News related to
energy

Guided by the Central Passport, LANDMARK invites visitors to experience Central anew— from Louis Vuitton’s global spectacle to cultural, dining and seasonal celebrations.

HONG KONG SAR – Media OutReach Newswire – 9 October 2026 – LANDMARK today unveils Destination CENTRAL, inviting local residents and international visitors to rediscover the many sides of Central through the collectible Central Passport. The programme celebrates the district’s long-standing role as Hong Kong’s gateway for arrival, exchange and discovery. Inspired by the spirit of travel, Destination CENTRAL connects experiences across Central, bringing together travel-inspired activations in partnership with Hong Kong Tramways and Asia Miles; district-wide dining privileges; a global spectacle by Louis Vuitton; and THE CHATER, an exclusive dining concept presented by LANDMARK.

Your Passport to Central

Created by LANDMARK, the luggage-inspired Central Passport is a collectible guide bringing together experiences both within LANDMARK and across the wider district into a seamless journey. Inside, a curated map is paired with personal stories and recommendations from people who know Central closely—from tram motormen, singers and public figures to athletes, celebrated chefs and bar founders—inviting visitors to uncover the area’s hidden character.

Available from collection points across the district, the Central Passport can be personalised with stamps from eight designated locations. Visitors who collect any three stamps can visit the Destination CENTRAL Redemption Counter on 2/F, LANDMARK ATRIUM to enter a lucky draw and unlock a surprise gift. Lucky winners stand a chance to receive up to 66,000 Asia Miles—equivalent to a round-trip business-class flight to Japan—alongside photobooth experiences, limited-edition keepsakes and dining vouchers. The Central Passport also includes exclusive dining privileges from more than 40 participating partners, including Lan Kwai Fong and The Murray.

Louis Vuitton at LANDMARK

Following iconic presentations on the Champs-Élysées in Paris, 57th Street in New York and ‘The Louis’ in Shanghai, Louis Vuitton brings the latest chapter of its global series to Hong Kong. Unveiling soon, the Maison will present a monumental mega-art installation at LANDMARK, reimagining its enduring “Spirit of Travel”. Complemented by the pop-up store currently at LANDMARK ATRIUM and the upcoming dedicated Basement Brand Exhibition , the experience offers a captivating glimpse into the world of Louis Vuitton—setting the stage for the highly anticipated Louis Vuitton Maison at LANDMARK.

Transit Through Central’s Changing Landscape

The travel narrative continues with the LANDMARK Tram Station and Heritage Route, created in partnership with Hong Kong Tramways. Together, they offer an interactive look at Central’s transport heritage and evolving urban landscape—from its early harbourfront and trading past to today’s connected city centre. The LANDMARK Tram Station recreates one of the city’s first-generation trams, fitted with authentic archive pieces from Hong Kong Tramways, including a traditional ticket punch, a coin box, driving console and “Dick, Kerr” controller.

A First Class Stop for Dining and Views

Taking the travel theme into hospitality, LANDMARK presents THE CHATER, an exclusive dining concept opening on 6 October, featuring an all-day menu curated by Mandarin Oriental, Hong Kong. Inspired by the elegance and anticipation of a grand station lounge, the new venue brings together Hong Kong and international flavours, with highlights including bubble tea and gourmet quick bites, alongside Pierre Hermé macarons and gelato set to be launched later in the season. The experience will extend to Platform 1889 on 3/F, a first-class railway carriage-inspired feature within THE CHATER’s terrace. Named for the year Sir Paul Chater co-founded Hongkong Land, Platform 1889 pays tribute to a defining moment in Central’s history while offering a prime view of Louis Vuitton’s monumental mega-art installation and the Central skyline.

Halloween Takes Over Central

From 17 to 31 October, Hongkong Land, supported by the Hong Kong Tourism Board and district partners, presents Halloween in Central—a heritage-led celebration that transforms Central’s iconic streetscape into a citywide Halloween playground.

At Statue Square Gardens, South, four large-scale installations set a striking scene: I Am Watching You, a giant eyeball rising over the fountain; The Awakening, a monumental gateway; the photo-ready Coffin Throne; and The Jail, a haunted reimagining of the pavilion.

