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Debut of ASEAN and Qinghai Pavilions alongside four key themes spanning energy, technology, green cities and waste management

HONG KONG SAR – Media OutReach Newswire – 12 October 2026 – Eco Expo Asia 2026, jointly organised by the Hong Kong Trade Development Council (HKTDC) and Messe Frankfurt (HK) Ltd, co-organised by the Environment and Ecology Bureau of the Government of the Hong Kong Special Administrative Region (HKSAR), will be held from 26 to 29 October at AsiaWorld-Expo.

HKTDC Associate Executive Director Silas Chu said: “Last month, the Hong Kong SAR Government unveiled the Policy Address and first Five-Year Plan, setting out a vision for building a green and liveable city. Across the region and beyond, China, the European Union and many ASEAN economies are actively pursuing carbon-neutrality or net-zero emission targets, and driving decarbonisation through regulations and industrial policies. Green transformation has shifted from policy aspiration to market rule. As global demand for ESG and green solutions continues to grow, Eco Expo Asia will bring together green technologies, innovative solutions, and global business opportunities to help enterprises capitalise on the new prospects emerging from this transition.”

He added, “This year’s Eco Expo Asia brings together over 340 exhibitors from 16 countries and regions, including first-time participants from Indonesia, Laos, Myanmar, the Philippines, Thailand, and Vietnam, highlighting the Expo’s growing international reach. Some 200 key officials and representatives of semi-official organisations from the Chinese Mainland, Hong Kong, Belt and Road countries, and ASEAN, will attend and tour the Expo, further promoting cross-regional cooperation and exchange.”

Speaking at the press conference, the Deputy Director of the Environmental Protection Department of the HKSAR Government, Dr Vanessa Au, expressed: “The 21^st edition of Eco Expo Asia, held under the theme ‘Connecting the World for a Sustainable Future’, dovetails with the HKSAR Government’s First Five-Year Plan, and implements the Policy Address precisely aligning with the National 15^th Five-Year Plan. It underscores our commitment to advancing Hong Kong’s green transformation, fostering green innovation, seizing the opportunities presented by the low-carbon economy, creating economic benefits and enhancing citizen well-being. Key highlights of this year’s expo include the HKSAR Government booth, the Environmental Campaign Committee Pavilion, the Hong Kong Pavilion and the newly established comprehensive experience zone for green technology. This year during the expo, the Environment and Ecology Bureau and the Ministry of Ecology and Environment of the People’s Republic of China will, for the first time, co-host the Belt and Road Green Innovation Conference in Hong Kong. In addition, the Environmental Protection Department, in association with the Belt and Road Initiative International Green Development Coalition and the Chinese Academy of Sciences, will jointly organise the second edition of the ‘Green Silk Road’ International Training Programme. This expo brings together stakeholders from all sectors, uniting our efforts to advance global carbon neutrality and sustainable development.”

Businesses show continued strong confidence in Hong Kong as an ESG business hub

The HKTDC has also released the “HKTDC ESG Index 2026”. The latest ESG Index stood at 67.3, up from 64.2 last year and well above the neutral threshold of 50, reflecting the continued strengthening of corporate confidence in Hong Kong’s role as an ESG hub. The survey also showed that 93% of respondents have integrated ESG into their overall business decision-making processes, while the share of businesses sourcing or selling ESG-related products and services rose from 29% in 2025 to 46% in 2026.

Silas said, “The rise in the ESG index reflects the continued strengthening of global businesses’ confidence in Hong Kong’s role as an ESG business hub. Results further demonstrate that ESG is increasingly being built into business decisions on investment, sourcing, and supply chain management, fuelling steady growth in demand for ESG products, services and solutions. ESG has evolved beyond a compliance requirement into a source of competitive advantage for companies.”

With strong demand for ESG solutions, Hong Kong is well positioned to unlock commercial opportunities across banking and finance, professional services, and innovation and technology. In terms of technological innovation, surveyed businesses identified the most impactful Hong Kong digital and ESG platforms for boosting performance as sustainable supply chain platforms (45%), AI analytics (37%), and cloud data reporting (30%). On supply chain management, respondents most valued Hong Kong’s ESG certification services (50%), followed by transparency and traceability tools (41%), and ESG audit and risk analysis solutions (36%).

