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By Asad Mirza In today’s fractured world, fissures caused mostly by the ongoing Trumpomania, every nation is working post haste to forge new alliances particularly focussed on trade. The best example of this is the India-EU partnership FTA, to be formalized on January 27.. The enhanced partnership is going to eliminate tariffs on more than […]

The article India-EU FTA Gives A Strong Political Message Of Europe To Trump appeared first on Latest India news, analysis and reports on Newspack by India Press Agency).

Bringing together local and overseas innovation talents and leaders to deepen cross-border, cross-campus collaboration

HONG KONG SAR – Media OutReach Newswire – 27 January 2026 – Hong Kong Science and Technology Parks Corporation (HKSTP), together with 15 local tertiary institutions, marked a major milestone as Hong Kong Techathon+, the city’s largest international intercollegiate innovation and technology (I&T) annual event, celebrated its 10th anniversary. The Hong Kong Techathon+ Finale was successfully held recently (on 24 January) at Hong Kong Science Park. The team “Cresento” from The Hong Kong University of Science and Technology won the Gold Award in the category of Trusted AI and Data Science under the Local Track (Open Group) as well as the Best Presentation Award voted by the audience.

In parallel, the Global University Innovation Network (GUIN), jointly established by HKSTP and its 15 local tertiary institution partners, convened its inaugural forum on 23 January. The forum brought together GUIN member representatives and academic I&T leaders for in-depth exchanges on innovation and entrepreneurship ecosystem development, further strengthening Hong Kong’s position as an international I&T and talent hub.

Hong Kong Techathon+ is co-organised by HKSTP and 15 local tertiary institutions, including: City University of Hong Kong, Hong Kong Baptist University, Hong Kong Metropolitan University, Hong Kong Shue Yan University, Lingnan University, The Chinese University of Hong Kong, The Education University of Hong Kong, The Hang Seng University of Hong Kong, The Hong Kong Polytechnic University, The Hong Kong University of Science and Technology, The University of Hong Kong, Tung Wah College; and three institutions under the Vocational Training Council – The Technological and Higher Education Institute of Hong Kong, Hong Kong Institute of Vocational Education, and Hong Kong Institute of Information Technology.

Record-high International Participation Highlights Hong Kong’s Role as a Hub for Talent, Markets and Opportunity

This year’s Techathon+ attracted enthusiastic participation from both local and overseas universities, Approximately 1,900 participants formed over 470 teams. Notably, 215 overseas teams joined, underscoring the event’s growing international appeal.

Following rigorous selection, 172 teams advanced to the finale, including 122 local teams and 50 overseas teams from Australia, Brazil, Chinese Mainland, Japan, Kazakhstan, Malaysia, Portugal, Singapore, the Republic of Korea, Taiwan, the UK, and the US. Kazakhstan, Japan, Korea and the UK participated for the first time through their university representatives, further demonstrating Techathon+’s reach as an international platform for I&T exchange.

A Decade of Growth: From a Local Challenge to One of Asia’s Major Inter-University I&T Platforms

HKSTP Chief Executive Officer Mr Terry Wong said: “Since its launch in 2015, Hong Kong Techathon+ has grown from a local challenge to one of Asia’s largest intercollegiate I&T events — driving creativity and collaboration while creating international impact. Techathon+ brings together outstanding young talents across tertiary institutions, turning ideas into innovative solutions that respond to societal needs and carry strong potential for real-world application. The platform has expanded the global pipeline of innovators and entrepreneurs, reinforcing Hong Kong’s role as a hub connecting talents, markets, and opportunities, and writing the next chapter of Hong Kong’s I&T story.”

Beyond a Competition: A Comprehensive “Soft-landing” platform for Entrepreneurship

Hong Kong Techathon+ is more than a university innovation competition. Over the past decade, the platform has engaged over 9,000 participants, nurturing innovative talents and supporting the growth of startups.