On Chater Road, the programme begins with Boo-st Your Mood – Pickleball Day in partnership with Pick & Match on 17 October, a wellness-focused afternoon of active fun. This is followed by OPEN by HE.R – Halloween in Central Kick-Off Party on 18 October, bringing live music and high-energy celebrations to the street. Monster Mash Fest – Family Day arrives on 24 October with costumes, face painting, themed bouncy-castle sessions, performances and Halloween treats, before Halloween Day Unleashed closes the programme on 31 October, featuring cosplay, roving characters, themed performances and late-night festivities. Full details are available at https://www.halloweenincentral.com/

“As a key stakeholder deeply rooted in Central, Hongkong Land is delighted to bring Destination CENTRAL to life alongside our district partners, inviting the public to discover the extraordinary charm of Central anew,” said Olivia Luk, General Manager, Marketing, Hong Kong Central, Hongkong Land Limited. “Together with a rich programme of dining privileges and seasonal celebrations, we hope everyone—from daily office workers and local residents to visitors—can shape their own memorable story of Central.”

Exclusive Rewards and Privileges

Destination CENTRAL brings added benefits to every qualifying LANDMARK visit with HSBC-exclusive offers for BESPOKE members. From 28 September to 18 November 2026, eligible BESPOKE members paying with an HSBC Privé Mastercard® or HSBC Premier Mastercard® can receive up to HK$3,000 in BESPOKE Bonus Reward Vouchers, up to 135,000 Bonus BESPOKE Points, and Complimentary Beverage Passes to Platform 1889 at THE CHATER upon registration of cumulative same-day eligible spending.

Terms and conditions apply. For full programme and promotional details, including specific Central Passport mechanisms, please visit https://destinationcentral.hk.

@landmarkhk #LANDMARKHK #DestinationCENTRAL

APPENDIX

Please visit the Destination CENTRAL website at https://destinationcentral.hk for the latest programme details, terms and conditions.

Central Passport Collection & Reward Details (28 September – 18 November 2026)

Other Destination CENTRAL Activities At A Glance

Destination CENTRAL Redemption Gifts

• 66,000 Asia Miles—equivalent to one Cathay Pacific Business Class round-trip ticket to Japan*
• 26,000 Asia Miles—equivalent to one Cathay Pacific Economy Class round-trip ticket to Japan*
• Destination CENTRAL Tram Plush Charm
• Destination CENTRAL Magnet
• Destination CENTRAL Photobooth Experience
• Destination CENTRAL Mini Camera
• Ami Signature Beef Sando
• BaseHall HK$50 Gift Certificate
• THE CHATER HK$50 Gift Certificate

*Based on Cathay Flight Awards – Standard Awards as of 1 September 2026. Terms and conditions apply.

Hashtag: #LANDMARKHK

The issuer is solely responsible for the content of this announcement.

About LANDMARK

LANDMARK represents the epitome of top-tier luxury shopping and lifestyle experiences. Drawing from a rich heritage which began in 1904 – LANDMARK today is the luxury shopping destination of Hongkong Land’s Central portfolio including 4 iconic connected buildings, LANDMARK ATRIUM, LANDMARK ALEXANDRA, LANDMARK CHATER and LANDMARK PRINCE’S. LANDMARK offers approximately 208 of the finest stores and restaurants, all seamlessly linked by pedestrian bridges. From high fashion and accessories to watches and jewellery, from luxury living to beauty and grooming, from international cuisine to authentic gourmet dining, LANDMARK brings the ultimate shopping experience to the discerning customer.

About Hongkong Land

Hongkong Land is a major listed property investment, management and development group. The Group focuses on developing, owning and managing ultra-premium mixed-use real estate in Asian gateway cities, featuring Grade A office, luxury retail, residential and hospitality products. Its mixed-use real estate footprint spans more than 850,000 sq. m., with flagship projects in Hong Kong, Singapore and Shanghai. Its properties hold industry leading green building certifications and attract the world’s foremost companies and luxury brands. The Group’s Hong Kong Central portfolio represents some 450,000 sq. m. of prime property. The Group has a further 165,000 sq. m. of prestigious office space in Singapore mainly held through joint ventures and five retail centres on the Chinese mainland, including a luxury retail centre at Wangfujing in Beijing. In Shanghai, the Group owns a 43% interest in a 1.1 million sq. m. mixed-use project in West Bund, which is due to be completed in 2028. Hongkong Land Holdings Limited is incorporated in Bermuda and has a primary listing on the London Stock Exchange, with secondary listings in Bermuda and Singapore. Hongkong Land is a member of the Jardine Matheson Group.

