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The proposed platform is being developed around the Clearing Corporation of India’s market infrastructure and is expected to be placed before the Reserve Bank of India for regulatory approval. Market participants have been working with the clearing corporation on design features, including trade execution, clearing, margining and reporting, with a rollout being discussed for the current financial quarter if approvals and operational testing proceed on schedule.

Bond forwards allow investors to buy or sell government securities at a pre-agreed price for settlement at a future date. The instrument is designed to help banks, insurers, primary dealers, overseas investors and other large holders manage interest-rate risk without requiring an immediate exchange of securities. Its wider use has become more important as India’s sovereign debt market draws larger cross-border flows after entry into major global bond indices.

The initiative follows the Reserve Bank of India’s February 2025 framework permitting forward contracts in government securities. The rules allow residents and eligible non-residents to undertake bond-forward transactions, while scheduled commercial banks and standalone primary dealers are permitted to act as market-makers. At least one party to a transaction must be a market-maker or a central counterparty authorised by the central bank.

Market officials see the platform as a step towards shifting a largely bilateral market into a more standardised structure. The present system is dominated by negotiated trades, with pricing often shaped by dealer relationships and limited visibility beyond counterparties. A screen-based mechanism could help create firmer reference prices, reduce information gaps and support more consistent valuation of related interest-rate products.

The bond-forward market is estimated at about ₹4 trillion to ₹4.5 trillion, with foreign banks accounting for the bulk of activity. That concentration has helped establish liquidity in parts of the curve but has also limited wider participation by domestic lenders, insurers and other institutional investors. A platform backed by central clearing could lower operational uncertainty for new entrants and improve confidence in settlement arrangements.

Clearing will be central to the reform. A centrally cleared structure would place the clearing corporation between counterparties, reducing bilateral credit exposure and applying margining standards across participants. The Reserve Bank’s directions already require non-centrally cleared bond-forward transactions to comply with margin rules for over-the-counter derivatives, while market-makers must use robust methods to mark positions to market.

The move also fits a wider regulatory push to improve surveillance of over-the-counter derivatives. Reporting of forward contracts in government securities to CCIL’s trade repository began on May 2, 2025, giving regulators access to transaction data through the life of a contract. A separate framework will require unique transaction identifiers for eligible over-the-counter derivative trades from January 1, 2027, improving traceability across counterparties and systems.

Foreign investor access is another factor behind the timing. Electronic trading providers have been building links to India’s government securities market as global investors increase allocations. MarketAxess executed its first platform trade in India government bonds between BlackRock and Standard Chartered Bank in 2025, using an integration with CCIL’s NDS-Order Matching system. Overseas investors bought nearly ₹1 trillion of government bonds over 13 months after inclusion in JPMorgan’s emerging market debt index, while other index inclusions have kept the market on global fixed-income desks’ radar.

The proposed bond-forward platform will still face practical tests. Dealers will need clarity on eligible securities, collateral treatment, settlement failure procedures, reporting formats, position limits and margin models. Participants will also need to align front-office systems, treasury risk controls and back-office processes before meaningful volumes migrate from bilateral trades to a shared electronic venue.

For insurers and long-duration investors, the instrument could become a more precise hedging tool across rate cycles. For banks, it could deepen market-making opportunities while making price discovery more transparent. For regulators, the key benefit lies in cleaner data, stronger risk monitoring and a structure that may reduce opacity in a derivatives market linked directly to sovereign bond pricing.

The official ceremony underscores Southeast Asia’s growing role in the global semiconductor value chain through collaboration, innovation and ecosystem-wide partnerships

KUALA LUMPUR, MALAYSIA – Media OutReach Newswire – 5 May 2026 – SEMICON Southeast Asia (SEMICON SEA) 2026 was officially launched today at the Malaysia International Trade and Exhibition Centre (MITEC), bringing together policymakers, manufacturers, suppliers, researchers, investors and emerging talent from across the global semiconductor ecosystem for three days of industry dialogue, technology showcases and business engagement.

The opening ceremony was officiated by YB Datuk Seri Johari Abdul Ghani, Minister of Investment, Trade and Industry (MITI), and attended by SEMI leadership, the Malaysian Investment Development Authority (MIDA) led by the Chief Executive Officer Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, and senior executives from global semiconductor companies.

Held under the theme ‘Transform Tomorrow’ in strategic partnership with MITI and MIDA, SEMICON Southeast Asia 2026 is expected to welcome more than 20,000 innovators, policymakers and technology experts. The three-day event focuses on key industry priorities including manufacturing scale-up, advanced packaging, intelligent manufacturing and workforce development, as companies respond to demand driven by artificial intelligence, high-performance computing and advanced electronics.

Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, Chief Executive Officer of MIDA, said Malaysia is approaching the next phase of semiconductor growth as an active builder rather than a beneficiary of global trends.

“The semiconductor industry is at an inflection point, and Malaysia intends to be at the centre of what comes next. Under the MADANI Economy Framework and the New Industrial Master Plan 2030, we are not simply maintaining our position in the global semiconductor supply chain, we are deliberately reshaping it. The NIMP 2030 sets a clear direction for the E&E sector to move beyond assembly and test into design, advanced packaging and innovation-driven manufacturing, and MIDA is here to make that transition real. The RM28.5 billion secured by the E&E sector in 2025 is proof that global confidence in Malaysia has not wavered. What we are now building is the ecosystem to match that confidence, through supply chain integration, local capability development and the kind of high-value partnerships that platforms like SEMICON Southeast Asia are uniquely placed to catalyse,” said Datuk Sikh Shamsul Ibrahim.

“SEMI’s role has always been to bring together the global semiconductor ecosystem, and that responsibility becomes even more important as the industry grows in scale and complexity. Today, innovation is no longer confined to a single segment. It requires closer alignment across design, manufacturing, materials and supply chains. SEMICON Southeast Asia provides a platform to bridge these different parts of the ecosystem, enabling stakeholders to engage in more meaningful collaboration and move from discussion to execution,” said Ajit Manocha, President and CEO of SEMI.

“As demand continues to be driven by artificial intelligence, high-performance computing and advanced electronics, the ability to coordinate across regions and capabilities will be critical. SEMICON Southeast Asia 2026 is not only about showcasing technology, but about strengthening the partnerships needed to support long-term industry growth and resilience.”

The event features key leadership programmes including the Executive Leadership Summit, MIDA Strategic Semiconductor Forum and Seminar, Sustainability and Energy Summit, TechZoomers Challenge and TalentCONNECT, reflecting SEMICON Southeast Asia’s role not only as an exhibition platform, but as a convening point for leadership, capability and execution across the region’s semiconductor ecosystem.

Marking over a decade of strategic collaboration, MIDA and SEMI today reinforce 12 years of a transformative partnership dedicated to elevating Malaysia’s standing in the global semiconductor value chain. This enduring alliance remains anchored on three core pillars designed to future-proof the nation’s industrial landscape:

• Ecosystem Integration: Harmonising domestic and international supply chains to ensure seamless operational synergy.
• Enterprise Capability: Empowering local businesses to scale their technical expertise and compete on a global stage.
• Talent Advancement: Cultivating a high-skilled workforce as the essential bedrock of Malaysia’s long-term economic resilience and competitive edge.

SEMICON Southeast Asia 2026 runs from 5–7 May 2026 at MITEC, Kuala Lumpur, with participation from companies and organisations across Asia, the United States and Europe.

The issuer is solely responsible for the content of this announcement.

About MIDA

MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 20 overseas offices. MIDA partners with investors at every stage of their journey, supporting sustainable growth and long-term value creation for Malaysia. For more information, please visit www.mida.gov.my and follow MIDA on X, Instagram, Facebook, LinkedIn, TikTok and YouTube.

About SEMI

SEMI® is the global industry association connecting over 4,000-member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The Google Cloud India AI Hub, being developed with AdaniConneX and Nxtra by Airtel, is designed as a gigawatt-scale private cloud and data centre network across three campuses near the port city. The investment is planned over 2026-2030 and marks Google’s biggest infrastructure commitment in the country, combining hyperscale computing, subsea cable connectivity and clean-energy-linked operations.

Andhra Pradesh Chief Minister N. Chandrababu Naidu laid the foundation stone for the project on April 28, 2026, alongside Union electronics and IT minister Ashwini Vaishnaw, state IT and HRD minister Nara Lokesh, Google global infrastructure vice-president Bikash Koley and senior representatives of Adani and Bharti Airtel. The project follows Google’s October 2025 announcement that Visakhapatnam would host its first gigawatt-scale AI hub in the country.

The development is expected to occupy about 600 acres across locations including Tarluvada, Rambilli and Adavivaram. State officials have projected the facility’s operational launch around September 2028, though large data centre campuses of this scale typically move through phased commissioning as power, cooling, network and security systems are completed.

Google’s plan goes beyond a conventional cloud facility. The hub is intended to support AI workloads for services such as enterprise cloud computing, consumer applications, advanced model deployment and data-intensive digital platforms. Its location on the east coast gives Visakhapatnam a strategic role in subsea connectivity, with plans for international cable landings that can improve bandwidth, reduce latency and strengthen links between India, Southeast Asia and global cloud regions.

