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By K Raveendran Cockroach Janta Party may have begun as satire, but its popularity has exposed something far more serious than a passing joke on the internet. The response it has drawn from government functionaries suggests that the ruling establishment is less disturbed by the humour itself than by the possibility that the satire has […]

The article Cockroach Party Exposes A Deeper Political Unease Among New Generation appeared first on Latest India news, analysis and reports on Newspack by India Press Agency).

Revenue Up 35.4% Year-on-Year API Token Call Volume Surges Nearly 6 Times

HONG KONG SAR – Media OutReach Newswire – 22 May 2026 – Phancy Group Co., Ltd. (“Phancy” or “The Company”, stock code: 6682.HK), a leading general artificial intelligence company, today announced its unaudited consolidated results for the first quarter ended 31 March 2026.

During the period, Phancy achieved revenue of approximately RMB1.458 billion, representing a 35.4% year-on-year increase. Gross profit margin remained at 35.1%. Phancy leveraged its deep expertise in full-stack AI cloud services, to capitalize on the accelerating adoption of localized computing power and strong enterprise demand for AI solutions. The Company achieved robust growth in its core businesses, accelerated product innovation, and secured several major partnerships, sustaining strong operational momentum.

2026 First Quarter Business Highlights:

Unified Enterprise AI Platform Drives Explosive Core Business Growth

Global computing resources remain constrained, while demand for both private enterprise AI deployments and API-based model calls continues to grow rapidly. Phancy’s enterprise-grade AI platform is built on a unified core architecture that seamlessly supports both API calling scenarios and dedicated private deployments. This significantly boosts AI application efficiency and resource utilization. Supported by a mature computing power supply chain developed over many years, Phancy’s deployable computing power resources have increased by over 200%. This enables the Company to effectively meet surging Token demand and consistently deliver stable, high-quality AI services to its customers.

In the first quarter of 2026, API Token call volume surged nearly 6 times compared to the same period in 2025, and already accounted for nearly 40% of the full-year 2025 total. Meanwhile, the Agentic AI business expanded rapidly, with deepening commercial adoption. Orders on hand grew nearly 100% compared to the end of 2025, emerging as a major growth driver for the Company.

AI Technology Iteration Accelerates, Commercialization Beats Expectations

Building on its continued push into digital employee applications and AI empowerment across business units, Phancy has significantly shortened the product development cycle from R&D to commercialization, enhancing overall operational efficiency and customer satisfaction.

As of mid-May 2026, ModelHub XC has completed adaptation and optimization for over 70,000 AI models on domestic chips, achieving more than 70% of its full-year target – well ahead of schedule.

In May, Phancy launched PhanthyMovie, a professional-grade AI video generation platform designed to enhance creativity, control, and stability in video production, enabling standardized and large-scale content creation for the industry.

Leveraging its advanced technology and proven execution capabilities, PhanthyMovie achieved rapid commercial traction. Just days after launch, the Company entered into a strategic cooperation agreement with Huanxi Media, covering approximately US$200 million in AI Token usage. The two parties will also collaborate on the development of a next-generation AI-powered film and television content production platform, further strengthening Phancy’s position in the AI-driven cultural and creative sector.

Core Products Align Closely with Policy Trends, Strengthening Compute-Model Integration

Since May 2026, China’s AI sector has seen a series of positive policy developments focused on computing infrastructure, data element circulation, and open-source compliance governance. Phancy’s core products, including HAMi vGPU and ModelHub XC, are well-aligned with national policy directions and mainstream industry trends.

In terms of computing resource allocation, policies emphasize cross-regional collaboration and broader access to computing power. Phancy’s HAMi vGPU offers unified scheduling and fine-grained resource partitioning, effectively improving utilization rates, optimizing data center energy efficiency, and supporting unified management across multiple chips to boost single-card efficiency.

In data and model governance, the government continues to promote high-quality dataset development and compliance management. ModelHub XC supports multi-model adaptation and optimization, incorporates data traceability and security certification features to help enterprises reduce compliance risks, and uses the EngineX engine for batch adaptation of domestic chips and models. This significantly improves compatibility while enhancing Token output efficiency through targeted model tuning.

Through deep integration of its computing and model layers, Phancy has built a comprehensive “Compute–Model” integrated solution. This addresses key industry needs such as efficient computing utilization, secure data supply, enterprise compliance, and domestic substitution, while strengthening its technological moat. The Company is well positioned to capture policy dividends and industry opportunities, supporting enterprises in their digital and intelligent transformation.

Hashtag: #PhancyGroup

The issuer is solely responsible for the content of this announcement.

About Phancy Group

Phancy Group (6682.HK) is a leading full-stack AI cloud services platform, providing comprehensive solutions for the AI 2.0 era. Our offerings include SageAIOS, HAMi vGPU and ModelHub XC, delivering efficient and scalable AI infrastructure with end-to-end capabilities. We provide a complete solution from heterogeneous compute resource management and optimization to the deployment of intelligent agent models. These solutions empower digital transformation across a wide range of industries, supporting our vision of building a large-scale and efficient “Token Factory.”

Guided by the mission of “AI for Everyone” and positioned as the “Navigator of AI,” Phancy Group is committed to becoming a global leader in Artificial General Intelligence.

The investment is designed to strengthen the chipmaker’s partnerships with foundries, packaging houses, substrate suppliers and server manufacturers that are central to its next generation of AI systems. The programme places Taiwan at the centre of AMD’s effort to scale production of high-performance processors, accelerators and rack-level systems built for increasingly complex AI workloads.