This represents an improvement over Malaysia’s performance in 2025, when the country received 16 recognitions, including six category wins. The stronger performance in 2026 demonstrates the growing capabilities of Malaysian organisations in implementing energy efficiency and renewable energy solutions.

The recognitions were conferred under the ASEAN Energy Efficiency and Conservation Best Practices Awards and the ASEAN Renewable Energy Project Awards. The Malaysian recipients were recognised for projects involving energy-efficient and green buildings, biogas, solar and micro-hydro, as well as emerging technologies such as green hydrogen, waste-to-energy and battery energy storage systems (BESS).

Prior to stepping onto the regional stage at AEA 2026, these organisations were first recognised for their achievement at the national level through National Energy Awards.

The National Energy Awards (NEA) serves as Malaysia’s platform for identifying and recognising organisations with the potential to compete at the ASEAN level. Selected NEA 2026 winners represented Malaysia at AEA 2026 and presented the country’s sustainable energy achievements and best practices to the region.

PETRA regards this regional recognition as evidence of the ability of Malaysian industries, businesses and institutions to translate the country’s energy transition objectives into practical solutions. It also demonstrates the value of cooperation among the Government, industry and other relevant stakeholders in strengthening Malaysia’s energy ecosystem.

The ASEAN Energy Awards 2026 were presented in Manila, the Philippines, in conjunction with the 44th ASEAN Ministers on Energy Meeting (AMEM) and the ASEAN Energy Business Forum (AEBF).

Malaysia’s performance at AEA 2026 supports the objectives of the National Energy Policy 2022–2040 and the National Energy Transition Roadmap (NETR) to develop a secure, sustainable and inclusive energy system while enhancing the country’s long-term economic competitiveness.

These objectives will also be advanced through the National Energy Efficiency Action Plan 2.0 (NEEAP 2.0) for 2026–2035. The plan targets cumulative energy savings of 815,000 terajoule (TJ) over its 10-year implementation period and is expected to generate approximately RM85 billion in energy savings, attract RM36 billion in private investment and create around 29,000 employment opportunities.

Together with the Energy Efficiency and Conservation Act 2024, NETR and NEEAP 2.0 provide the policy and regulatory foundation to accelerate energy efficiency, encourage investment and innovation, and enhance Malaysia’s energy security and economic competitiveness.

PETRA, together with the Sustainable Energy Development Authority (SEDA) Malaysia and other relevant stakeholders, will continue to work with industry to increase the adoption of energy-efficient practices, expand renewable energy deployment, and facilitate innovation and investment in support of Malaysia’s energy transition objectives.

PETRA once again congratulates all Malaysian recipients for their achievements and for representing the country with distinction at AEA 2026. Their success reflects the progress of Malaysia’s energy sector and reinforces the country’s contribution to a secure, resilient and sustainable energy future for Malaysia and the wider ASEAN region.

Hashtag: #PETRA

The issuer is solely responsible for the content of this announcement.

Su held talks with Young Hyun Jun, Samsung’s vice chairman and chief executive of its Device Solutions division, during a visit to South Korea that also included discussions with SK Hynix chief executive Kwak Noh-jung. The meetings placed high-bandwidth memory, broader DRAM supplies and possible foundry co-operation at the centre of AMD’s efforts to secure capacity for its expanding AI business.

Speaking to reporters in Seoul, Su said AMD continued to explore opportunities with Samsung across both memory and contract chip manufacturing. She described Samsung and SK Hynix as critical partners for AMD’s data-centre ambitions and urged memory producers to add capacity as quickly as possible.

The talks come as shortages across parts of the memory market complicate expansion plans for chip designers and data-centre operators. Demand for high-bandwidth memory, or HBM, has surged because AI accelerators require substantially greater memory bandwidth than conventional computing processors, while strong demand has also tightened supplies of standard DRAM products.

Su said the supply environment remained tight and AMD was working with customers to optimise their memory requirements so available capacity could support more computing. She said the company had built a strong supply chain but was working with suppliers to accelerate its expansion.