Pavilion line-up expands with ASEAN and Qinghai Pavilion debuts

Eco Expo Asia brings together green innovations and technologies from around the world, offering the industry a platform to exchange ideas and explore new business opportunities. This year, the number of participating pavilions has risen to 18, covering a wider spread of regions. On the Chinese Mainland front, Qinghai Province makes its first appearance with a pavilion of its own, joined by the nine Chinese Mainland cities in the Greater Bay Area, Macao, Guangxi, Hunan, Shanghai, and Nanjing in Jiangsu Province.

Among the international group pavilions, the headline addition is a new ASEAN Pavilion, featuring 13 green technology companies from eight member countries, including Singapore, Laos, Malaysia, Myanmar, the Philippines, Indonesia, Thailand, and Vietnam. An ASEAN networking reception on the opening day will further strengthen business ties with the region. In addition, Korea Institute of Fusion Energy (KFE), bringing two companies, will showcase their marine environmental technologies and waste gas treatment equipment. The US State of Illinois returns after several years, while Canada, Italy, and the Netherlands maintain their regular presence.

Regarding Hong Kong exhibitors, the Hong Kong Science and Technology Parks Corporation once again leads 11 start-ups to the Expo to showcase local green innovation achievements. The Hong Kong Pavilion, supported by the Environmental Protection Department and coordinated by the Federation of Hong Kong Industries, is back with 19 local exhibitors presenting a diverse range of eco-friendly products, technologies and solutions. Rounding off the home-grown line-up, the HKSAR Government booth, featuring 11 bureaux and departments including the Environment and Ecology Bureau, and the Environmental Campaign Committee Pavilion, will highlight the city’s latest work in environmental protection and green development.

As a member of the HKSAR Government’s GoGlobal Task Force, the HKTDC will set up a GoGlobal Connect Zone, helping Chinese Mainland environmental enterprises tap international markets through Hong Kong’s professional services. A seminar on going global rounds out the programme, sharing practical experiences in expanding overseas.

Four thematic areas spotlight green innovation

Aligned with global trends and policy directions, this year’s Expo centres on four areas: Green Energy in Motion, Frontier Green Tech, Building for a Greener City and From Waste to Worth, showcasing the latest innovative green technologies, products, and solutions.

Under”Green Energy in Motion“, the Expo features green energy solutions spanning the maritime, land transport and aviation sectors. Echoing the call in the Policy Address and Hong Kong’s First Five-Year Plan to build a Sustainable Aviation Fuel (SAF) industry chain, EcoCeres Ltd. (Booth: 3-F30), a global leading SAF producer, makes its Expo debut with its advanced renewable SAF made from waste materials, alongside Hydrotreated Vegetable Oil (HVO). The Hong Kong Science and Technology Parks Pavilion (Booth: 3-E02) will also focus on energy, with start-ups presenting innovations such as EV chargers and modular EV conversion technology.

Under the “Frontier Green Tech” theme, around 30 start-ups and university spin-offs will show how research achievements have been transformed into practical environmental applications. Among them, first-time exhibitor Stellerus Technology Limited (Booth: 6-D27) will display the Multi‑Spectral Imaging Carbon Observatory (MUSICO), the world’s first lightweight, high‑resolution, high‑precision synergistic greenhouse gases observatory, which has already been deployed on China’s Tiangong space station. MUSICO monitors greenhouse gas emissions, supporting enterprises in formulating emission-reduction measures and supplying precise data to green finance institutions.

In keeping with the “building a green and liveable city” policy direction under Hong Kong’s Five-Year Plan, the “Building for a Greener City” theme gathers a host of innovations now in real-world use. Green Vigor Limited (Booth: 3-E02) will exhibit a modular hydropower system that converts wasted hydraulic resources from water tanks and cooling systems in buildings into electricity, a solution already in use in local shopping malls, commercial buildings and schools. AEC GreenTech Innovations Limited (Booth: 3-C20) brings a robot designed for plastering and paint spraying, which works at least five times faster than manual labour while halving material use, delivering environmental benefits. The technology has been adopted in local construction projects.

The fourth area, “From Waste to Worth“, assembles a number of leading Chinese Mainland enterprises in the waste management sector, including Chongqing Sanfeng Environment Group (Booth: 3-E30), named among Top 50 Environmental Enterprises in China and the Top 10 Influential Enterprises in China’s Solid Waste Industry, as well as listed environmental companies Dynagreen Environmental Protection Group (Booth: 3-B30) and Beijing Enterprises Environment Group (Booth: 3-D30), showcasing their waste management and resource circular solutions. Hong Kong-based Green AI Technology Limited (Booth: 3-E26) will launch REV, its new generation of the unmanned recycling station at the Expo, demonstrating how AI and automation can be applied to recycling.