A major focus will be Elevated Fanout Bridge, or EFB, a 2.5D packaging technology intended to improve the speed and efficiency of connections between chip components. AMD plans to use the technology in its sixth-generation EPYC central processing units, codenamed “Venice”, which are being positioned for AI, cloud and high-performance computing deployments.

The move comes as AI infrastructure spending shifts from individual chips towards complete systems that combine CPUs, graphics processors, high-bandwidth memory, networking and software. Advanced packaging has become a critical bottleneck because AI workloads require large volumes of data to move quickly between processors while keeping power consumption and heat within manageable limits.

AMD Chair and Chief Executive Lisa Su said customers were rapidly expanding AI infrastructure to meet rising compute demand. The company is seeking to combine its high-performance computing portfolio with Taiwan’s manufacturing and packaging capabilities to support integrated, rack-scale AI systems.

AMD is working with partners including ASE, SPIL, Powertech Technology, Wiwynn, Wistron, Inventec, Unimicron, AIC, Nan Ya PCB and Kinsus. These companies cover key parts of the supply chain, from advanced packaging and substrates to server assembly and mechanical architecture. Sanmina is also involved in manufacturing support for the company’s Helios platform.

The investment will support both wafer-based and panel-based EFB interconnect development. AMD and Powertech Technology have qualified what they describe as the industry’s first 2.5D panel-based EFB interconnect, a step aimed at improving scalability and production economics for high-volume AI processors.

The technology is expected to help the “Venice” EPYC processors deliver higher interconnect bandwidth and better power efficiency. That matters because data centre operators are increasingly constrained by electricity availability, cooling capacity and rack density, not only by chip performance.

AMD has also begun ramping production of “Venice” CPUs using Taiwan Semiconductor Manufacturing Company’s 2-nanometre process technology in Taiwan. Future production is planned at TSMC’s Arizona facility, extending the supply chain beyond Taiwan while preserving the company’s close reliance on TSMC’s leading-edge manufacturing.

The “Venice” chips will be a central element of AMD’s Helios rack-scale platform, which also includes AMD Instinct MI450X graphics processors, advanced networking and the ROCm open software stack. The platform is scheduled for deployments beginning in the second half of 2026, with AMD describing the opportunity in terms of multi-gigawatt AI infrastructure rollouts.

The strategy puts AMD in a more direct contest with Nvidia, which dominates AI accelerator sales and has built a strong lead through its GPUs, networking, software ecosystem and full-rack systems. AMD’s challenge is not only to deliver competitive silicon but also to prove that it can scale complete AI infrastructure with dependable supply, efficient packaging and broad software support.

AMD’s data centre business has become the company’s main growth engine. First-quarter 2026 data centre revenue reached $5.8 billion, up 57 per cent from a year earlier, driven by demand for EPYC processors and the ramp-up of Instinct GPU shipments. That performance has strengthened investor expectations that AMD can capture a larger share of AI and cloud infrastructure spending.

Taiwan remains critical to that effort because of its concentration of semiconductor expertise. TSMC anchors the foundry side, while packaging, substrate and system-assembly partners provide the manufacturing depth needed to turn chip designs into deployable infrastructure. The concentration also creates geopolitical and supply-chain risks, particularly as governments and companies seek greater resilience across strategic technologies.

As a full-stack self-developed provider of enterprise-grade AI infrastructure (AI Infra) and solutions, QingCloud Technologies Corp. deeply understands enterprise demands and implementation scenarios, and has built end-to-end digital and intelligent solutions. With deep roots in livelihood services, TECSUN SCIENCE & TECHNOLOGY CO.,LTD. boasts integrated capabilities of “Data + Algorithms + Scenarios”, self-developed innovations such as government affairs large models and AI-powered employment services, as well as profound industry customer resources and operational experience. Oriented by solution collaboration, the two parties will combine TECSUN’s scenario-based intelligent applications with QingCloud’s private cloud, information technology application innovation cloud, intelligent computing platform and MaaS services to form solid technological synergy.

Focusing on core sectors including employment, healthcare and government services, the two sides will promote the integrated deployment of employment Agent and intelligent computing platform to achieve precise job matching and intelligent recommendation; advance the implementation of a fusion architecture of contactless medical payment systems and edge AI inference cloud; and accelerate the joint optimization of government affairs large models and intelligent guidance systems in the information technology application innovation cloud environment.

In terms of delivery, the two parties will jointly conduct compatibility tests and performance verification to ensure the compatibility and stability of the joint solutions, and jointly deliver secure, controllable and ready-to-use intelligent livelihood solutions. Meanwhile, they will actively explore the co-construction of regional intelligent computing centers in mature areas to consolidate the computing infrastructure for “AI + Livelihood Services”.

Looking ahead, the two sides will take joint solutions as the anchor, jointly explore the closed-loop operation model of “Urban Livelihood AI Operation Base”, connect the full chain from computing supply, model iteration to service delivery, help elevate the intelligence of urban governance, and jointly build a new engine for livelihood services.

Hashtag: #Tecsun

The issuer is solely responsible for the content of this announcement.

By Nitya Chakraborty This is the season of high level summits. On May 14 and 15, U.S President Donald Trump visited Beijing and had ‘ fantastic’ talks, according to the U.S. President, Chinese media also went overboard explaining the great possibilities of China-US cooperation in political and economic spheres and also how important this was […]

The article Cuba Is Under Siege By USA, But Neither Xi Jinping Nor Putin Taking It With Trump appeared first on Latest India news, analysis and reports on Newspack by India Press Agency).