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SEMICON Southeast Asia 2026 opened in Kuala Lumpur on Tuesday, putting Malaysia at the centre of a regional push to capture a larger share of the global semiconductor value chain as chipmakers rethink production networks, sourcing risks and capacity plans.

The three-day industry gathering at the Malaysia International Trade and Exhibition Centre runs from 5 to 7 May and is expected to draw more than 20,000 policymakers, manufacturers, suppliers, investors, researchers and technology specialists. Held under the theme “Transform Tomorrow”, the event is being staged in strategic partnership with Malaysia’s Ministry of Investment, Trade and Industry and the Malaysian Investment Development Authority.

The launch ceremony was officiated by Datuk Seri Johari Abdul Ghani, Malaysia’s Minister of Investment, Trade and Industry, with senior SEMI executives, MIDA leadership and global semiconductor company representatives in attendance. The programme places manufacturing scale-up, advanced packaging, intelligent manufacturing, sustainability and workforce development at the centre of discussions, reflecting the industry’s shift from pure capacity expansion to more resilient and geographically diversified ecosystems.

Malaysia enters the event with a strong base in electrical and electronics manufacturing, particularly assembly, testing and packaging. The country has long been a critical node for chip back-end operations, with Penang and Kulim playing key roles in outsourced semiconductor assembly and test activity. The policy focus is now moving further up the value chain into chip design, advanced packaging, automation, materials, equipment support and higher-value manufacturing services.

Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, chief executive officer of MIDA, said Malaysia was no longer positioning itself as a passive beneficiary of industry shifts. “The semiconductor industry is at an inflection point, and Malaysia intends to be at the centre of what comes next,” he said, pointing to the MADANI Economy Framework and the New Industrial Master Plan 2030 as policy anchors for a broader industrial upgrade.

The E&E sector secured RM28.5 billion in approved investments in 2025, underlining continued investor interest despite a more fragmented global trade environment. Malaysia’s broader semiconductor strategy is focused on supply-chain integration, stronger domestic enterprise capability and talent development, as the country seeks to build a deeper industrial base around its existing production strengths.

Ajit Manocha, president and chief executive officer of SEMI, said closer coordination across design, manufacturing, materials and supply chains had become essential as artificial intelligence, high-performance computing and advanced electronics reshape demand. He said SEMICON Southeast Asia was designed not only as a technology showcase but as a platform for partnerships that can support long-term industry growth and resilience.

The timing of the Kuala Lumpur event is significant. Global semiconductor sales are on course to approach $1 trillion in 2026, driven largely by demand for AI accelerators, memory, advanced logic, data-centre infrastructure, automotive electronics and edge devices. Monthly industry sales crossed $99 billion in March 2026, while first-quarter sales were sharply higher than the previous quarter, showing the scale of the current upcycle.

Capital expenditure is also accelerating. Spending on 300mm fab equipment is projected to rise to about $133 billion in 2026 and $151 billion in 2027, as chipmakers expand capacity for advanced logic and memory while governments push for more localised semiconductor supply chains. Yet Southeast Asia remains under-represented in new front-end fabrication plans compared with China, Taiwan, South Korea, Japan and the United States, leaving room for Malaysia, Singapore, Vietnam, Thailand and the Philippines to compete more aggressively for future investment.

SEMICON Southeast Asia 2026 features the Executive Leadership Summit, the MIDA Strategic Semiconductor Forum and Seminar, the Sustainability and Energy Summit, TechZoomers Challenge and TalentCONNECT. These sessions are designed to connect policy, capital, manufacturing capability and workforce planning, rather than treating the exhibition as a conventional trade fair.

The emphasis on talent is especially important. Semiconductor expansion is being constrained not only by investment cycles and export controls but also by shortages of engineers, technicians, automation specialists and materials experts. Malaysia’s challenge is to match global investor confidence with a skilled workforce capable of supporting advanced packaging, precision manufacturing and design-linked activity.