Over 30 key events to gather experts from government, industry, academia and research

More than 30 forums and seminars will be held during the Expo, bringing together over 80 government officials, industry leaders and business representatives from the Chinese Mainland, Australia, Malaysia, Thailand, and other Belt and Road countries to share insights on green opportunities, success stories and forward-looking strategies.

The annual flagship event, Eco Asia Conference, will also feature a series of seminars centred on four key themes, with industry and academic experts presenting the latest developments. On 26 October, Professor Su Hui, Chair Professor in the Department of Civil and Environmental Engineering at HKUST, who spearheaded the development of MUSICO, will join Professor Kenneth Leung, Director of the State Key Laboratory of Marine Environmental Health at CityUHK, to discuss technologies for monitoring extreme weather and explore Hong Kong’s role as a regional green innovation hub. On 27 October, representatives from the Construction Industry Council and China State Construction Engineering (Hong Kong) Ltd will examine green building development from the perspectives of policy, certification and practice.

On 28 October, Avinash Persaud, Special Advisor on Climate Change to the President of the Inter-American Development Bank (IDB) and a member of the High-Level Expert Group on Climate Finance for the COP26, 27 and 28 Presidencies, will take to the stage. Drawing on his extensive experience spanning international finance, public policy, and climate finance, he will analyse emerging global trends in the field.

Public Dayinvites everyone to embrace green lifestyles

The final day of the Expo (29 October) will be Public Day, with free admission for the public, aiming to raise awareness of environmental protection and sustainability and to encourage the adoption of green lifestyles. A series of seminars on climate, environmental protection and food waste upcycling will be held that day. Speakers include representatives from the Hong Kong Observatory, Hong Kong meteorologist and former Assistant Director of the Hong Kong Observatory Leung Wing Mo, and guests from Ways Out HK, a local social enterprise that turns food waste into jewellery. Visitors can also take part in interactive workshops, including a recycled paper making workshop, green cleaners making workshop and green mini games, enabling participants to learn hands-on how to put resource recycling and green living into practice.

Register now : https://tinyurl.com/33s7wf64

Hashtag: #HKTDC #EcoExpoAsia #ESG #Sustainability

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Su held talks with Young Hyun Jun, Samsung’s vice chairman and chief executive of its Device Solutions division, during a visit to South Korea that also included discussions with SK Hynix chief executive Kwak Noh-jung. The meetings placed high-bandwidth memory, broader DRAM supplies and possible foundry co-operation at the centre of AMD’s efforts to secure capacity for its expanding AI business.

Speaking to reporters in Seoul, Su said AMD continued to explore opportunities with Samsung across both memory and contract chip manufacturing. She described Samsung and SK Hynix as critical partners for AMD’s data-centre ambitions and urged memory producers to add capacity as quickly as possible.

The talks come as shortages across parts of the memory market complicate expansion plans for chip designers and data-centre operators. Demand for high-bandwidth memory, or HBM, has surged because AI accelerators require substantially greater memory bandwidth than conventional computing processors, while strong demand has also tightened supplies of standard DRAM products.

Su said the supply environment remained tight and AMD was working with customers to optimise their memory requirements so available capacity could support more computing. She said the company had built a strong supply chain but was working with suppliers to accelerate its expansion.

AMD expects demand for AI computing to remain elevated for several years and plans to increase chip supply substantially in 2027. Su said during a stop in Taiwan this week that the company had extended its capacity-planning horizon from one or two years to between three and five years as it works with manufacturing partners.

That planning encompasses advanced wafers, packaging, substrates and memory, all of which have become potential constraints as companies race to build AI infrastructure. AMD has been expanding its Instinct accelerator business as it competes with Nvidia for spending by cloud providers and other large data-centre customers.

Samsung already occupies an important position in AMD’s supply plans. The companies signed a memorandum of understanding in March covering next-generation AI memory and computing technologies, with Samsung designated a primary HBM4 supplier for AMD’s Instinct MI455X graphics processor.

