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The programme is anchored by MOKiN’s TrueGround™ technology, a SIRIM-certified anti-leakage charging solution designed to help reduce electrical leakage risks during charging. As the world’s first Class-1 Anti-Leakage charger, MOKiN introduces an added layer of electrical safety protection that addresses a risk often overlooked in conventional charging products, which typically prioritise charging speed and power output.

The initiative comes amid growing concerns over electrical safety in Malaysian households. According to the Fire and Rescue Department, electrical-related issues accounted for 68% of building fire cases recorded between January and September 2024, with more than 3,000 residential fire incidents linked to electrical sources such as faulty wiring, damaged electrical equipment and overloaded circuits.

“Charging has become such a routine part of daily life that many people no longer pay attention to warning signs like overheating, exposed cables or tingling sensations during charging,” said Terry Lee Hup Boon, Founder of UNIPRO GLOBAL SDN BHD.

“Many consumers tend to focus on charging speed and convenience, but electrical safety is just as important. Our anti-leakage charging technology was developed to help address safety risks that are often overlooked in everyday charging, and through the Safe Swap Programme, we hope to encourage greater awareness of safer charging practices.”

Through the Safe Swap Programme, consumers can trade in old or damaged chargers from any brand and receive a complimentary MOKiN 20W charger, while stocks last.Consumers can participate in Safe Swap activations at the following events from 1 to 30 June 2026:

• Switch World Event, Gurney Plaza, Penang (4-7 June 2026)
• UR Festival Fair, Sunway Square, Selangor (11-14 June 2026)

In partnership with consumer electronics retailer Gajeto, MOKiN will also be running a free trade-in campaign at selected Gajeto outlets throughout the month of June, giving consumers additional opportunities to learn more about safer charging solutions and explore MOKiN’s range of anti-leakage charging products. Customers can bring any old charger, regardless of brand, and swap in for a brand-new MOKiN 20W charger at no cost, with no purchase required, while stocks last. Participating Gajeto locations include:

• Gajeto IOI City Mall (6-7 June 2026)
• Gajeto The Exchange 106 (13-14 June 2026)
• Gajeto 1 Utama (20-21 June 2026)
• Gajeto Setia City Mall (27-28 June 2026)

Consumers may also choose to upgrade to selected higher-watt charging models ranging from 33W to 140W at promotional prices throughout the campaign period.

The Safe Swap Programme reflects MOKiN’s ongoing effort to encourage safer charging habits and greater awareness around the condition of charging accessories used daily by consumers. Consumers are encouraged to bring in old, damaged or ageing chargers during the campaign period, particularly accessories showing signs such as overheating, exposed cables, loose connections or inconsistent charging performance. All traded-in chargers collected through the programme will be removed from circulation as part of the initiative.

Complimentary MOKiN 20W chargers are available on a first come, first served basis while stocks last. For more information, visit www.mokin.my.
Hashtag: #mokinmalaysia #trueground #mokin #mokinmy #safeswap

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Unipro Global Sdn Bhd

Malaysia’s dedicated distributor for the world’s leading consumer electronics accessories brands such as MOKiN, AUKEY, ESR, and Nakamichi. Based in Kuala Lumpur. We bring premium tech accessories to Malaysian consumers. At Unipro Global Sdn Bhd, we believe that quality tech accessories should be accessible to every Malaysian. We work closely with our brand partners to ensure the right products reach the right customers — at the right price.

The offering will comprise existing ordinary shares held by the company’s current shareholders, meaning proceeds from the sale will go to the selling shareholders rather than to OMIFCO. The subscription period is expected to open this month, subject to final regulatory approvals from the Financial Services Authority, with trading targeted for July if market conditions remain supportive.

OMIFCO is 50 per cent owned by Oman state energy group OQ, while Indian Farmers Fertiliser Cooperative Limited and Krishak Bharati Cooperative Limited each hold 25 per cent. The float is expected to give investors access to one of Oman’s largest industrial exporters and a fertiliser producer with strong exposure to global urea and ammonia demand.