Botswana’s beef industry is under mounting pressure as foot-and-mouth disease disrupts exports, closes key slaughter facilities and threatens rural incomes in a country where cattle remain central to household wealth, food security and national trade. Acting Minister of Lands and Agriculture Dr Edwin Dikoloti has warned that the outbreak is placing significant strain on the economy and livelihoods, with the most immediate commercial blow coming from lost […]

Bengaluru-based Pixxel and Sarvam have set out plans to build Pathfinder, a 200 kg-class orbital data centre satellite that would test whether artificial intelligence workloads can be processed directly in space rather than routed first through terrestrial cloud systems.

The mission, announced on 4 May 2026, is scheduled to reach orbit as early as the fourth quarter of 2026. Pixxel will design, build, launch and operate the satellite, while Sarvam will provide the artificial intelligence stack needed for training and inference on board. The partners describe the project as India’s first orbital data centre satellite, placing it at the junction of three strategic races: sovereign AI, commercial space infrastructure and the search for lower-latency computing systems.

Pathfinder is intended to carry data centre-grade graphics processing units alongside Pixxel’s hyperspectral imaging camera. That combination would allow the satellite to capture high-fidelity Earth observation data and analyse it in orbit using foundation models, instead of sending large volumes of raw imagery to ground stations for processing. The aim is to transmit insights rather than just data, cutting the time between observation and decision-making.

The approach could be valuable for environmental monitoring, agriculture, mining, resource management, disaster response and critical infrastructure tracking. Hyperspectral imaging can detect patterns invisible to conventional cameras by reading hundreds of spectral bands, making it useful for identifying crop stress, pollution, mineral signatures, water conditions and changes in land use. Adding on-board AI would make such systems faster and potentially more autonomous.

Pathfinder also reflects the pressure building around AI infrastructure. Data centres have become increasingly constrained by energy demand, land availability, cooling requirements and regulation. AI-focused facilities are especially power-intensive because training and running large models depend on specialised chips. Industry forecasts point to data centre electricity use crossing 1,000 terawatt hours by 2030, with AI workloads accounting for a growing share of consumption.

Orbital computing is being explored as one answer to that problem, though it remains technically difficult and commercially unproven at scale. Satellites can draw continuous solar power in certain orbits and process space-generated data close to its source. Yet the model must overcome radiation exposure, heat dissipation, launch costs, repair limitations, chip reliability, bandwidth management and the challenge of operating high-performance hardware in an environment far harsher than a ground-based server hall.

For Pixxel, the project marks a move beyond Earth observation into space infrastructure. The company has built its position around hyperspectral satellites and already operates Firefly satellites capable of capturing detailed environmental data. Pathfinder would test whether those sensing systems can be paired with in-orbit computing to create a more responsive intelligence layer.

For Sarvam, the mission extends its sovereign AI pitch beyond ground infrastructure. The company has focused on building language models and platforms designed for deployment in local contexts, including multilingual use cases. Running its models aboard an India-built satellite would give the company a high-profile demonstration of how AI sovereignty can include hardware location, data control and infrastructure independence, not just model development.

The announcement comes as global technology groups examine space-based compute. Google’s Project Suncatcher has explored satellite constellations fitted with AI accelerators and optical links, with prototype missions planned with Planet. Elon Musk has also spoken publicly about the possibility of data centres in orbit within the wider SpaceX and Starlink ecosystem. These ideas remain at an early stage, but they show that AI infrastructure is beginning to stretch beyond conventional cloud regions.

Domestic activity is also widening. Agnikul Cosmos and NeevCloud have explored related orbital infrastructure concepts, indicating that private space and compute companies see a possible market in distributed cloud systems that span Earth and orbit. Defence, climate intelligence, telecommunications and sovereign data processing are likely to be among the first areas of interest if the technology matures.

Pathfinder’s immediate importance lies less in replacing terrestrial data centres and more in validating whether orbit can host meaningful AI workloads. The satellite is expected to test power management, thermal control, real-time inference, data processing and model performance under operational space conditions. Success would give Pixxel and Sarvam a foundation for more advanced orbital compute systems, while failure would expose the engineering and economic limits of the concept.