Their agreement also covers advanced DRAM products for AMD’s sixth-generation EPYC processors, code-named Venice, and its Helios rack-scale AI platform. Samsung has supplied HBM3E memory for AMD’s MI350X and MI355X accelerators, extending a technology relationship between the companies that spans graphics, mobile and computing products.

HBM4 is particularly important to the next generation of AI hardware because increasingly powerful accelerators need faster transfers of enormous datasets while controlling energy consumption. Memory manufacturers have consequently directed more investment towards HBM, leaving capacity across other memory categories under pressure.

Samsung has been seeking to increase its position in the high-margin HBM market while SK Hynix remains another major supplier to AI chip developers. Strong AI demand has supported memory prices and earnings, though the pace of conventional DRAM price increases is expected to moderate after steep gains earlier this year.

AMD’s discussions with Samsung could also extend beyond memory. Their March agreement provided for talks on a possible foundry partnership under which Samsung could manufacture future AMD products. Su said on Wednesday that AMD was continuing to examine opportunities in that area, without announcing a manufacturing contract.

The possibility would give AMD another potential production option as advanced semiconductor capacity remains heavily sought after. Taiwan Semiconductor Manufacturing Co remains a central manufacturing partner for AMD, and Su met suppliers in Taiwan before travelling to South Korea as part of her capacity discussions.

Upgrades improve print quality, strengthen security and simplify ID card issuance

SINGAPORE – Media OutReach Newswire – 6 October 2026 – HID, a global leader in trusted identity solutions, is rolling out enhancements across its FARGO^® DTC ID card printers, including the DTC1250e, DTC4500e and DTC1500 models, to help organizations issue secure, professional-quality ID cards faster, with less IT support and the ability to easily scale as needs evolve.

Organizations that issue ID cards — from schools and healthcare systems to government offices, corporate campuses and others — need printers that are easy to operate, produce consistently high-quality credentials and keep pace with growing security requirements. The latest enhancements address each of those priorities.

Built to Print: Faster, Sharper Output and Stronger Security
Speed and reliability are essential for high-volume credential issuance. Printing more cards in less time with fewer interruptions, these printers have been updated with newer, faster hardware and electronics platforms. Support for high-capacity ribbons also streamlines the issuance workflow and maintains high productivity, reducing reloads and lost time. For front-desk and HR staff who issue dozens of badges a day, this means shorter lines and less time waiting on a stalled print job.

“We’ve been at this for a long time. For more than three decades, organizations have trusted us to power their ID badging programs,” said Apryl Erickson, VP and Head of FARGO. “With thousands of printers in the field worldwide, we’re excited to build on that legacy by delivering enhanced solutions that provide greater value to our end users and support their mission-critical issuance processes.”

Card quality matters just as much as issuance speed. With 300 x 600 dpi resolution, an enhanced color profile and adjustable K-panel printing, organizations benefit from having professional-quality ID cards that look sharper, have crisper text, cleaner logos and more accurate color.

When an organization issues credentials, they need to enhance card security and safeguard cardholder data. As such, all DTC printers offer enhanced AES-256-GCM encryption and resin scramble data protection. On the DTC1500 and DTC4500e, a built-in, customizable watermark overlay adds a layer of security at no added cost.

Built to Last: Secure, Reliable, Sustainable Performance and Less Downtime
Reliable and sustainable, the enhancedDTC printers are backed by three-year product warranties, provide ongoing printer health monitoring and are specifically engineered for efficient energy use.

Organizations also need to keep operator maintenance low. An integrated diagnostic utility and Color Assist tool are now built directly into the printer driver, so common issues can be identified and resolved without a support call. An optional OLED SmartScreen on the DTC1250e further simplifies day-to-day operation, helping non-technical staff be productive from day one with no IT ticket required.

Built for More: Room to Grow Without Starting Over
Programs rarely remain static, and organizations need to scale as their needs grow without incurring the cost of new hardware. FARGO DTC printers offer field-upgradable dual-side printing and encoding options that let organizations start with what they need and add capabilities later, without having to buy new base hardware, as programs expand.

These upgrades build on more than 30 years of DTC printing expertise. The portfolio also integrates with HID’s broader ecosystem for access control and identity management, helping organizations expand their credentialing programs as needs evolve. The DTC1500 and DTC4500e are also compatible with FARGO Connect™, a secure, cloud-based card printing platform that provides real-time fleet visibility.