Non-local teams also participated in a four-day immersive programme, featuring I&T ecosystem seminars, mentorship, investor matching, visits at Hong Kong Science Park, and tours to Chinese Mainland I&T bases, helping participants explore market expansion opportunities across the Greater Bay Area.

HKSTP also invites selected high-potential finalist teams and winners to join its Ideation Programme, offering up to HK$100,000 in seed funding (along with support aligned with participating universities’ startup programmes), free co-working spaces, access to advanced technology resources and professional mentorship. Through HKSTP’s incubation and industry networks, teams are supported from prototype development to sustainable startups operations – scaling progressively and building international impact.

Amazon Web Services (AWS) is the exclusive Technology Enabler for the 10^th Edition of Hong Kong Techathon+, providing participating startups with access to leading cloud and artificial intelligence technologies and platforms. Through this collaboration, AWS offered competing teams technology resources in generative AI and machine learning, professional technical support, and workshop to accelerate innovation and drive Hong Kong’s development as an international I&T hub.

Inaugural GUIN Forum: Deepening Global University Innovation Collaboration

The first Global University Innovation Network (GUIN) Forum was successfully held on 23 January at Hong Kong Science Park, bringing together GUIN member institution representatives and I&T experts. The forum focused on three key areas:

• Exploring strategies for university-industry technology transfer collaboration to achieve win-win innovation outcomes
• Examining the Greater Bay Area as a hub for international innovation collaboration, including opportunities for research commercialisation and cross-border partnership, and
• Strengthening global collaboration networks through actionable pathways.

Speakers included Dr Tony Raven, former CEO of Cambridge Enterprise; Professor Poh Kam Wong, Emeritus Professor at National University of Singapore; and Dr Alwin Wong, Chair of the Association of Technology Transfer Professionals (ATTP), among others.

Co-founded last year by HKSTP and 15 local tertiary institution partners with support from multiple overseas institutions and partners, GUIN aims to bring together leading minds to advance international collaboration in innovation and entrepreneurship, reinforcing Hong Kong’s role as a global talent and innovation hub.

In his welcome address at the forum, Mr Terry Wong, Chief Executive Officer of HKSTP remarked: “We are building GUIN into a ‘global platform for innovation exchange and incubation’ — sharing knowledge, co-creating initiatives, and connecting startups with campus incubation resources and markets worldwide to turn concepts into tangible outcomes.”

Since last summer, HKSTP and university partners have launched the Theme-based Global Incubation Programmes under GUIN with three initiatives currently underway focusing on dentistry, visual technology, and the circular economy. The inaugural ” Global Hub for Future Dentistry” programme has attracted 40 top applicants worldwide. Additional thematic incubation programmes are in preparation, and GUIN members and partner organisations are welcomed to co-develop this expanding international collaboration.

The 10^th Edition of Hong Kong Techathon+ Partial Awards List:

Local Track (Student Group)

Local Track (Open Group)

Global Track

*Winner of Best Presentation Award voted by the audience.

Hashtag: #HKSTP

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UABBHK 2025 transformed traditional architectural exhibitions into a dynamic civic performance, positioning artificial intelligence (AI) not as a tool, but as a platform to co-create ethical, inclusive, and human-centred futures. Through immersive installations, public workshops, and experimental formats, UABBHK 2025 invited audiences to participate in the design of the city — in real time.

“The Biennale has not only showcased the possibilities of design in the AI era, but also activated a civic platform where architecture, technology and public imagination intersect,” said Ar. Allen Poon, Chairman of The Hong Kong Institute of Architects Biennale Foundation, during the ceremony. “Today’s conclusion marks both a milestone and a beginning — a new phase of creative exploration among Hong Kong, Shenzhen and the world.”