AdaniConneX, the joint venture between Adani Enterprises and EdgeConneX, is expected to lead major elements of data centre construction and power-linked infrastructure. Nxtra by Airtel will support data centre development, fibre connectivity and cable landing infrastructure. Airtel’s existing telecom backbone and Adani’s energy and infrastructure capabilities give the project domestic execution partners at a time when AI infrastructure is becoming capital-intensive and geopolitically sensitive.

The project also fits into a wider policy push to reduce dependence on overseas compute capacity. Demand for AI infrastructure has expanded rapidly as startups, banks, telecom operators, public agencies and manufacturing groups test generative AI, automation and data analytics. Large language models and AI inference services require dependable access to graphics processing units, high-density power systems, liquid cooling, resilient connectivity and local data storage.

Visakhapatnam’s selection reflects Andhra Pradesh’s attempt to position itself as a technology and logistics corridor after years of competition from established hubs such as Bengaluru, Hyderabad, Chennai, Pune and the National Capital Region. The port city already has an industrial base, naval presence, road and rail connectivity and a coastline suited to cable infrastructure. The state government is banking on the Google project to attract hardware suppliers, energy providers, construction contractors, cloud specialists and AI startups.

Employment claims around the project have been ambitious, with state leaders citing the possibility of hundreds of thousands of direct and indirect jobs through construction, operations, supply chains and associated services. The more immediate employment impact is likely to come from civil works, electrical systems, fibre deployment, facility management, security and engineering support. Higher-skilled roles in cloud architecture, AI operations and chip-level systems may depend on how quickly local training pipelines are aligned with industry needs.

Power and water use will be closely watched. Gigawatt-scale data centres require enormous electricity supply and sophisticated cooling systems, making renewable energy procurement, grid stability and water stewardship critical. Google has said the project will be tied to a long-term clean energy strategy and community programmes covering water, skills, maritime trade modernisation and women-led businesses. Delivering on those commitments will be essential for public acceptance, especially as data centres worldwide face scrutiny over their environmental footprint.

The Union Minister for Electronics and Information Technology, Railways and Information and Broadcasting made the remarks at the ground-breaking ceremony of the Google Cloud India AI Hub in Visakhapatnam, a project carrying an estimated investment of $15 billion. The facility, planned with Adani ConneX and Airtel Nxtra, will include a 1GW hyperscale AI data centre, with about 600 acres allocated across Turluvada, Rambilli and Adavivaram in Andhra Pradesh.

Vaishnaw’s comments reflect a broader policy effort to shift India’s role from assembly-led electronics manufacturing to deeper participation in global technology supply chains. The government is seeking to build domestic capability across finished devices, modules, sub-modules, components, raw materials, tools and manufacturing machinery, a progression seen as essential for reducing import dependence and gaining a larger share of global production.

Mobile phones remain the strongest evidence of that transition. Electronics production has risen from about ₹1.9 lakh crore in 2014-15 to about ₹11.3 lakh crore in 2024-25, while electronics exports climbed from about ₹38,000 crore to about ₹3.3 lakh crore over the same period. Mobile phone production expanded from about ₹18,000 crore to roughly ₹5.5 lakh crore, and mobile phone exports rose from about ₹1,500 crore to nearly ₹2 lakh crore, making the category one of the country’s most visible export successes.

Smartphones have become a leading export product, with Apple, Samsung, Tata Electronics, Foxconn, Dixon Technologies and other manufacturers playing prominent roles in the production ecosystem. The shift has been supported by the Production Linked Incentive scheme for large-scale electronics manufacturing, which helped attract global brands and contract manufacturers to expand capacity. The sector’s next phase, however, will depend less on assembly incentives and more on the availability of components, precision engineering, skilled labour, predictable taxation and faster logistics.

The Google Cloud project adds a digital infrastructure dimension to this manufacturing agenda. Vaishnaw urged global technology companies, including Google, to consider manufacturing servers, GPUs and chips in the country, arguing that the domestic data centre boom could create demand for high-value electronics and advanced computing hardware. Visakhapatnam is being positioned as an artificial intelligence hub, with subsea cable links expected to improve global connectivity through routes connecting Australia, the Middle East, Europe, Africa and the United States.