The enhanced DTC printer portfolio is commercially available now. Product availability for enhanced FARGO DTC1250e and DTC4500e printers is slated for late October/early November, varying by region. Enhanced FARGO DTC1500 units will follow later in Q4 2026.

Building on these enhancements, HID plans to further expand the FARGO DTC portfolio later this year with a streamlined, single-sided printer designed for organizations with lower-volume issuance needs. It will not be available in the United States and Canada. It will be offered only in select regions outside these markets. The new model will bring the same reliability and ease of use while providing an accessible entry point into the broader FARGO portfolio.

FARGO printers are available through HID’s partner and distributor network.

Stay Connected with HID

Visit our Media Center, read our Industry Blog, and follow us on Facebook, LinkedIn and X (Twitter).
Hashtag: #HID #FARGO #TrustedIdentity

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The issuer is solely responsible for the content of this announcement.

About HID

HID powers the trusted identities of the world’s people, places and things. We make it possible for people to transact safely, work productively and travel freely. Our trusted identity solutions give people convenient access to physical and digital places and connect things that can be identified, verified and tracked digitally. Millions of people around the world use HID products and services to navigate their everyday lives, and billions of things are connected through HID technology. We work with governments, educational institutions, hospitals, financial institutions, industrial businesses and some of the most innovative companies on the planet. Headquartered in Austin, Texas, HID has over 4,500 employees worldwide and operates international offices that support more than 100 countries. HID is an ASSA ABLOY Group brand. For more information, visit www.hidglobal.com.

© 2026 HID Global Corporation/ASSA ABLOY AB. All rights reserved. HID, the HID Blue Brick logo and the Chain Design are trademarks or registered trademarks of HID Global, ASSA ABLOY AB, or its affiliates(s) in the US and other countries and may not be used without permission. All other trademarks, service marks, and product or service names are trademarks or registered trademarks of their respective owners.

Future Foods Opens New Revenue Opportunities for Restaurant Operators

Born out of the Kitchens business, Future Foods was created to help restaurant operators generate additional revenue through virtual delivery brands. Today, it is the largest virtual brand company in the restaurant space, with more than 1,500 live locations.

The Future Foods model allows restaurants to launch established delivery brands from their existing kitchens without investing in another location or major infrastructure. With their existing kitchens, operators can optimise food costs, reach more customers and increase delivery sales.

Future Foods also provides support with storefront setup, delivery platform integration, marketing and operations, allowing restaurant teams to focus on preparing great food while strengthening their delivery business.

Restaurant partners can choose from a portfolio of nationally recognised brands across a range of cuisines, including Pasta Glory, Brooklyn Calzones, Sunny & Fine’s, Poke Picnic and Brekkie Bagels, fulfilling customer demand in the market.

Picnic Brings a Simpler Workplace Dining Experience

Alongside Future Foods, NAMAA has introduced Picnic, a workplace dining platform built around the idea of “food at work, simplified.” By combining CloudKitchens with local brick-and-mortar restaurants, Picnic gives employees a wide variety of lunch options through a digital food court experience.

Orders are delivered to a designated Picnic shelf on each office floor within a 20 to 30-minute delivery window, making lunchtime easier while reducing the need to manage individual food deliveries.

Picnic also offers a more cost-effective approach to workplace dining. With no delivery fees, tips, administrative charges, nor minimum order requirements, both employers and employees benefit from greater convenience at no extra cost.

The platform offers flexible corporate solutions, including subsidised lunch programmes, non-subsidised daily deliveries, group ordering and fee-free catering for larger corporate events, allowing businesses to tailor to their employees’ needs.

Together, Future Foods and Picnic reflect NAMAA’s commitment to supporting restaurant growth while making workplace dining easier. As food delivery continues to evolve across the Middle East, both platforms give restaurants, businesses and consumers more flexibility and choice.

Hashtag: #NAMAA

The issuer is solely responsible for the content of this announcement.

About NAMAA

NAMAA is a leader in driving the growth of digital food solutions, quick commerce, and the underlying real estate foundations. The founding members have been laying the groundwork since 2019, guided by a philosophy centred on developing infrastructures that give consumers fast and dependable access to meals, groceries, and essentials. Part of the wider ATOMS Group, the company has since grown into a multi-sector network with operations spanning the Middle East.

The event will bring together industry participants from digital assets, fintech, payments, Web3 infrastructure, institutional services, and cross-border finance. It aims to provide a face-to-face networking platform for institutions, project teams, infrastructure providers, investors, and professionals. Discussions will focus on digital asset infrastructure, compliant payments, stablecoin use cases, wallet and card services, and how digital assets can enter real-world payment scenarios.