Exhibition Highlights: Tech Meets Imagination

UABBHK 2025 unfolded across two venues, Oil Street Art Space (Oi!) and the newly opened East Kowloon Cultural Centre (EKCC), showcasing 25 curated exhibits by architects, artists, researchers, and technologists from Hong Kong and beyond. Teams from 10+ regions, including Chinese Mainland, Hong Kong, Taiwan, as well as Australia, Austria, Italy, Japan, Singapore, the Netherlands, the UK, and the USA, explored how AI can be integrated into architectural thinking, spatial storytelling, and participatory design. Among the highlights were 4 video screening works that extended the exhibition’s themes through cinematic and documentary perspectives, addressing topics such as displacement and homecoming, the entanglement of code and culture, and speculative futures shaped by collective memory and student-led design fictions. Interactive installations like Prompt[Pond]ering, Sentient Mirror, and Collaborative Ephemeral Pavilion invited audiences to co-design spaces through AI-driven interactions. Works such as LANdLine Project and Flower Market Imaginaries grounded these future-facing visions in Hong Kong’s unique community and cultural context.

“In curating UABBHK 2025, we imagined AI not as a threat, but as a collaborator — a partner in rehearsing the future of our cities,” shared by Dr. Jimmy Ho and Ar. Aron Tsang, Lead Curators of UABBHK 2025. “We are proud to have created a platform that enables technology to be tangible, and civic imagination visible.”

Extending Impact: Public Programmes on Innovation & Collaboration

To extend the UABBHK 2025’s engagement beyond the galleries, two flagship public programmes were launched to bring AI and urban thinking into action: the ArchiTech Hackathon and the Hetao Vision: AI Video Competition.

ArchiTech Hackathon: Bridging Architecture and AI

Held earlier on the 24 January morning and co-hosted with Google Developer Group Hong Kong (GDGHK), the ArchiTech Hackathon was a first-of-its-kind 3-hour collaborative event that brought together 40 architects, developers and students — half from the HKIA Young Architects Group (YAG) and half from GDGHK — to explore how AI can support architectural workflows. The participants learned to use Google’s Gemini model and no-code platforms to build AI agents for architectural design code compliance.

Led by Mr. Frankie Wu from GDGHK, Ms. Adeline Chan and Ar. Owen Lam, Executive Curators of UABBHK 2025, the event embodied UABBHK’s vision by fostering cross-disciplinary collaboration between the tech and design communities, showcasing AI as a practical and imaginative tool for the built environment.

The winning team is Mr. Eric Chan and Ar. Toby Chiu. They successfully built the AI ​​agent for the competition in an astonishing time of 3 minutes, 56.32 seconds within a 60-minute timeframe, and was able to answer 10 questions, as required by the competition, completing the complex professional architect exam questions with 90% accuracy under four minutes.

Hetao Vision: Innovative AI Video Competition

Also announced during the ceremony were the winners of the Hetao Vision AI Video Competition, which invited creators to imagine the future of the Hetao Shenzhen-Hong Kong Science and Technology Innovation Co-operation Zone (HSITP). All entries were required to be fully AI-generated — both visually and aurally — using tools such as Runway, Pika Labs, Suno, and Udio.

The competition explored how AI can democratise futurology, letting creators of all backgrounds envision interconnectivity, innovation, and inclusiveness across the “one river, two banks” vision of Hetao.

The winning video,titled 深港河脈：一河兩岸的科創樞紐宏圖(Shenzhen-Hong Kong River Network: A Grand Vision for a Science and Technology Innovation Hub Across Both Banks) by Mr. Zhang Xiaoshan, was praised for utilising AI to create a convincing narrative of a cross-border innovation hub, demonstrating a profound understanding of the development of the Hetao area. Two additional finalists were also recognised for their distinctive storytelling and technical creativity.

A public screening of the shortlisted videos will be held in the Hetao Science and Technology Innovation Centre, in February 2026, allowing the public to reflect on the role of AI in imagining future urban life.