The company operates from Sur Industrial City, where its complex includes two ammonia trains and two urea trains. Annual nameplate capacity stands at about 1.15 million tonnes of ammonia and 1.65 million tonnes of urea, making the producer one of the largest fertiliser operators in the Gulf. The business is supported by long-term gas supply arrangements, established marketing relationships and export infrastructure, including a dedicated deep-water berth that connects the plant to overseas markets.

The IPO comes at a sensitive moment for fertiliser supply chains, with Middle East producers drawing stronger investor attention as global prices respond to disruptions in energy and shipping routes. Urea remains OMIFCO’s dominant revenue source, accounting for the bulk of sales, while ammonia provides an additional export stream and supports integrated production at the Sur complex.

OMIFCO generated revenue of $802.3 million in 2025, with an EBITDA margin of 50.6 per cent and a net profit margin of 40 per cent. Revenue for the first quarter of 2026 reached $207.4 million, while EBITDA margin stood at 50.5 per cent and profit margin at 40.4 per cent. The company has said it has maintained a net cash position for several years and has no interest-bearing debt, a profile likely to feature prominently in investor marketing.

The company expects to distribute dividends of about RO71.2 million, equivalent to roughly $185 million, for the 2026 financial year. The payout is planned in two equal instalments, scheduled for September 2026 and April 2027. For the following two financial years, dividend guidance is expected to be linked to either 90 per cent of net profit or a minimum annual compounded increase from the 2026 dividend base, whichever is higher.

The planned sale follows a series of listings and privatisation moves aimed at expanding the depth of Oman’s capital market. OQ Exploration and Production’s 2024 listing was one of the largest offerings in the region that year, while Asyad Shipping also formed part of the state-linked pipeline of public market transactions. OMIFCO’s proposed listing would extend that momentum into industrial manufacturing and food-security-linked exports.

Bank Muscat and Société Générale have been appointed joint global coordinators for the offering, with Bank Muscat also acting as issue manager. Arqaam Capital and United Securities are serving as joint bookrunners. The final structure, allocations and investor eligibility terms will be detailed in the prospectus after approval by the Financial Services Authority.

The offering is expected to include tranches for institutional and retail investors, with participation governed by Oman’s regulations for public joint stock companies. Shares will also be offered to selected qualified investors outside the United States under applicable securities rules, broadening the potential investor base while keeping the formal listing on the Muscat Stock Exchange.

OMIFCO’s position is closely linked to demand from agriculture markets, particularly urea used in crop nutrition. India has remained a major destination for its exports, supported by long-term commercial ties with its cooperative shareholders. From 2023 to 2025, the country accounted for most exported urea volumes and a substantial share of ammonia shipments, reinforcing the company’s role in cross-border fertiliser supply.

The stock climbed about 6 per cent on Tuesday as investors reacted to signs that Tencent is moving closer to embedding a task-performing assistant inside WeChat, the messaging, payments and social platform used by more than 1.4 billion people. The prototype is designed to help users complete everyday actions within the app, including finding venues, interacting with mini-programmes and placing customised orders, rather than merely answering questions in chatbot form.

The planned agent would mark a significant step in Tencent’s push to convert its AI investments into consumer products at scale. WeChat already functions as a digital operating system for daily life in China, covering messaging, payments, shopping, food delivery, public services, entertainment, ride-hailing and enterprise communication. That reach gives Tencent an advantage that few rivals can match: a single platform with a vast user base, heavy daily engagement and a dense network of third-party services.

People familiar with the prototype have indicated that users would be able to access the AI agent through a swipe gesture on the main WeChat screen. Tencent is expected to begin the regulatory compliance process before wider testing, with a small group of external users likely to receive access before any phased public launch. A firm release date has not been set, reflecting both regulatory uncertainty and the technical demands of deploying agentic AI across a platform of WeChat’s size.

The market response underscores how investors are reassessing Tencent’s AI position after months of concern that the company was trailing Alibaba, ByteDance and Baidu in the race to commercialise generative AI. Tencent has promoted Yuanbao, its AI chatbot, developed its Hunyuan foundation model and introduced productivity-focused AI tools, but WeChat remains the asset most capable of turning those efforts into a daily consumer habit.