Event Details

Event Name: Token2049 Networking Event with BitGo, HashKey & UstarPay
Date & Time: Wednesday, 7 October, 18:00–21:00 GMT+8
Event Partners: BitGo, HashKey Cloud, UstarPay
Registration: Submit an application through the official Luma event page
Registration Link: https://luma.com/qjgwthvg
Entry: Approved participants may enter with a valid QR code

Please note that this event requires registration approval. All participants must submit an application through the official Luma event page. The hosts will review applications based on applicant background, industry relevance, and event capacity. Once approved, participants will receive an event QR code. Only approved participants with a valid QR code will be admitted to the event. An invitation or shared event information does not constitute official admission credentials.

Stablecoins Enter the Next Stage: From On-Chain Assets to Real-World Payments

In recent years, stablecoins have evolved from a funding tool primarily used in crypto trading into a payment and settlement medium within the global digital economy. As cross-border work, global freelancing, online subscriptions, e-commerce, and international trade continue to grow, the market demand for faster, more flexible, and geographically accessible payment methods has continued to increase.

However, for digital assets to truly enter everyday life, one core question remains: how can the speed of on-chain transactions be connected with the trust, compliance, and settlement systems required by the real world?

In traditional financial and payment networks, every movement of funds must address fundamental questions: who the user is, where the funds come from, whether the transaction is compliant, whether risk can be identified, and whether the settlement trail can be audited. For digital asset payments, these questions do not disappear simply because technology becomes faster. Instead, they become essential conditions for digital assets to move toward broader, scalable adoption.

UstarPay’s role is to build the infrastructure that connects on-chain assets with real-world payment scenarios during this transition.

About UstarPay’s Role in Real-World Digital Asset Use

UstarPay is a PayFi-focused infrastructure platform connecting supported digital assets with real-world spending and transaction use cases. Its core vision is to help digital assets move beyond trading, holding, or investment and become more practical for everyday and commercial use, subject to applicable requirements.

By connecting wallet, card, and related technology infrastructure, UstarPay helps eligible individuals and businesses access card and transaction solutions using supported digital assets. In applicable markets, and subject to supported assets, product settings, and relevant requirements, users may explore stablecoins and other supported digital assets for online shopping, travel and hotel spending, subscription services, cross-border purchases, in-store purchases, and, where applicable, ATM withdrawals.

For enterprises, UstarPay explores modular technology support connected to card applications, risk management, and settlement workflows. Relevant use cases may be considered for eligible platforms and businesses, subject to applicable laws, partner requirements, product scope, and case-by-case assessment.

UstarPay believes the future of digital asset use is not only about whether a transaction can be completed, but also whether relevant activity can be verified, monitored, risk-assessed, reviewed, and settled. Based on this view, UstarPay is exploring “Proof-of-Spend” as part of its digital asset application narrative. By connecting identity verification, AML processes, asset custody, on-chain risk assessment, transaction records, and settlement workflows, UstarPay is exploring how digital asset applications can be supported by more verifiable, monitorable, and traceable process foundations.

From a risk management and traceability perspective, UstarPay considers identity verification, on-chain transaction monitoring, asset custody, and settlement records as relevant components where applicable. The company may work with relevant technical service providers in these areas. This registration does not mean that all products, services, or markets are authorized or available. Relevant services remain subject to applicable laws and regulations, user eligibility, supported assets, product settings, partner requirements, and jurisdictional restrictions.

Guided by “Real Crypto, Real Life,” UstarPay’s long-term direction is to help supported digital assets move from on-chain holdings toward card and transaction applications that can be used in everyday and commercial contexts, subject to product configuration, applicable requirements, supported assets, and regional availability.

Event Significance: Connecting PayFi, Stablecoin Payments, and Institutional Infrastructure

The co-hosts of this event span digital asset custody, institutional infrastructure, PayFi, stablecoin payments, and on-chain yield. This reflects the digital asset industry’s ongoing evolution from single-purpose trading scenarios toward more mature financial and payment infrastructure.

As stablecoins continue to become an important tool for value movement in the global digital economy, the market demand for compliant payment access, secure asset custody, risk control infrastructure, and cross-border settlement capabilities continues to grow. Through this event, UstarPay hopes to engage with more industry participants to discuss how digital assets can enter the real world in a safer, more compliant, and more practical way.