What’s Next: Visit UABBSZ and Explore the Living Archive

UABBHK 2025 will continue its journey in the Shenzhen & Hong Kong Bi-City Biennale of UrbanismArchitecture (Shenzhen) (UABBSZ) from January to March 2026. Whether you participated in the Hong Kong Edition or missed it, we warmly welcome you to visit the parallel venue of UABBSZ, at the Shenzhen Hetao Science and Technology Innovation Centre. Come and view the selection of UABBHK 2025 exhibits, continuing the creative dialogue and collaboration between Hong Kong and Shenzhen.

In addition, UABBHK 2025’s ideas and output will remain accessible through a dedicated digital gallery website and a forthcoming archive booklet, both will preserve the curatorial vision, exhibited works, and public interactions from this edition. These resources will serve as an open, living archive — a springboard for future conversations across architecture, AI, and urban futures.

Hashtag: #UABBHK

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About The Hong Kong Institute of Architects Biennale Foundation

The Hong Kong Institute of Architects Biennale Foundation is a non-profit making organisation established and incorporated in 2014 for charitable purposes. The objects for which the Biennale Foundation is established are:

• To promote creativity and advance the understanding, appreciation and interest of architectural and design excellence
• To encourage cross-border and cross-disciplinary dialogue and collaboration among creative professionals from Hong Kong, other parts of the Greater China region and overseas
• To support art, design, architectural and cultural education for students and youth, the community, and policy makers
• To create a favourable environment for study, research and experimentation of design, art and architectural works in an exhibition scale
• To energise and revitalise specific sites of interests by introduction of cultural and creative events

About the Cultural and Creative Industries Development Agency

The Cultural and Creative Industries Development Agency (CCIDA), formerly known as Create Hong Kong (CreateHK) since 2009, was established in June 2024. CCIDA is a dedicated office under the Culture, Sports and Tourism Bureau of the Government of the Hong Kong Special Administrative Region (HKSAR Government) to provide one-stop services and support to the cultural and creative sectors with a mission to foster a conducive environment in Hong Kong to facilitate development of the arts, culture and creative sectors as industries. CCIDA’s strategic foci are nurturing talent and facilitating start-ups, exploring markets, promoting cross-sectoral and multi-disciplinary collaboration, promoting industrialisation of the arts, culture and creative sectors under the industry-oriented principle, and fostering a creative atmosphere in the community, thereby reinforcing Hong Kong as Asia’s creative capital and our positioning as the East-meets-West centre for international cultural exchange.

Alibaba Cloud and NVIDIA as Key Technology Partners. Usher in a New Era of Industrial AI.

HONG KONG SAR – Media OutReach Newswire – 26 January 2026 – AsiaInfo Technologies Limited (“AsiaInfo Technologies” or the “Company”; HKEX stock code: 01675), a leading provider of software products, solutions, and services, and ABB Robotics jointly established the “Embodied Intelligence Laboratory” and held its inauguration ceremony at AsiaInfo Plaza in Beijing on 25 January.

Tian Suning, Chairman of AsiaInfo Technologies, and Dr. Ouyang Ye, Chief Executive Office and Chief Technology Officer of AsiaInfo Technologies, together with Han Chen, Vice President of ABB Group and President of ABB Robotics China, jointly held an unveiling ceremony for the laboratory. Li Li, Vice President of the Government-Enterprise Business Unit at Alibaba Cloud Intelligence Group, attended the ceremony as key technology partners, witnessing this milestone that ushers in a new phase of integration between Physical AI technologies and the real economy.

ABB Robotics is one of the world’s leading robotics suppliers, offering a comprehensive and integrated portfolio that includes industrial and collaborative robots, autonomous mobile robots (AMRs), controllers, application solutions, services, and equipment. Powered by its intelligent software, its technologies help businesses across industries from automotive to electronics and logistics to become more resilient, flexible, and efficient.