AMD expects demand for AI computing to remain elevated for several years and plans to increase chip supply substantially in 2027. Su said during a stop in Taiwan this week that the company had extended its capacity-planning horizon from one or two years to between three and five years as it works with manufacturing partners.

That planning encompasses advanced wafers, packaging, substrates and memory, all of which have become potential constraints as companies race to build AI infrastructure. AMD has been expanding its Instinct accelerator business as it competes with Nvidia for spending by cloud providers and other large data-centre customers.

Samsung already occupies an important position in AMD’s supply plans. The companies signed a memorandum of understanding in March covering next-generation AI memory and computing technologies, with Samsung designated a primary HBM4 supplier for AMD’s Instinct MI455X graphics processor.

Their agreement also covers advanced DRAM products for AMD’s sixth-generation EPYC processors, code-named Venice, and its Helios rack-scale AI platform. Samsung has supplied HBM3E memory for AMD’s MI350X and MI355X accelerators, extending a technology relationship between the companies that spans graphics, mobile and computing products.

HBM4 is particularly important to the next generation of AI hardware because increasingly powerful accelerators need faster transfers of enormous datasets while controlling energy consumption. Memory manufacturers have consequently directed more investment towards HBM, leaving capacity across other memory categories under pressure.

Samsung has been seeking to increase its position in the high-margin HBM market while SK Hynix remains another major supplier to AI chip developers. Strong AI demand has supported memory prices and earnings, though the pace of conventional DRAM price increases is expected to moderate after steep gains earlier this year.

AMD’s discussions with Samsung could also extend beyond memory. Their March agreement provided for talks on a possible foundry partnership under which Samsung could manufacture future AMD products. Su said on Wednesday that AMD was continuing to examine opportunities in that area, without announcing a manufacturing contract.

The possibility would give AMD another potential production option as advanced semiconductor capacity remains heavily sought after. Taiwan Semiconductor Manufacturing Co remains a central manufacturing partner for AMD, and Su met suppliers in Taiwan before travelling to South Korea as part of her capacity discussions.

Under the contract, all trains designed and manufactured by Alstom for Hanoi’s urban rail lines will be new-generation five-car trains, offering advanced features in design, operational efficiency and safety. The aluminium car body reduces axle load, saving energy and reducing track wear. The wide-body design maximises interior space and increases passenger capacity. The train runs fully automated and driverless, at GoA4, the highest grade of automation. The modern braking system combines regenerative and disc brakes, ensuring safety while recovering energy during braking.

The first 83 trainsets will be designed and manufactured at Alstom’s Valenciennes Petite-Forêt site in France, one of Alstom’s centres of expertise for metros. In addition to supplying the 83 complete trainsets, Alstom will provide technology, engineering expertise, tooling support and key components, enabling Vingroup to develop local capabilities to manufacture and assemble the next 117 trainsets in Vietnam.

The contract between Vingroup and Alstom lays an important foundation for strengthening Vietnam’s self-reliance and modernising its rail industry ecosystem. The partnership also opens opportunities to establish a long-term industrial partnership and progressively expand Vietnam’s participation in the global value chain.

Mr. Martin Sion, Alstom CEO, said:“This agreement is a major milestone for Alstom in one of the fastest-growing mobility markets in the world. By combining Alstom’s global expertise with VINGROUP’s industrial strength and long-term vision, we are creating a unique partnership that supports both the expansion of Hanoi’s metro network and the development of local rail capabilities. This agreement also demonstrates the strength of French rail technology and reinforces Alstom’s position as a trusted partner for major mobility projects across the region.”

Mr. Nguyen Viet Quang, Vice Chairman and CEO of Vingroup, said: “High-speed rail, urban rail, bridges, ports, logistics and other next-generation transport infrastructure are among the key areas under Vingroup’s Infrastructure pillar. Our strategy is to connect world-class international resources, technologies and expertise with the strong execution capabilities of Vingroup’s ecosystem, enabling us to contribute to the development of infrastructure platforms with long-term significance for Hanoi and Vietnam.”

Vingroup is the general contractor for Hanoi’s metro projects through its subsidiary Vinhomes. The partnership with Alstom aims to provide rolling stock for Hanoi’s urban rail projects while progressively developing local capabilities, enabling Vingroup to contribute over the long term to the development of the city’s urban rail network.

