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Agoda has received investment promotion from the Thailand Board of Investment (BOI) for International Business Center activity. Agoda’s Bangkok base underscores Thailand’s potential to become a tech talent hub.

Mr. Narit Therdsteerasukdi, Secretary General of the BOI, visited the office at the One Bangkok complex and met Agoda Chief Executive Omri Morgenshtern and senior management. The Bangkok site serves as Agoda’s Global Tech & Operations Hub, with systems developed in Thailand deployed across a platform that lists more than 6 million properties in 39 languages. The company employs more than 8,000 people in 25 markets.

More than half of the Bangkok staff are Thai, while about 2,000 foreign specialists come from more than 80 countries. Roles range from software engineering, data science and AI to product management, marketing and international business management.

“Thailand has a deep pool of skilled people in data analytics, IT and communications, engineering and business management, and an open work culture where people of many nationalities collaborate well,” Mr. Narit said. “Combining Thai and foreign expertise allows the company to place complex, high value-added activities in Thailand while creating opportunities to transfer knowledge, upgrade skills, and build the country’s tech ecosystem over the long term.”

Agoda’s foreign experts get help with visas and work permits in one place. The BOI, the Immigration Bureau, and the Department of Employment facilitate both through the Thailand Investment and Expat Service Center, a one-stop service at One Bangkok, where Agoda’s office is also based. That helps experts from around the world join Thai teams quickly and conveniently. It suits a business that constantly trains, coordinates, and travels internationally.

Agoda also runs a talent pipeline with Thai universities. Its Tech Camp Day, held three times a year, brings in more than 100 students per session, and its internship program takes more than 500 students a year from over 10 universities. More than 20 percent of interns have gone on to join the company.

“Working at a global technology company gives Thai professionals exposure to the standards, tools, and working methods of international teams,” Morgenshtern said. “That experience can be carried into new businesses, startups, and the upgrading of companies across industries, spreading knowledge and supporting Thailand’s long-term economic growth.”

“A global company like Agoda choosing Thailand as its main base for high-skilled technology work is an example of success in attracting investment driven by people and knowledge,” Mr. Narit said. “These investments create high-value jobs and give Thais the chance to work with experts from around the world. The skills they gain today will help them build new businesses and develop the country in the years ahead.”

Hashtag: #Thailandboardofinvestment #BOI #FDI #Investment

https://www.boi.go.th/en/index/

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Thailand Board of Investment (BOI)

Established in 1966, the Thailand Board of Investment (BOI) has spent six decades promoting high-value investment from both foreign and Thai investors, strengthening the country’s competitiveness and driving its transition toward a sustainable, balanced new economy.

Investment Services Center – PR Section, Office of the Board of Investment (BOI)

555 Vibhavadi-Rangsit Road, Chatuchak, Bangkok 10900 Tel. +66 (0) 2553 8111, Fax +66 (0) 2553 8222

The two-day summit, inaugurated on Friday at the Brilliant Convention Centre, attracted investment proposals worth approximately ₹5,800 crore, potentially generating more than 10,000 jobs. Separately, five companies received letters of intent for land allocation covering projects valued at ₹9,625 crore.

The proposed semiconductor facility, involving Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, represents one of the state’s largest identified investments in advanced chip packaging. The company signed a memorandum of understanding with the state government on July 22 for a greenfield outsourced semiconductor assembly and testing plant.

The project is planned for the Indore-Ujjain corridor, where the government has identified approximately 50 acres for development. Its proposed capabilities include advanced packaging technologies associated with increasingly complex semiconductor devices, although commercial production schedules and confirmed manufacturing capacities remain undisclosed.

Advanced packaging allows multiple semiconductor components to be integrated within compact assemblies, improving communication between chips and potentially reducing power consumption. Technologies involving three-dimensional integration are particularly relevant to artificial intelligence accelerators, high-performance computing and specialised processors.

The proposed plant has been described as incorporating sophisticated packaging and testing capabilities. However, claims that it will become India’s first operational 3D artificial intelligence chip packaging facility remain dependent on implementation, technical specifications and the commissioning of competing projects.

Yadav said the summit demonstrated growing interest among technology companies in establishing manufacturing, research and engineering operations in Madhya Pradesh. More than 1,000 delegates participated, including representatives from Japan, South Korea, Taiwan and Sweden.

The investment proposals announced during discussions included ₹1,800 crore from Spintronics AI Semiconductors for phased development and ₹1,200 crore from Lalwala Industries for semiconductor manufacturing and chip design activities.

Other prospective investors included companies operating in electronics manufacturing, semiconductor design, healthcare technology and associated services. The government indicated that the proposals would require further approvals and implementation agreements before their anticipated employment benefits could materialise.