The project also fits a broader shift in satellite design. Spacecraft have traditionally acted mainly as sensors and transmitters, collecting data for later analysis on Earth. Pathfinder points towards satellites that can interpret what they observe, prioritise what should be sent down and support faster decisions for governments and commercial users.

Commercial adoption will depend on cost, reliability and demand. Ground-based cloud systems remain cheaper, easier to maintain and vastly more scalable. Orbital compute will need to prove that its advantages — lower latency for space data, resilience, solar access and sovereignty — justify the complexity of placing advanced AI hardware in space.

For now, Pathfinder gives the space and AI sectors a test case with wider implications. It places Pixxel and Sarvam among early movers trying to turn satellites from data collectors into active computing nodes, while testing whether the limits facing AI infrastructure on Earth can be partly addressed above it.

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India is preparing a new electronic venue for bond-forward trades, seeking to bring greater transparency to a fast-growing derivatives segment that still relies heavily on negotiated over-the-counter deals.

The proposed platform is being developed around the Clearing Corporation of India’s market infrastructure and is expected to be placed before the Reserve Bank of India for regulatory approval. Market participants have been working with the clearing corporation on design features, including trade execution, clearing, margining and reporting, with a rollout being discussed for the current financial quarter if approvals and operational testing proceed on schedule.

Bond forwards allow investors to buy or sell government securities at a pre-agreed price for settlement at a future date. The instrument is designed to help banks, insurers, primary dealers, overseas investors and other large holders manage interest-rate risk without requiring an immediate exchange of securities. Its wider use has become more important as India’s sovereign debt market draws larger cross-border flows after entry into major global bond indices.

The initiative follows the Reserve Bank of India’s February 2025 framework permitting forward contracts in government securities. The rules allow residents and eligible non-residents to undertake bond-forward transactions, while scheduled commercial banks and standalone primary dealers are permitted to act as market-makers. At least one party to a transaction must be a market-maker or a central counterparty authorised by the central bank.

Market officials see the platform as a step towards shifting a largely bilateral market into a more standardised structure. The present system is dominated by negotiated trades, with pricing often shaped by dealer relationships and limited visibility beyond counterparties. A screen-based mechanism could help create firmer reference prices, reduce information gaps and support more consistent valuation of related interest-rate products.

The bond-forward market is estimated at about ₹4 trillion to ₹4.5 trillion, with foreign banks accounting for the bulk of activity. That concentration has helped establish liquidity in parts of the curve but has also limited wider participation by domestic lenders, insurers and other institutional investors. A platform backed by central clearing could lower operational uncertainty for new entrants and improve confidence in settlement arrangements.

Clearing will be central to the reform. A centrally cleared structure would place the clearing corporation between counterparties, reducing bilateral credit exposure and applying margining standards across participants. The Reserve Bank’s directions already require non-centrally cleared bond-forward transactions to comply with margin rules for over-the-counter derivatives, while market-makers must use robust methods to mark positions to market.

The move also fits a wider regulatory push to improve surveillance of over-the-counter derivatives. Reporting of forward contracts in government securities to CCIL’s trade repository began on May 2, 2025, giving regulators access to transaction data through the life of a contract. A separate framework will require unique transaction identifiers for eligible over-the-counter derivative trades from January 1, 2027, improving traceability across counterparties and systems.

Foreign investor access is another factor behind the timing. Electronic trading providers have been building links to India’s government securities market as global investors increase allocations. MarketAxess executed its first platform trade in India government bonds between BlackRock and Standard Chartered Bank in 2025, using an integration with CCIL’s NDS-Order Matching system. Overseas investors bought nearly ₹1 trillion of government bonds over 13 months after inclusion in JPMorgan’s emerging market debt index, while other index inclusions have kept the market on global fixed-income desks’ radar.

