategically positioned AI fund, AlgoVision AI Growth Partners Foundation. Driven by computing power, capital, and application scenarios, it backs upstream tech breakthroughs and high-value downstream applications, bridging AI research with industrial use. From academic discourse to computing coordination, the summit revealed a new competitive landscape: core advantage now lies in integrating technology, data, scenarios, capital, and resources—not the capability of a single model. With data-driven rationality and risk control, Chow injected lasting long-termism into global AI deployment.
Hashtag: #KitHuiGrowthFinancialAcademy
The issuer is solely responsible for the content of this announcement.
Kit Hui Growth Financial Academy was founded by Chow Kit Hui. Chow Kit Hui has long focused on global asset allocation, corporate mergers and acquisitions, private equity, derivatives, risk management, macroeconomic research, and financial valuation modeling. The academy does not center on short-term market predictions or teaching investment “tricks.” Instead, it helps learners establish a rational, long-term, and structured path to financial understanding. The academy emphasizes structured comprehension of market mechanisms, risk-prioritized decision-making, and independent judgment.
Official website: https://www.kithuiacademy.com/
Qualcomm has secured a major opening in artificial intelligence infrastructure through a deal to supply ByteDance with chips for AI data centres, giving the San Diego-based group a high-profile customer as it pushes beyond its traditional smartphone processor business. The agreement covers application-specific integrated circuits, or ASICs, designed to support AI workloads in ByteDance’s expanding data-centre operations. The chips are expected to be used for AI agent […]
Global enterprise AI expenditure is expected to reach about $940 billion in 2026 and climb to roughly $2.1 trillion by 2029, reflecting a shift from experimental deployments to large-scale use across manufacturing, finance, logistics, health care, energy and public services. China is emerging as one of the fastest-expanding markets within that cycle, helped by heavy infrastructure spending, state-backed industrial policy and a corporate race to build domestic alternatives to foreign chips, models and cloud platforms.
The acceleration is no longer confined to model development. China’s AI buildout is moving across the full technology stack, from data centres and accelerators to enterprise software, robotics and agentic systems capable of handling complex workflow tasks. The first phase of the investment wave was dominated by computing power, foundational models and large infrastructure projects. The next phase is being shaped by applied AI, intelligent services and automation across production lines, offices and consumer platforms.
That transition is putting pressure on global rivals. US technology groups still lead in advanced chips, frontier models and hyperscale cloud capacity, but China’s market has advantages in deployment speed, manufacturing depth and policy coordination. Companies including Alibaba, Tencent, Baidu, Huawei and ByteDance are expanding AI services while also trying to reduce dependence on restricted US semiconductor supplies. Alibaba has unveiled a new AI chip through its T-Head unit and is directing tens of billions of dollars into cloud and AI infrastructure over several years. Huawei’s Ascend processors have become central to China’s domestic accelerator strategy as export controls limit access to top-tier Nvidia products.
Infrastructure remains the foundation of the race. Worldwide AI infrastructure spending is on course to exceed $1 trillion by 2029, with accelerated servers accounting for the overwhelming share. China remains the second-largest AI infrastructure market after the US, even though export restrictions have created supply constraints for high-end accelerators. Those restrictions have encouraged domestic chip design, local server ecosystems and more efficient deployment models for inference, where many commercial AI applications run after models have been trained.
China’s data centre expansion is also moving into more specialised formats. AI workloads demand dense computing power, stable electricity supply and advanced cooling, all of which are raising costs and straining grids. Projects near Shanghai and other technology hubs are testing alternative energy and cooling systems, including offshore and renewable-powered facilities. These efforts reflect a broader attempt to manage the energy burden of AI while supporting national ambitions in cloud services, industrial software and smart manufacturing.
Robotics is becoming a central pillar of the spending wave. China already has the world’s largest industrial robot base and is pushing into embodied intelligence, where AI systems are integrated into machines that operate in factories, warehouses, homes and public spaces. Forecasts for China’s robotics market point to rapid expansion over the next five years, with demand coming from electric vehicles, electronics, logistics and elder care. The combination of AI models, sensors, batteries and manufacturing scale gives domestic firms a route to compete internationally beyond software alone.