Under Hanoi’s Capital Master Plan with a 2045 vision, the city’s urban rail network is planned to reach 979 kilometres, comprising 18 lines and serving as the backbone of the city’s public transport system.

With a total planned length of nearly 1,000 kilometres, the network would also represent one of the largest urban rail development programmes in Southeast Asia, helping reduce traffic congestion, mitigate environmental pollution and improve the quality of life for Hanoi’s residents.

Hashtag: #Vingroup

The issuer is solely responsible for the content of this announcement.

About Vingroup

Established in 1993, VINGROUP is one of the leading diversified private economic groups in the region, operating across six core sectors: Industrials & Technology, Real Estate & Services, Infrastructure, Green Energy, Culture and Social Enterprises.

For more information, please visit: www.vingroup.net/en.

About Vinhomes

Vinhomes is Vietnam’s leading real estate brand, pioneering the development of large-scale, high-quality urban communities with professional planning, comprehensive amenities and a modern, green and clean living environment, helping shape new lifestyles for Vietnamese residents.

Alongside 32 urban developments currently in operation across the country, Vinhomes continues to focus on developing new-generation mega and super-scale urban developments of leading regional scale and stature, aspiring to create “some of the world’s most desirable places to live” while contributing significantly to the transformation of Vietnam’s urban landscape.

For more information, please visit: https://vinhomes.vn/vi.

About Alstom

Alstom is the pure rail leader, committed to making rail the backbone of sustainable transportation. We design and deliver a complete range of future-ready solutions – from high-speed and regional trains to metros, monorails, trams, turnkey systems, end-to-end services, infrastructure, signalling and digital rail solutions. With 87,800 people in 61 countries, Alstom brings together global expertise and multi-local presence to make every journey smarter, cleaner and more enjoyable. Together with our partners and customers, we realise the power of rail. Listed in France, Alstom generated revenues of €19.2 billion for the fiscal year ending 31 March 2026.

For more information, please visit www.alstom.com

Upgrades improve print quality, strengthen security and simplify ID card issuance

SINGAPORE – Media OutReach Newswire – 6 October 2026 – HID, a global leader in trusted identity solutions, is rolling out enhancements across its FARGO^® DTC ID card printers, including the DTC1250e, DTC4500e and DTC1500 models, to help organizations issue secure, professional-quality ID cards faster, with less IT support and the ability to easily scale as needs evolve.

Organizations that issue ID cards — from schools and healthcare systems to government offices, corporate campuses and others — need printers that are easy to operate, produce consistently high-quality credentials and keep pace with growing security requirements. The latest enhancements address each of those priorities.

Built to Print: Faster, Sharper Output and Stronger Security
Speed and reliability are essential for high-volume credential issuance. Printing more cards in less time with fewer interruptions, these printers have been updated with newer, faster hardware and electronics platforms. Support for high-capacity ribbons also streamlines the issuance workflow and maintains high productivity, reducing reloads and lost time. For front-desk and HR staff who issue dozens of badges a day, this means shorter lines and less time waiting on a stalled print job.

“We’ve been at this for a long time. For more than three decades, organizations have trusted us to power their ID badging programs,” said Apryl Erickson, VP and Head of FARGO. “With thousands of printers in the field worldwide, we’re excited to build on that legacy by delivering enhanced solutions that provide greater value to our end users and support their mission-critical issuance processes.”

Card quality matters just as much as issuance speed. With 300 x 600 dpi resolution, an enhanced color profile and adjustable K-panel printing, organizations benefit from having professional-quality ID cards that look sharper, have crisper text, cleaner logos and more accurate color.

When an organization issues credentials, they need to enhance card security and safeguard cardholder data. As such, all DTC printers offer enhanced AES-256-GCM encryption and resin scramble data protection. On the DTC1500 and DTC4500e, a built-in, customizable watermark overlay adds a layer of security at no added cost.

Built to Last: Secure, Reliable, Sustainable Performance and Less Downtime
Reliable and sustainable, the enhancedDTC printers are backed by three-year product warranties, provide ongoing printer health monitoring and are specifically engineered for efficient energy use.

Organizations also need to keep operator maintenance low. An integrated diagnostic utility and Color Assist tool are now built directly into the printer driver, so common issues can be identified and resolved without a support call. An optional OLED SmartScreen on the DTC1250e further simplifies day-to-day operation, helping non-technical staff be productive from day one with no IT ticket required.