The proposed bond-forward platform will still face practical tests. Dealers will need clarity on eligible securities, collateral treatment, settlement failure procedures, reporting formats, position limits and margin models. Participants will also need to align front-office systems, treasury risk controls and back-office processes before meaningful volumes migrate from bilateral trades to a shared electronic venue.

For insurers and long-duration investors, the instrument could become a more precise hedging tool across rate cycles. For banks, it could deepen market-making opportunities while making price discovery more transparent. For regulators, the key benefit lies in cleaner data, stronger risk monitoring and a structure that may reduce opacity in a derivatives market linked directly to sovereign bond pricing.

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The official ceremony underscores Southeast Asia’s growing role in the global semiconductor value chain through collaboration, innovation and ecosystem-wide partnerships

KUALA LUMPUR, MALAYSIA – Media OutReach Newswire – 5 May 2026 – SEMICON Southeast Asia (SEMICON SEA) 2026 was officially launched today at the Malaysia International Trade and Exhibition Centre (MITEC), bringing together policymakers, manufacturers, suppliers, researchers, investors and emerging talent from across the global semiconductor ecosystem for three days of industry dialogue, technology showcases and business engagement.

The opening ceremony was officiated by YB Datuk Seri Johari Abdul Ghani, Minister of Investment, Trade and Industry (MITI), and attended by SEMI leadership, the Malaysian Investment Development Authority (MIDA) led by the Chief Executive Officer Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, and senior executives from global semiconductor companies.

Held under the theme ‘Transform Tomorrow’ in strategic partnership with MITI and MIDA, SEMICON Southeast Asia 2026 is expected to welcome more than 20,000 innovators, policymakers and technology experts. The three-day event focuses on key industry priorities including manufacturing scale-up, advanced packaging, intelligent manufacturing and workforce development, as companies respond to demand driven by artificial intelligence, high-performance computing and advanced electronics.

Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, Chief Executive Officer of MIDA, said Malaysia is approaching the next phase of semiconductor growth as an active builder rather than a beneficiary of global trends.

“The semiconductor industry is at an inflection point, and Malaysia intends to be at the centre of what comes next. Under the MADANI Economy Framework and the New Industrial Master Plan 2030, we are not simply maintaining our position in the global semiconductor supply chain, we are deliberately reshaping it. The NIMP 2030 sets a clear direction for the E&E sector to move beyond assembly and test into design, advanced packaging and innovation-driven manufacturing, and MIDA is here to make that transition real. The RM28.5 billion secured by the E&E sector in 2025 is proof that global confidence in Malaysia has not wavered. What we are now building is the ecosystem to match that confidence, through supply chain integration, local capability development and the kind of high-value partnerships that platforms like SEMICON Southeast Asia are uniquely placed to catalyse,” said Datuk Sikh Shamsul Ibrahim.

“SEMI’s role has always been to bring together the global semiconductor ecosystem, and that responsibility becomes even more important as the industry grows in scale and complexity. Today, innovation is no longer confined to a single segment. It requires closer alignment across design, manufacturing, materials and supply chains. SEMICON Southeast Asia provides a platform to bridge these different parts of the ecosystem, enabling stakeholders to engage in more meaningful collaboration and move from discussion to execution,” said Ajit Manocha, President and CEO of SEMI.

“As demand continues to be driven by artificial intelligence, high-performance computing and advanced electronics, the ability to coordinate across regions and capabilities will be critical. SEMICON Southeast Asia 2026 is not only about showcasing technology, but about strengthening the partnerships needed to support long-term industry growth and resilience.”

The event features key leadership programmes including the Executive Leadership Summit, MIDA Strategic Semiconductor Forum and Seminar, Sustainability and Energy Summit, TechZoomers Challenge and TalentCONNECT, reflecting SEMICON Southeast Asia’s role not only as an exhibition platform, but as a convening point for leadership, capability and execution across the region’s semiconductor ecosystem.