Among the five companies receiving land allocation letters, Cytech RE proposed a ₹6,415 crore hyperscale data centre with a capacity of 50 megawatts at Ganga Malanpur in Gwalior. The project represents the largest individual investment covered by those letters.

Una Ecosystems proposed a ₹2,000 crore lithium-cell manufacturing facility in Bhopal, while Auriga IT Solutions outlined a ₹500 crore global capability centre in Indore. Meena Circuits and Kaynes Electronics proposed electronics manufacturing investments of ₹400 crore and ₹310 crore respectively.

These investments extend beyond semiconductor fabrication and packaging, reflecting the government’s broader effort to attract data infrastructure, electronics manufacturing and technology services. The distinction is significant because the aggregate investment figures announced at the summit encompass several industrial categories rather than semiconductor production alone.

Yadav also announced plans for a Semiconductor Centre of Excellence and a separate Centre of Excellence for Photonics and Quantum Technologies. Both institutions are intended to support research, chip design, innovation and specialised workforce development.

The Madhya Pradesh State Electronics Development Corporation exchanged memoranda of understanding with five institutions, including SEMI India, Semiconductor Laboratory in Mohali and the Electronics Sector Skills Council of India.

The agreements cover technical collaboration, training, research and industry engagement. Their implementation is expected to involve cooperation between government agencies, academic institutions and private companies seeking access to specialised semiconductor expertise.

The state’s Semiconductor Policy 2025 offers financial incentives for eligible projects, including capital assistance and subsidised electricity. Officials have presented these measures as instruments for attracting investment into a sector requiring substantial initial expenditure and dependable infrastructure.

Yadav assured participating companies of administrative assistance, including streamlined approvals, single-window clearances and access to electricity supplies. He also identified the Indore-Ujjain Economic Corridor as a priority location for semiconductor packaging, electronics manufacturing and chip design.

Seven additional companies received letters of intent for office accommodation at the Electronics Complex in Pardesipura, Indore. Their proposed activities include semiconductor design, engineering services, research, artificial intelligence applications and electronics development.

The allocations cover approximately 44,816 square feet and carry projections of 1,280 employment opportunities. Among the beneficiaries are ADT Semiconductors, Spintronics AI Semiconductors, H-Semi Products and Truechip Solutions.

The summit’s programme includes technical discussions on semiconductor supply chains, advanced packaging, fabless chip design, photonics, quantum technologies and workforce requirements, alongside exhibitions involving more than 50 participating companies.

Exploring Emerging Opportunities in AI, Smart Supply Chain Management, ESG and Sustainability

Free Admission Open for Public Registration Now

HONG KONG SAR – Media OutReach Newswire – 24 October 2026 – Amid the reshaping of global supply chains, the rapid advancement of artificial intelligence (AI) technologies, and the rise of emerging industries such as the low-altitude economy, the logistics industry is entering a new wave of smart transformation. Organised by the Hong Kong Productivity Council (HKPC) and funded by the Logistics Promotion Funding Scheme (LPFS) under the Maritime and Aviation Training Fund of the Transport and Logistics Bureau of the HKSAR Government, LogTech Expo 2026 will take place on 29 October (Thursday) at the InnoCentre in Kowloon Tong. Under the theme “Smart-Driven Transformation, Leading the Future of Logistics”, the Expo will bring together more than 50 logistics, supply chain and innovation and technology enterprises, alongside logistics industry leaders and experts, to share insights through a series of forums and discussions. The event will provide a one-stop platform for the industry to stay abreast of the latest logistics technology trends and developments. Admission is free, and online registration is now open.

As one of the major annual events in Hong Kong’s logistics technology sector, the Expo will feature the latest applications and achievements in smart logistics. From AI and big data analytics, smart warehousing and robotics, and automated supply chain management systems, to cross-border e-commerce logistics, green logistics, new energy transportation and drone delivery solutions, visitors will be able to experience first-hand how technology is reshaping logistics operations and helping enterprises enhance efficiency and competitiveness.

Renowned Enterprises and Organisations Showcase the Entire Smart Logistics Value Chain
This year’s Expo will bring together renowned brands and organisations from the logistics and technology sectors, including SF Supply Chain, Hong Kong Customs and Excise Department, Hongkong Post, Auto-ID Technology, HSM Industrial Solution, Tradelink, GS1 Hong Kong, ShipAny and Axis Communications, showcasing innovative solutions that support digital transformation and intelligent operations across the logistics industry. Visitors can explore the following technology zones:

• AI and Data Applications Zone: Leveraging AI, big data and automation technologies to enhance logistics planning and operational efficiency;
• Smart Warehousing and Robotics Zone: Showcasing intelligent sorting systems, automated warehousing and robotics solutions;
• Smart Supply Chain and Digital Platform Zone: Featuring WMS, TMS and digital supply chain management systems;
• Cross-border E-commerce and Delivery Zone: Showcasing innovative models in global fulfilment and smart delivery;
• ESG and Green Logistics Zone: Focusing on new energy transportation, carbon reduction technologies and sustainable logistics development;
• Low-Altitude Economy Zone: Exploring emerging applications such as drones and last-mile delivery solutions.