Built for More: Room to Grow Without Starting Over
Programs rarely remain static, and organizations need to scale as their needs grow without incurring the cost of new hardware. FARGO DTC printers offer field-upgradable dual-side printing and encoding options that let organizations start with what they need and add capabilities later, without having to buy new base hardware, as programs expand.

These upgrades build on more than 30 years of DTC printing expertise. The portfolio also integrates with HID’s broader ecosystem for access control and identity management, helping organizations expand their credentialing programs as needs evolve. The DTC1500 and DTC4500e are also compatible with FARGO Connect™, a secure, cloud-based card printing platform that provides real-time fleet visibility.

The enhanced DTC printer portfolio is commercially available now. Product availability for enhanced FARGO DTC1250e and DTC4500e printers is slated for late October/early November, varying by region. Enhanced FARGO DTC1500 units will follow later in Q4 2026.

Building on these enhancements, HID plans to further expand the FARGO DTC portfolio later this year with a streamlined, single-sided printer designed for organizations with lower-volume issuance needs. It will not be available in the United States and Canada. It will be offered only in select regions outside these markets. The new model will bring the same reliability and ease of use while providing an accessible entry point into the broader FARGO portfolio.

FARGO printers are available through HID’s partner and distributor network.

Stay Connected with HID

Visit our Media Center, read our Industry Blog, and follow us on Facebook, LinkedIn and X (Twitter).
Hashtag: #HID #FARGO #TrustedIdentity

https://www.hidglobal.com/
https://www.linkedin.com/company/hid-global
https://twitter.com/hidglobal
https://www.facebook.com/hidglobal

The issuer is solely responsible for the content of this announcement.

About HID

HID powers the trusted identities of the world’s people, places and things. We make it possible for people to transact safely, work productively and travel freely. Our trusted identity solutions give people convenient access to physical and digital places and connect things that can be identified, verified and tracked digitally. Millions of people around the world use HID products and services to navigate their everyday lives, and billions of things are connected through HID technology. We work with governments, educational institutions, hospitals, financial institutions, industrial businesses and some of the most innovative companies on the planet. Headquartered in Austin, Texas, HID has over 4,500 employees worldwide and operates international offices that support more than 100 countries. HID is an ASSA ABLOY Group brand. For more information, visit www.hidglobal.com.

© 2026 HID Global Corporation/ASSA ABLOY AB. All rights reserved. HID, the HID Blue Brick logo and the Chain Design are trademarks or registered trademarks of HID Global, ASSA ABLOY AB, or its affiliates(s) in the US and other countries and may not be used without permission. All other trademarks, service marks, and product or service names are trademarks or registered trademarks of their respective owners.

The agreement gives Qualcomm access to technology Huawei has presented as an alternative route to higher semiconductor performance when conventional transistor shrinking becomes harder and more expensive. It also marks an important commercial endorsement of Huawei’s expanding patent portfolio as the company seeks a larger role in global AI and computing markets.

Huawei and Qualcomm said the arrangement includes cross-licences to their patent portfolios across multiple technology fields. Qualcomm will separately purchase certain Huawei patents registered in the United States covering computing, AI, networking and other technologies. That purchase remains subject to required regulatory approvals.

Financial terms and the duration of the agreement were not disclosed. Huawei said completion of the transaction would lift the cumulative value of its patent licensing agreements above $6.9 billion. The company has said its intellectual-property licensing operation has generated positive revenue since 2021.

LogicFolding forms part of Huawei’s Tau Scaling Law, a semiconductor design framework unveiled in May. Rather than depending solely on geometric scaling — making transistors progressively smaller — the approach seeks to reduce the time required for signals to travel through chips and electronic systems.

Huawei says LogicFolding can shorten critical signal paths by reorganising circuits across vertically integrated layers. The company argues that compressing signal-propagation delay can raise effective transistor density and improve performance and energy efficiency without relying entirely on successive advances in lithography.

The technology has particular strategic importance for Huawei because US export controls have restricted its access to some advanced semiconductor equipment and technologies. China-based chipmakers cannot obtain the most advanced extreme-ultraviolet lithography systems made by ASML, complicating efforts to manufacture chips using leading-edge processes through conventional methods.