Semiconductors are the most strategic part of the plan. The India Semiconductor Mission has already helped draw investment into assembly, testing, marking and packaging facilities, chip design centres and fabrication proposals. Approved projects across several states include packaging units, display driver chip capacity and compound semiconductor facilities. The sector remains capital-intensive and technologically demanding, and India is entering a field dominated by Taiwan, South Korea, the United States, Japan, the Netherlands and China. Timelines, execution quality and ecosystem depth will determine whether the country can move beyond packaging and design services into higher-value production.

The government’s target of building a $500 billion domestic electronics ecosystem by 2030-31 is ambitious. It requires not only export-led growth but also a domestic supplier base for printed circuit boards, camera modules, batteries, displays, sensors, connectors, power electronics and semiconductor materials. Without local component depth, headline export gains can mask high import content, limiting value addition and leaving manufacturers exposed to currency swings and global supply disruptions.

Industry executives have generally welcomed the policy focus but continue to point to operational challenges. High logistics costs, customs procedures, dependence on imported inputs, limited component clusters, power quality, land acquisition delays and uneven state-level implementation remain constraints. Global companies also compare India with Vietnam, Mexico, Malaysia and Thailand when allocating production, making policy certainty and execution speed critical.

Labour availability is one of India’s advantages. Electronics manufacturing has generated large-scale employment, including substantial hiring of young women in assembly lines and component facilities. This has helped states such as Tamil Nadu, Karnataka, Uttar Pradesh, Andhra Pradesh and Gujarat compete for investment. Yet sustained growth will require improvements in industrial training, factory housing, transport, safety standards and career progression, particularly as production moves from assembly to precision manufacturing.

Geopolitics has created an opening. Companies are diversifying supply chains because of trade tensions, tariff risks, pandemic-era disruptions and concerns over concentration in China. India’s democratic institutions, large market, engineering talent and improving infrastructure make it a credible candidate for “China plus one” strategies. The challenge is to convert interest into anchored manufacturing networks that include suppliers, tooling companies, testing labs, logistics providers and research partnerships.

Laying the Foundation for Long‑Term Growth in Japan Through Seamless Customer Experiences and Trusted Local Expertise

TOKYO, JAPAN – Media OutReach Newswire – 4 May 2026 – Arrow Electronics (NYSE: ARW), a global technology solutions provider, today announced the integration of Chip One Stop’s e‑commerce capabilities into arrow.com, strengthening its omnichannel customer engagement in Japan. By bringing together Arrow’s global resources, supplier network, and digital tools with Chip One Stop’s trusted local expertise, the integration delivers a more seamless and consistent customer experience while laying a strong foundation for long‑term growth.

Through the integration on arrow.com, customers in Japan gain access to a single, scalable destination that continues to offer Japanese‑language support and local services, while expanding their access to Arrow’s broader ecosystem. Arrow’s Yokohama warehouse will continue to operate as an important logistics facility in Japan, supporting stable and efficient fulfilment. Eligible orders can typically be delivered within 24 hours in Japan and in many South Asian markets, with delivery timelines in other Asia‑Pacific countries varying by destination.

Electronic components and technology solutions are foundational to Japan’s manufacturing, innovation, and technology ecosystems. On arrow.com, customers can access an integrated interface that supports discovery, evaluation, transaction, and related services.

Arrow’s omnichannel engagement approach enables customers to seamlessly manage design, engineering, supply chain services, and fulfillment—helping speed time‑to‑market. Customers benefit from access to engineering expertise, reference designs, bill of materials (BOM) optimization, lifecycle management, and integration support to move from concept to production more efficiently. At the same time, real‑time pricing, inventory visibility, cost‑optimization tools, and advanced analytics enable smarter supply‑chain decisions, risk mitigation, and compliance for critical applications. A more agile digital foundation also supports faster response to urgent needs and evolving market conditions.

“This transition builds on the trusted relationships our customers value in Japan while expanding how we support them,” said Aiden Mitchell, Arrow’s chief growth officer, global semiconductor. “By combining strong local execution with Arrow’s global platform, we are well positioned as a trusted solution provider—supporting customers and suppliers from product inception through supply chain and go‑to‑market execution.”

As part of the integration, chip1stop.com has been retired, with e‑commerce operations now available on arrow.com as of May 4, 2026. Chip One Stop’s operations and services will be integrated into Arrow, with existing services continuing without interruption.

For more information, visit www.arrow.com.
Hashtag: #ArrowElectronics

The issuer is solely responsible for the content of this announcement.

About Arrow Electronics

Arrow Electronics (NYSE:ARW) sources and engineers technology solutions for thousands of leading manufacturers and service providers. With 2025 sales of $31 billion, Arrow’s portfolio enables technology across major industries and markets. Learn more at arrow.com.