Policy support is reinforcing corporate investment. Beijing’s “AI Plus” strategy, issued in 2025, aims to embed artificial intelligence across the economy by expanding access to data, compute and talent while promoting open-source ecosystems and industrial adoption. Local governments have added funding programmes, innovation parks and procurement support, creating competition among cities such as Beijing, Shanghai, Shenzhen and Hangzhou. That model can accelerate deployment, though it also raises the risk of duplicated capacity, uneven standards and projects driven more by subsidy incentives than commercial demand.
The competitive picture remains mixed. China leads in AI publication volume, citations, patent output and industrial robot installations, while the US continues to produce more frontier models and higher-impact patents. The performance gap between leading US and Chinese models has narrowed, aided by open-source releases and engineering efficiency from Chinese labs. DeepSeek’s breakthrough earlier in the cycle demonstrated that capable systems could be produced with fewer resources than previously assumed, intensifying debate over whether raw spending alone will determine leadership.
Huang is expected to meet Taiwan Semiconductor Manufacturing Company chairman and chief executive C. C. Wei as Nvidia prepares a second-half production ramp for Vera Rubin, the next-generation platform that combines new Vera CPUs, Rubin GPUs, advanced memory and high-speed networking for rack-scale AI systems. The visit has drawn close attention because Nvidia’s product cycle is now tied more tightly than ever to Taiwan’s foundries, packaging houses, server assemblers and component suppliers.
Nvidia reported revenue of $81.6bn for the quarter ended April 26, up 85 per cent from a year earlier, with data-centre revenue reaching $75.2bn, up 92 per cent. The company also authorised an additional $80bn in share repurchases and raised its quarterly dividend to 25 cents a share from 1 cent, underscoring the scale of cash generation from the AI infrastructure boom.
Demand is being driven by cloud providers, AI model developers, enterprise customers and sovereign AI projects, all seeking clusters capable of training and running larger generative and agentic AI systems. Nvidia has described the buildout of “AI factories” as one of the largest infrastructure expansions in technology history, with its platform spanning chips, networking, systems software and reference designs for data centres.
Vera Rubin is expected to follow the Blackwell and Grace Blackwell generation, which is still being shipped in high volumes. That overlap is creating pressure across Taiwan’s supply chain because new capacity must support existing commitments while preparing for a platform with different requirements in advanced packaging, high-bandwidth memory integration, board assembly, cooling and system validation.
Huang has described Vera Rubin as potentially the biggest product ramp in Nvidia’s history and one of the largest technology manufacturing efforts Taiwan has handled. Industry estimates around the platform point to millions of parts across each system and the involvement of well over 100 Taiwan-based ecosystem partners, from chip fabrication and advanced packaging to printed circuit boards, power systems, connectors, thermal modules and final server integration.
TSMC remains central to the effort because Nvidia depends on its leading-edge process technology and advanced packaging capacity. The challenge is not limited to wafers. CoWoS and other packaging technologies have become strategic bottlenecks as AI accelerators require multiple logic dies, high-bandwidth memory stacks and dense interconnects. Any delay in packaging expansion can ripple through server production schedules, cloud deployment plans and Nvidia’s revenue timing.
Taiwan’s broader technology sector has become a critical artery for the global AI trade. TSMC, Foxconn, Quanta, Wistron, Wiwynn, Inventec and a dense network of specialist suppliers are competing to add capacity while dealing with constraints in land, power, water, skilled labour and equipment availability. The concentration gives Nvidia speed and engineering depth, but also exposes the company to geopolitical and operational risks.
China remains the clearest commercial setback. Huang has said US export controls have pushed Nvidia’s share of China’s advanced AI chip market to zero, a striking reversal for a company that once held a dominant position there. The restrictions have strengthened the opening for Huawei and other domestic suppliers, while leaving Nvidia dependent on whether Washington and Beijing allow compliant chips to be sold without triggering national-security objections.
That loss has not slowed Nvidia’s global momentum, but it has changed the composition of growth. Revenue is now increasingly concentrated in markets where hyperscale cloud companies, enterprise AI developers and governments are building large AI data centres outside China. For investors, the question is whether demand can keep absorbing each successive architecture at the scale implied by Nvidia’s guidance.
Nvidia forecast revenue of about $91bn for the current quarter, above market expectations, signalling that orders for AI infrastructure remain strong despite concerns about overcapacity, power shortages and the pace at which customers can monetise AI services. Operating expenses rose 49 per cent to $7.75bn, reflecting the growing cost of research, supply commitments and ecosystem investments needed to sustain the company’s lead.