Huawei has therefore increasingly emphasised architecture, packaging, interconnection and system-level optimisation as ways of extracting more computing performance from available manufacturing technology. LogicFolding is one element of that effort, although Huawei’s performance claims and longer-term projections remain subject to commercial-scale validation.

Huawei has already introduced the architecture in its latest Kirin processors. The Kirin 9050 Pro used in the Mate XT 2 foldable smartphone incorporates LogicFolding, providing an early commercial application of the design approach. Huawei has also outlined plans to extend the underlying method beyond mobile processors towards AI accelerators and other high-performance computing systems.

The patent arrangement does not mean Qualcomm is adopting Huawei’s complete chip architecture in its products. Patent licensing provides legal rights to use covered inventions under agreed terms, while individual product designs, manufacturing decisions and implementation choices remain separate. Neither company disclosed which Qualcomm products, if any, could eventually incorporate technologies covered by the LogicFolding patents.

The broader agreement also deepens a long-running intellectual-property relationship between the companies. Huawei made its first patent-licensing payment to Qualcomm in 2001, while the new pact is their first licensing agreement to encompass 5G technologies.

John Han, executive vice-president and general manager of Qualcomm Technology Licensing, said the agreement recognised Huawei’s continuing innovation and intellectual property in 5G and other technology fields. He also said it reaffirmed recognition of Qualcomm’s 5G technology and its standard-essential-patent licensing programme.

Huawei chief intellectual property officer Alan Fan said the agreement demonstrated the value of Huawei’s innovations while recognising Qualcomm’s foundational contributions to modern communications technology. Both companies said their licensing practices were intended to be consistent with fair, reasonable and non-discriminatory principles.

The deal comes as Qualcomm broadens its business beyond smartphone processors into personal computers, automotive systems, networking and data-centre computing, areas where efficient AI processing and high-speed interconnects are increasingly important.

Qualcomm’s licensing business remains central to its model, with the company saying its portfolio contains 200,000 granted and pending patents across more than 100 countries and jurisdictions, including foundational cellular and AI inventions.

Richard Yu joined Huawei in 1993, working on early developments like the first-generation program-controlled switch and participating in the establishment of Huawei’s wireless communications business, which started with GSM. Over the past decade, Yu has led Huawei’s consumer business with the vision to deliver a seamless AI life experience to all consumers across five key scenarios: HIMA-powered Smart Travel, HarmonyOS Office, Smart Home, Fitness & Health, and Entertainment, which he said is also the long-term strategy for Huawei’s consumer business over the next 10 years.

Between 2007 and 2025, Huawei invested more than CNY1.8 trillion into R&D shifting from roughly 10% of annual revenue in early years to over 20% recently. Huawei has continued to increase investment into the core technologies of the ICT domain and basic research, which has translated into robust core capabilities, extensive intellectual property, and a vast patent portfolio, and helped with achieving a series of breakthroughs in technological innovation.

The Mate 90 series smartphones Huawei just launched come with the latest Kirin 9050 Pro chip. The overall device performance is 31% higher than the previous generation. The Balong modem, image sensor processor (ISP), mobile security processor (MSP), Lingxi CPU, Maleoon GPU, and the NPU that adopts Huawei’s Da Vinci architecture for AI processing are all designed by Huawei. They offer higher energy efficiency and deliver much-improved overall system-level performance.

Even though Yu admitted that Huawei has limited access to advanced semiconductor processes, Huawei recently made a new breakthrough in the semiconductor domain – the LogicFolding technology under the Tau Scaling Law. Unveiled by He Tingbo, head of Huawei’s Semiconductor Business Department this May, this technology vertically stacks the logic layers of chips and restructures the circuit layout through inter-layer high-density interconnect to shorten critical paths and reduce latency. This technology was adopted on Kirin 9050 Pro chip, which shows very strong AI processing power. The Mate 90 series powered by this chip can run a 30B MoE on-device AI model.

In the AI domain, Yu talked about the Ascend compute foundation that Huawei provides, by remarking Huawei’s large models called openPangu, AI capabilities for intelligent driving, and HarmonyOS Celia, which is similar to Gemini in the Google Android ecosystem. Huawei is also using AI to improve the O&M of communications network equipment. By combining AI computing power with domestic open-source large models, Huawei’s vision is to help enterprises and industries around the world to become more productive and bringing more convenience to everyone.