Tencent’s first-quarter earnings showed both the strength and the cost of that strategy. Revenue rose 9 per cent year on year to RMB196.5 billion, while IFRS net profit attributable to equity holders increased 21 per cent to RMB58.1 billion. Marketing services revenue rose 20 per cent to RMB38.2 billion, helped by AI-driven advertising improvements, while domestic games revenue grew 6 per cent and international games revenue climbed 13 per cent. Capital expenditure reached RMB31.9 billion, up 16 per cent, as spending on AI infrastructure continued to rise.

The company has told investors that new AI products are weighing on margins, even as core businesses continue to generate strong cash flow. Excluding new AI products, non-IFRS operating profit rose 17 per cent in the first quarter, compared with a 9 per cent increase overall. That gap highlights the near-term drag from AI investment, but also explains why investors are sensitive to any sign that Tencent can place AI directly into revenue-generating services.

Competition is intensifying across China’s technology sector. Alibaba has pushed Qwen into consumer and enterprise markets, ByteDance has expanded AI features across its content ecosystem, and Baidu continues to build around Ernie and AI cloud services. The key battleground is shifting from chatbots to agents that can perform tasks, connect with apps and act across digital services with limited user input.

WeChat’s mini-programme ecosystem could be central to Tencent’s approach. Millions of merchants, developers and service providers already operate within the platform, allowing an AI agent to navigate services without pushing users outside Tencent’s environment. For merchants, an effective agent could increase conversion rates by shortening the path from search to purchase. For Tencent, it could deepen engagement, improve advertising relevance and strengthen its fintech and business services ecosystem.

Regulation remains a critical constraint. China requires generative AI services offered to the public to comply with rules covering data security, content control and algorithmic governance. Any WeChat agent would need to satisfy those requirements before broad release, especially because it could interact with payments, commerce and public services.

The Provisions on the Protection of Trade Secrets, issued by the State Administration for Market Regulation under Order No. 126, came into force on 1 June 2026 and replace rules first introduced in 1995. The overhaul gives regulators clearer authority to handle disputes involving digital assets that now sit at the centre of corporate value, from AI model architecture and training datasets to platform recommendation systems, software code and commercially valuable operational data.

The change marks a significant shift in China’s treatment of intangible technology assets. Earlier rules were drafted before cloud computing, AI systems and large-scale data operations became central to business competition. The new framework defines trade secrets as technical or business information that is not publicly known, has commercial value and has been subject to confidentiality measures by the rights holder. Technical information now expressly covers data, algorithms, computer programs and code, while business information can include management, sales, finance, planning, customer and operational data.

The timing gives the regulation wider strategic weight. China and the United States are locked in a prolonged technology rivalry involving semiconductor controls, restrictions on advanced computing hardware, limits on investment in sensitive sectors and scrutiny of cross-border technology transfers. Washington has tightened export controls on high-end chips and chipmaking equipment, while Beijing has expanded its own legal toolkit to protect critical technology, secure data flows and prevent overseas transfer of capabilities it regards as strategically important.

The new rules do not create a separate trade secret law, but provide more detailed administrative guidance under China’s Anti-Unfair Competition Law. They clarify how regulators should assess whether information is secret, whether it has commercial value, what counts as reasonable confidentiality measures and how infringement should be investigated. For companies, the central message is that protection will depend not only on the value of the information, but also on whether internal controls, access limits, confidentiality agreements, digital safeguards and evidence trails are in place.

The provisions also recognise that unsuccessful research can have commercial value. Stage-by-stage technical results, failed experimental data and development paths that save time or cost in future research may qualify for protection if they meet the legal conditions. That is especially relevant for AI labs, pharmaceutical developers, electric vehicle makers, chip design firms and advanced manufacturing groups, where failed trials can reveal important technical boundaries and prevent competitors from repeating expensive mistakes.

Regulators have been given practical enforcement tools, including powers to inspect business premises, question individuals, copy documents, examine electronic records and take action against materials linked to suspected infringement. Penalties can include orders to stop unlawful conduct, confiscation of illegal gains and fines that may reach CNY5 million in serious cases. The framework also covers improper acquisition, disclosure, use or permission to use trade secrets obtained through theft, bribery, fraud, coercion, electronic intrusion or breach of confidentiality obligations.