Marking over a decade of strategic collaboration, MIDA and SEMI today reinforce 12 years of a transformative partnership dedicated to elevating Malaysia’s standing in the global semiconductor value chain. This enduring alliance remains anchored on three core pillars designed to future-proof the nation’s industrial landscape:

  • Ecosystem Integration: Harmonising domestic and international supply chains to ensure seamless operational synergy.
  • Enterprise Capability: Empowering local businesses to scale their technical expertise and compete on a global stage.
  • Talent Advancement: Cultivating a high-skilled workforce as the essential bedrock of Malaysia’s long-term economic resilience and competitive edge.

SEMICON Southeast Asia 2026 runs from 5–7 May 2026 at MITEC, Kuala Lumpur, with participation from companies and organisations across Asia, the United States and Europe.

The issuer is solely responsible for the content of this announcement.

About MIDA

MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 20 overseas offices. MIDA partners with investors at every stage of their journey, supporting sustainable growth and long-term value creation for Malaysia. For more information, please visit and follow MIDA on X, Instagram, Facebook, LinkedIn, TikTok and YouTube.

About SEMI

SEMI® is the global industry association connecting over 4,000-member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit , contact a regional office, and connect with SEMI on and to learn more.

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MUMBAI, INDIA – Media OutReach Newswire – 5 May 2026 – ECOVACS Robotics, a global leader in home service robotics, is raising comfort this season with its Summer Holiday Campaign, bringing smarter, faster, and hands-free cleaning to Indian homes. Convenient, effortless and designed for modern city hustlers, their all-in-one solutions empower consumers to come home to spotless spaces without lifting a finger.

ECOVACS is rolling out limited-time, high-impact deals on Amazon India from 8th to 13th May, with discounts of up to 75%, making this the perfect moment for first-time consumers to switch from manual to intelligent cleaning and upgrade their routines with cutting-edge technology. ECOVACS’ entry-level range makes that transition seamless.

ECOVACS Robotics Summer Sale

From everyday dust to hard-to-reach corners and even windows, ECOVACS Robotics cleaning solutions deliver full-home coverage, blending intelligent technology with powerful performance and seamless automation to take the stress out of summer cleaning.

The DEEBOT N50 Pro OMNI brings this vision to life with a powerful combination of vacuuming and intelligent mopping, effortlessly tackling dust, debris, and pet hair across all floor types. With up to 300 minutes of runtime, anti-hair tangle technology, and intuitive app-enabled controls, users can easily customize schedules, zones, and cleaning modes right from their smartphones or wearable devices—making smart living feel truly effortless.

Enhancing this experience further is the All-in-One OMNI Station, which streamlines maintenance with automated mop washing and drying, auto-refill, and dust emptying—delivering a hygienic, hands-free cleaning routine that keeps your home consistently fresh with minimal effort.

For homes with more compact layouts, the DEEBOT MINI is also part of the lineup. Designed to take up less space while still offering the All-in-One OMNI Station and a hands-free cleaning experience, this is another ideal choice for users seeking efficiency without compromising on performance.

As modern homes face rising levels of dust and pollution, maintaining cleanliness in homes goes beyond just floors. Windows, constantly exposed to outdoor dust and changing weather conditions, require equal attention to keep living spaces truly spotless. ECOVACS’ WINBOT robotic window cleaners address this by effectively removing dust, rain stains, and pollution buildup, leaving windows crystal-clear and helping your home shine from the inside out.

Beyond windows, the WINBOT MINI is also designed to clean a wide range of glass surfaces, including glass panels, balcony glass, and shower screens — ensuring comprehensive coverage across vertical spaces in the home.

Its compact and slim design enables it to access and clean areas that are often difficult to reach, such as narrow windows, spaces behind grills or railings, and other tight or confined surfaces. This makes it a practical solution for urban homes where accessibility can be a challenge.

Explore ECOVACS’ Summer Holiday deals to unlock special, limited-time pricing. Make the switch smarter this summer—to faster, easier, and more effective deep cleaning—at your fingertips. Visit ECOVACS’ official marketplace to grab these can’t-miss deals!

Hashtag: #ECOVACS

The issuer is solely responsible for the content of this announcement.

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