Hashtag: #UstarPay

The issuer is solely responsible for the content of this announcement.

About BitGo

BitGo (NYSE: BTGO) is the digital asset infrastructure company delivering custody, wallets, staking, trading, financing, stablecoins, and settlement services from regulated cold storage. Since 2013, BitGo has focused on accelerating the transition of the financial system to a digital asset economy. BitGo maintains a global presence and multiple regulated entities, including BitGo Bank & Trust, National Association, the first federally chartered digital asset trust bank owned by a publicly traded company. Today, BitGo serves thousands of institutions, including many of the industry’s top brands, financial institutions, exchanges, and platforms, and millions of investors worldwide. For more information, visit www.bitgo.com.

About UstarPay

UstarPay is a PayFi-focused infrastructure platform designed to connect digital assets with real-world spending and transaction use cases. By connecting wallet, card, and related technology infrastructure, UstarPay helps eligible users and businesses access convenient card and transaction solutions using supported digital assets.

With a focus on compliance, transparency, and risk management, UstarPay is developing digital asset experiences designed to support traceability and transparency in supported markets. Guided by “Real Crypto, Real Life,” the company is focused on making supported digital assets more practical and relevant to everyday life, subject to applicable requirements and availability. Relevant services remain subject to applicable laws and regulations, user eligibility, supported assets, product settings, and regional availability.

For more information, please visit www.ustarpay.com.

About HashKey Cloud

HashKey Cloud is the institutional staking and yield infrastructure of HashKey Group (HKEX: 3887). It focuses on providing secure, auditable multi-chain staking and yield services for global institutions, asset managers, and professional investors. Our services include ETF/DAT staking, prime VIP staking, API staking, and prime yield, empowering institutions to manage on-chain assets and returns with efficiency and confidence.

Disclaimer: Relevant services are subject to applicable laws and regulations, user eligibility, supported assets, partner requirements, and geographic restrictions. Not all services are available in all markets.

Richard Yu, Executive Director of Huawei, Director of the Investment Review Board, and Chairman of the Huawei Consumer BG, stated: “The HUAWEI Mate 90 Series is equipped with the flagship Tau chipset across the entire series. Through vertical integration of hardware, software, chips, and cloud, we have achieved a comprehensive evolution in design, performance, imaging, reliability, and smart user experience. Today, we step into a new era of brilliance.”

Between 2007 and the end of 2025, Huawei invested a total of CNY1.8 trillion into R&D. Today’s product breakthroughs are the direct result of long-term R&D investment and a foundation of core technology. Huawei is turning foundational advancements in Kirin, HarmonyOS, and beyond into tangible product experiences that consumers can truly feel.

Meticulously Crafted, Radiant at First Sight

The HUAWEI Mate 90 Series introduces a refined, seamless design, pairing a glossy mid-frame with a matte metal rear cover.

In terms of durability, the Mate 90 Pro and higher models are built on the full-body Kunlun Xuanwu architecture. The camera cover introduces the industry’s first Optical Kunlun Glass, delivering 20x better drop resistance, while the front display is protected by 3rd-gen Kunlun Glass, offering a 50% improvement in impact resistance. The Pro Max Premium Edition and RS ULTIMATE DESIGN go further with upgraded Xuanwu Kunlun Glass, cutting reflections by 70% and boosting scratch resistance by 16x. The entire lineup supports IP68 dust and water resistance up to 6 meters alongside IP69 resistance against high-temperature, high-pressure water jets.

Powered by LogicFolding Tau Chip: A Massive Leap in Performance

At the heart of the HUAWEI Mate 90 Pro Max is the LogicFolding Tau Chip, built on an innovative architecture that drastically compresses critical path latency to enable 5 million signal transmission bonds and an impressive 125 TB/s inter-die bandwidth. The Pro Max Premium Edition and RS ULTIMATE DESIGN are powered by the Kirin 9050 Pro chip, delivering a 31% increase in overall performance. Meanwhile, the Pro model’s Kirin 9035 chip brings a 20% performance boost, and the standard edition’s Kirin 9030 chip offers a 27% gain in performance.

Vertically integrated with HarmonyOS 7 across hardware, software, chips, and the cloud, the Kirin 9050 Pro CPU supports hyper-threading technology for effortless, ultra-smooth operations. Mobile gaming also reaches new heights with hardware-accelerated ray tracing, capable of rendering up to 55 million rays per second.