For multinational companies operating in China, the new rules create a mixed picture. Stronger protection could help firms defend proprietary data, software systems and industrial processes in a market where trade secret disputes have often been difficult to pursue. At the same time, wider protection for data and algorithms may increase compliance complexity, particularly in joint ventures, outsourced research, cloud services, employee mobility, cross-border collaboration and licensing arrangements.

Technology companies are likely to face tougher expectations over documentation. Firms seeking protection will need to show that the information was not easily accessible, carried economic value and was actively protected. Generic claims that an algorithm or dataset is confidential may not be enough. Companies will be expected to classify sensitive assets, restrict access by role, track downloads and transfers, maintain logs, use encryption or watermarking where appropriate, and ensure that employment and partnership contracts define confidentiality obligations with precision.

The rules also sit alongside China’s broader data and security regime, including laws on data security, personal information protection, cybersecurity and export control. That overlap could make enforcement more powerful but also more complicated. A dataset may be a trade secret, a regulated data asset and a cross-border transfer concern at the same time. Businesses handling AI training material, user behaviour data or industrial performance data will need to assess those obligations together rather than treating trade secret protection as a standalone issue.

At the center of VinDynamics’ showcases is Dyno, an intelligent humanoid robot designed to serve as a versatile assistant for modern living environments. Equipped with an advanced AI platform and a highly responsive environmental sensing system, Dyno is optimized for security and surveillance applications across urban areas, campuses, and integrated service complexes. The robot is also being developed as a household assistant capable of supporting a wide range of everyday tasks through its flexible arm span and dexterous object manipulation capabilities.

A key highlight at both ICRA 2026 and Computex 2026 is Dyno’s live demonstration as a robotic guide. The humanoid robot was previously piloted at Vinpearl Safari Phu Quoc, one of Vietnam’s largest semi-wildlife conservation parks. Operating in a demanding outdoor environment, Dyno demonstrated natural communication abilities, multilingual narration, and flexible responses to visitors’ questions, delivering a distinctive and engaging guest experience.

The pilot program at Vinpearl Safari showcased Dyno’s adaptability in real-world service scenarios and highlighted the potential of humanoid robots across tourism, hospitality, and customer service applications. Its ability to operate reliably in real-world environments, handle dynamic situations, and interact directly with people represents an important step toward future commercial deployment of humanoid robotics.

At both events, VinDynamics is also presenting a comprehensive robotics technology ecosystem developed by its team of Vietnamese engineers. In addition to the fully-integrated Dyno humanoid robot, the company is showcasing two high-value core components: a specialized actuator system and a robotic hand with internationally-benchmarked dexterity. VinDynamics is also introducing a dedicated AI training dataset optimized for real-world application scenarios.

Mastering the entire humanoid robotics value chain, from hardware to software and from mechanical design to artificial intelligence, stands as clear evidence of the research and development capabilities of Vietnamese engineers. VinDynamics’ efforts also provide a strong foundation for its global expansion strategy and long-term technology partnerships with leading technology corporations, research institutions, and international enterprises in robotics and AI. These initiatives will gradually position humanoid robotics developed by Vietnamese engineers more deeply within the global technology value chain.

Mr. La Manh Hung, Chairman of VinDynamics, said: “The introduction of Dyno at ICRA 2026 and Computex 2026 is not only an important milestone for VinDynamics but also reflects the aspirations of Vietnamese engineers to contribute to one of today’s most advanced technology fields. With the belief that humanoid robots will play an increasingly important role in daily life, VinDynamics is focused on developing practical technologies with people at the center.”

Founded in September 2025, VinDynamics is Vingroup’s pioneering humanoid robotics company, with a vision to develop versatile, human-centric robots capable of seamlessly integrating into everyday life and scaling globally. As the global humanoid robotics market is projected to reach tens of trillions of dollars by 2050, driven by rapid advances in AI, sensors, and automation, VinDynamics’ presence at ICRA 2026 and Computex 2026 further reinforces the pioneering role of Vietnamese enterprises in one of the 21st century’s most strategic technology trends.

Hashtag: #VinDynamics

The issuer is solely responsible for the content of this announcement.