In the past years, Huawei has launched a broad series of products and solutions, including smartphones, PCs, tablets, wearables, TWS audio products, Smart TVs, home routers, smart home control solutions, as well as intelligent electric vehicles together with partners. Underlying these products and solutions are Huawei’s chip hardware platform and HarmonyOS – another OS ecosystem after iOS from Apple and Android from Google that Huawei developed to support all the smart devices and smart hardware across all scenarios.

Development of HarmonyOS began in 2019. Before that, Huawei was a major contributor to the Android community as well as the entire Android ecosystem. Now, more than 90 million devices, including smartphones, PCs, and tablets, currently run on HarmonyOS 6 and HarmonyOS 7. This figure is expected to hit the 100 million mark by the end of this year. The number of apps and services in the HarmonyOS ecosystem has already exceeded 450,000. Its global registered developer count has reached 11 million, and Huawei now has over 23,000 app innovation partners. Expressing his special thanks to all partners and developers for their trust and support, Yu also pointed out that Huawei is considering gradually bringing HarmonyOS to the global market in the future.

Globalization is another topic of the conversation. Yu mentioned that Huawei had very good collaboration with many companies from the US, Europe, Japan, South Korea, and Taiwan, delivering huge business value and benefits to those partners. When it comes to the difficulties that Huawei overcame since 2019, Yu said that relying on homegrown technologies and capabilities, Huawei gradually designed its own operating system and developed basic tools and software by themselves, putting a domestic supply chain in place. In 2023, Huawei started to manufacture the chips used by smartphones domestically again. With these chips and HarmonyOS, and by relying on China’s domestic supply chain, materials, and process nodes, Huawei has basically gotten rid of the dependence on US technologies.

While Huawei’s global market share was once No. 1, nowadays it only sells several million units of smartphones outside China every year. However, Yu revealed that Huawei is trying to return to the overseas market step by step.

Taking wearables as an example, Huawei is No. 1 in terms of the market share both in China and globally. Other innovative products such as TWS earphones, are also growing fast and have reached No. 1 in many countries. While Huawei’s tablet and PC business was greatly affected after it was denied access to Windows and Intel x86 chips, the HarmonyOS-based tablets are now performing strongly. Another example would be CPE, which is a mobile router that provides connectivity to the unconnected in remote and rural areas. These products are also very well received across many regions outside China, helping more people connect to the rest of the world and live better lives.

Question: Both the Huawei XT 2 and the two most advanced models of the Mate 90 series use a LogicFolding chip. Will LogicFolding chips be used for more phones in the future? We understand that Huawei’s chip production capacity is still limited. Huawei has launched SuperPoDs, and AI infrastructure is a huge business. They are both very important in China. How do you secure a larger share of the chip supply internally?

Richard Yu: We started introducing the chip that adopts the LogicFolding technology powered by the Tau Scaling Law to the Mate XT 2 tri-fold phone. To answer your question, yes, more of our phones will definitely use these LogicFolding chips in the future.

Currently, the production capacity for advanced semiconductors in China still cannot meet the rapidly growing demand. Huawei’s Ascend chips for the AI domain also use such capacity. But we have developed a requirement plan, which also covers the chip requirements of smartphones.

The sharp price increase for memory components over the past two years has somewhat limited the smartphone sales volume. Even though the production capacity remains tight right now, generally it is sufficient to meet our market shipment needs.

We hope that production capacity will ramp up in China’s semiconductor industry so that we can manufacture more advanced products for consumers in the Chinese market as well as the overseas market in the future.

To read the full Q&A session:
https://www.apmultimedianewsroom.com/multimedia-newsroom/continuous-innovation-securing-our-competitive-edge-through-technological-breakthroughs

Hashtag: #Huawei

The issuer is solely responsible for the content of this announcement.

By Ashok Nilakantan Ayers NEW YORK: As the United States enters the final month before the November 3 midterm elections, both parties are confronting an increasingly fluid political landscape. Republicans hold the White House, the Senate and the House of Representatives, but history has rarely been kind to governing parties in midterm years. Democrats, meanwhile, […]

The article Midterm 2026: An Election Shaped By Uncertainty, Power And Political Headwinds appeared first on Latest India news, analysis and reports on Newspack by India Press Agency).