Second-Generation Linglong Display: A Screen That Truly Stands Out

The HUAWEI Mate 90 Pro introduces the second-generation Linglong Display, reaching an unprecedented peak brightness of 12,000 nits at 1% APL. Built on an enhanced Tandem OLED Architecture, panel lifespan is extended by 138%. The HUAWEI Mate 90 Pro Max and RS ULTIMATE DESIGN debut the Full-color Linglong Display. Leveraging its 12,000-nit ultra-high brightness and full BT.2020 end-to-end color management, over 60 mainstream apps can now upsample P3 content to vibrant, full-color BT.2020 quality. Eye care technology also receives a major upgrade, featuring industry-first ambient light detection and a 1-nit ultra-low brightness eye-comfort mode for a seamless, strain-free viewing experience.

Breakthrough Connectivity & Reliable Outdoor Utility

Connectivity gets a total overhaul. The industry-first Wi-Fi and cellular converged antenna architecture boosts signal gain by 2 dB. The entire lineup supports eSIM, with the Pro Max pioneering four-SIM, three-standby functionality. With multi-device communication sharing, photo and video upload speeds are boosted by up to 40% in congested environments like crowded concerts or remote outdoor areas.

XMAGE True-to-Color Portrait

The entire series comes equipped with True-to-Color Camera 3.0, featuring full-focal-length infrared optical coating for the first time, which advances overall color accuracy by 37% and skin-tone accuracy by 62%. The updated XMAGE True-to-Color Portrait engine introduces four versatile shooting modes: Portrait original, Soft light portrait, Dazzling fireworks, and Starburst, delivering striking, authentic portraits that speak directly to the heart.

The Pro Max features a powerful 18 EV ultra-HDR main camera, a large-sensor 200 MP RYYB telephoto camera, and CIPA 7.5-rated hardware image stabilization, guaranteeing crisp, steady shots even beyond 20x zoom. The lineup also introduces a dedicated live-streaming optimization mode, making it an ideal companion for content creators.

Additionally, the HUAWEI XMAGE Z10 Modular Camera features a 1-inch large sensor, 24–240 mm continuous optical zoom, and a maximum aperture of f/2.0 to f/4.5, providing pristine, studio-quality imagery across every focal length.

HarmonyOS AI: Smarter, Proactive, and Seamless

Powered by the 30B MoE full-modal on-device foundation model on the Pro Max and higher models, next-generation AI features come to life. Celia Memories seamlessly syncs and organizes content from over 50 mainstream apps, while the Celia navigation bar proactively suggests over 30 context-aware actions based on on-screen content. For everyday tasks, Celia Call 2.0 handles automated call answering, call summaries, and real-time translation, while the Celia Gallery Assistant enables intuitive voice- or text-driven photo editing and instant video generation. Furthermore, HarmonyOS Interconnect brings distance-free remote Huawei Share and allows one-tap sharing to multiple HarmonyOS devices simultaneously.

Committed to taking the harder but right path, Huawei provides users and developers with a powerful alternative in HarmonyOS. Today, HarmonyOS 6 and HarmonyOS 7 power over 90 million devices, including smartphones, PCs, and tablets, and are on track to pass the 100 million mark by the end of this year. At the same time, Huawei’s global registered developer community has grown to over 11 million.

ULTIMATE DESIGN: See the Extraordinary

The HUAWEI Mate 90 RS ULTIMATE DESIGN evolves the iconic Star Diamond camera module aesthetic and debuts Dynamic Lenticular Kunlun Glass, elevating high-durability materials into an expression of premium design. The rear cover showcases an all-new Ascending Texture available in Red, White, and Black. Under the hood, it packs the Kirin 9050 Pro chip, Full-color Linglong Display, Tiantong Satellite Communications, BeiDou Satellite Messaging, four-SIM three-standby, and the advanced True-to-Color Camera 3.0 with an 18 EV ultra-HDR main camera, delivering ultimate design, technology, imaging, and experience.

The series starts at CNY5,999 for the HUAWEI Mate 90, CNY6,999 for the HUAWEI Mate 90 Pro, CNY9,499 for the HUAWEI Mate 90 Pro Max, and CNY12,999 for the HUAWEI Mate 90 RS ULTIMATE DESIGN.

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