About VinDynamics

VinDynamics is a technology company under Vingroup, dedicated to the research, development, and manufacturing of advanced robotics and automation solutions, particularly in the field of humanoid robots. Leveraging cutting-edge technologies such as artificial intelligence, mechatronics, and motion control, VinDynamics aims to deliver intelligent, safe, and cost-effective robotic products that enhance productivity and improve quality of life.

Learn more at: https://vindynamics.net/en

The memorandum of understanding, signed by the Government of Odisha, Intel and 3DGS, covers an advanced packaging glass-core substrate manufacturing facility in the Bhubaneswar-Khurda region. The project is expected to focus on substrates used in next-generation chip packaging, a part of the semiconductor supply chain that has gained strategic importance as artificial intelligence, high-performance computing and advanced data-centre processors demand larger, faster and more power-efficient packages.

The agreement places Odisha in a stronger position within India’s semiconductor map, which has so far been led by assembly, testing, marking and packaging projects, outsourced semiconductor assembly facilities, compound semiconductor proposals and early-stage fabrication investments. The planned plant would add a specialised layer to that ecosystem by targeting glass-core substrates and high-density interconnect technologies, areas that are increasingly viewed as critical for advanced packaging.

Intel’s role is expected to centre on technology know-how, process expertise and ecosystem support, while 3DGS brings specialisation in glass-based integration platforms. 3DGS, a US-based company, has developed glass-centric technologies for radio-frequency, photonics and semiconductor packaging applications. Its involvement gives the Odisha plan a sharper focus than conventional electronics manufacturing projects, as glass-core substrates remain an emerging technology rather than a mature commodity segment.

Glass substrates are attracting industry attention because conventional organic substrates face physical limits as chip packages become larger and denser. Advanced processors now often combine multiple chiplets, memory stacks and interconnect layers in one package. That increases pressure on the base material to carry more power and data connections while reducing warpage, signal loss and thermal stress. Glass offers better dimensional stability, finer interconnect potential and the ability to support larger package sizes, though yield, tooling and commercial-scale production remain challenges.

Intel has publicly positioned glass substrates as a key packaging technology for the second half of this decade. The company has argued that glass could help extend system-level performance gains beyond the limits of transistor scaling, particularly for artificial intelligence accelerators and high-performance computing chips. For India, participation in this segment could move the country beyond back-end assembly into a more advanced part of the global chip supply chain.

The Odisha project is also politically significant. The signing was witnessed by Union electronics and information technology minister Ashwini Vaishnaw and Odisha chief minister Mohan Charan Majhi, alongside senior executives from Intel and 3DGS. The state has been pushing to attract electronics, data centre and semiconductor-linked investments as part of a broader industrial strategy aimed at diversifying beyond metals, mining and ports.

The proposed facility is expected to be developed over several years, with industry estimates placing the build-out period at five to six years. Employment projections point to high-skilled roles across engineering, materials science, process control, quality systems and equipment maintenance, while indirect jobs could emerge through chemicals, gases, logistics, clean-room services and precision component suppliers.

The investment comes as India seeks to reduce dependence on overseas semiconductor supply chains after pandemic-era shortages exposed vulnerabilities in electronics, automotive and defence manufacturing. The Union government’s semiconductor programme has already backed projects by Tata Electronics, Micron Technology, CG Power and Kaynes, while several states are competing to attract design, packaging and manufacturing facilities. Gujarat and Assam have emerged as early beneficiaries, while Odisha’s Intel-3DGS agreement signals a broader geographic spread of the chip ecosystem.

For Intel, the deal fits into a wider effort to strengthen its foundry and advanced packaging credentials at a time when the global chip industry is being reshaped by artificial intelligence demand. The company has been investing in packaging platforms such as EMIB and Foveros, while also promoting glass substrates as a future enabling technology. Its broader turnaround remains under scrutiny because of competitive pressure from Nvidia, AMD, TSMC and Samsung, but advanced packaging offers a route to relevance in custom accelerators and multi-die systems.

The project will still have to pass execution tests before it becomes a production anchor. Semiconductor substrate manufacturing requires tight process control, specialised equipment, stable utilities, skilled technical labour and reliable supply of materials. Glass-core technology also needs commercial validation at scale, as the industry has not yet shifted from established organic substrate supply chains in volume applications.