Visitors will not only be able to learn how innovative technologies are applied in real-world business scenarios but also engage directly with solution providers and industry experts to explore opportunities for collaboration and transformation.

10 Thematic Seminars and Sharing Sessions Focus on the Future of Logistics
In addition to the exhibition, the Expo will feature 10 thematic forums and technical sharing sessions covering key industry topics including AI, supply chain digitalisation, cross-border e-commerce, the low-altitude economy and logistics innovation.

The opening seminar, “Smart Tools for Logistics: Practical AI Applications and Insights”, will be moderated by Ryan IP, Vice President and Executive Director of the Public Policy Institute of Our Hong Kong Foundation, and feature a panel comprising Professor Kee-hung LAI, Head of the Department of Logistics and Maritime Studies and Chair Professor of Shipping and Logistics at The Hong Kong Polytechnic University; Sunny HO, MH, JP, FCILT, Executive Director of the Hong Kong Shippers’ Council; Keno Tai-yip CHEUNG, President of The Chartered Institute of Logistics and Transport in Hong Kong; and Suki CHEUNG Shuk-ming, Chief Executive Officer of MG Ship. Together, they will discuss how AI can enhance logistics operational efficiency, drive supply chain digitalisation, and support Hong Kong’s development as a smart logistics hub.

In addition, experts from organisations including Profit Sky International Industrial, ShipAny, Tradelink, Axis Communications and GS1 Hong Kong will share real-life business cases, enabling visitors to gain deeper insights into digital twins, cross-border e-commerce, supply chain visibility and AI applications in logistics.

Promoting Cross-sector Collaboration to Shape the Future of Logistics
The Expo is supported by more than 20 industry organisations, including the Airport Authority Hong Kong, Cathay Cargo, Hong Kong Shippers’ Council, Hong Kong Logistics Association, Chartered Institute of Logistics and Transport in Hong Kong, Cyberport and the Logistics and Supply Chain MultiTech R&D Centre. It serves as an effective platform for industry exchange and business matching, fostering innovative collaboration and industry upgrading.

Admission is free. Logistics practitioners, supply chain professionals, manufacturers, e-commerce businesses, technology solution providers, academics, and members of the public interested in the development of logistics technology are welcome to attend.

Event Details
LogTech Expo 2026
Date: 29 October 2026 (Thursday)
Time: 10:00 am – 5:30 pm
Venue: InnoCentre, 72 Tat Chee Avenue, Kowloon Tong
Admission Fee: Free (Advance registration required)
Register Now: https://campaigns.hkpc.org/zh-hk/tc-rsvp-logtech_expo_2026
Exhibitor List: View Exhibitor List

Hashtag: #HKPC

The issuer is solely responsible for the content of this announcement.

About the Hong Kong Productivity Council

The Hong Kong Productivity Council (HKPC) is a statutory body established in 1967, dedicated to enhancing the productivity and competitiveness of Hong Kong enterprises through world-class applied R&D, innovative technology services, and integrated manufacturing solutions. As a market-oriented, international R&D organisation, HKPC leverages its deep expertise and extensive industry experience in key areas such as AI, advanced manufacturing, life and health technology, green technology and new energy to drive new industrialisation and support the growth of emerging and future industries.

HKPC focuses on addressing businesses challenges and industrial technology needs, promoting the full integration between technological and industrial innovation. Through technology transfer, product innovation, intellectual property protection and commercialisation of R&D outcomes, the Council fosters collaboration with the local business community as well as top global R&D institutions, delivering added value to industries and advancing the development of new productive forces. HKPC’s world-class R&D achievements have been widely recognised over the years, winning an array of local and overseas accolades, reinforcing Hong Kong’s role as an international innovation and technology centre and a smart city.

To help enterprises capitalise on Hong Kong’s strengths in international connectivity to expand into global markets, HKPC offers comprehensive overseas expansion services tailored to critical areas including product development, technology, manufacturing, and management, enabling businesses to successfully go global from Hong Kong.

HKPC is also committed to providing timely and practical support to SMEs and startups with timely and practical, assisting them in accessing Government funding programmes. Through its FutureSkills training initiatives, HKPC helps both industry and academia stay ahead in latest digital and STEM technologies, nurturing a future-ready talent pool for Hong Kong.

For more information, please visit HKPC’s website: www.hkpc.org/en.