As AI rapidly moves from the digital realm into the physical world, Physical AI, as the key bridge linking AI capabilities with real‑world industries, is becoming a core engine driving the intelligent upgrade of manufacturing sector. Against this backdrop, AsiaInfo Technologies has established a strategic partnership with ABB Robotics to jointly set up the Embodied Intelligence Laboratory, integrating both parties’ core strengths in foundation AI large models, industrial automation, communications technologies and robot control. The laboratory will focus on cutting‑edge areas such as industrial simulation and Physical AI, aiming to break through bottlenecks in the perception, decision‑making and execution capabilities of intelligent agents in complex real‑world scenarios. It will build an end‑to‑end innovation system spanning technology research and development (“R&D”), technology commercialization and large‑scale industrial deployment, thereby injecting strong AI‑driven momentum into high‑quality development.

As a leader in full‑stack digital‑intelligence capabilities, AsiaInfo Technologies will take AI large model application as the core lever, deeply integrating its strengths in 5G‑A telecommunications technology and network security to drive technology integration and large‑scale deployment at the laboratory. By developing replicable, scalable scenario‑based solutions, the Company will accelerate the rollout and value realisation of innovation in the intelligent manufacturing sector. Leveraging its global expertise in industrial automation and flexible control, ABB Robotics will provide the laboratory with real‑world, production‑line use cases and strong engineering support capabilities, enabling efficient validation, optimisation and iteration of technical solutions, and achieving deep coupling and mutual empowerment between technology and application scenarios.

The laboratory will leverage external technology partners to reinforce its R&D capabilities. By utilising Alibaba Cloud’s massive data processing power and cutting‑edge algorithmic frameworks such as Vision‑Language‑Action (VLA), and NVIDIA accelerated computing technology for training optimisation, it will significantly speeding up the industrialisation of Physical AI technologies.

The Embodied Intelligence Laboratory jointly established by AsiaInfo Technologies and ABB Robotics has been officially launched, marking the shift of their strategic partnership into a practical stage of implementation based on previous research. This collaboration represents not only a forward-looking initiative by both parties to deploy cutting-edge technologies and fulfill their industrial responsibilities, but also a pivotal step in advancing Physical AI from the laboratory into real-world applications on the factory floor. Looking forward, AsiaInfo Technologies together with partners including ABB Robotics and Alibaba Cloud, will use the laboratory as a core platform to deepen technical collaboration and scenario co‑creation, drive large‑scale deployment of Physical AI in industry, build a globally impactful benchmark for industrial intelligence, and help shape an open and collaborative Physical AI ecosystem.
Hashtag: #AsiaInfo

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Strong international validation for India’s ambitions in semiconductors and artificial intelligence has emerged during Union minister Ashwini Vaishnaw’s visit to Veldhoven, the Netherlands, where he held discussions centred on advanced manufacturing technologies and long-term collaboration. Vaishnaw described the engagement as a major opportunity to understand cutting-edge systems and align partnerships that could accelerate India’s high-technology ecosystem.

The visit to Veldhoven, home to the world’s most sophisticated chipmaking equipment capabilities, comes at a time when New Delhi is pushing to anchor itself more firmly in global semiconductor supply chains while building domestic capacity. Vaishnaw indicated that interlocutors acknowledged India’s policy direction and scale as compelling factors for deeper cooperation across semiconductors and artificial intelligence, two areas that are increasingly intertwined in next-generation computing and industrial automation.

Discussions during the trip focused on lithography technologies, supply-chain resilience and skills development, according to people familiar with the engagements. India’s pitch rests on a combination of policy incentives, a large engineering workforce and expanding demand from electronics, automotive and data-driven sectors. Officials accompanying the minister underlined that partners in Europe see India as a credible long-term manufacturing and innovation base rather than merely a consumption market.

The Netherlands occupies a critical position in the global chip industry because of its dominance in extreme ultraviolet lithography, a technology essential for producing advanced semiconductors. India’s engagement with Dutch stakeholders is therefore viewed as strategically important, particularly as countries and companies diversify supply chains amid geopolitical and commercial pressures. Vaishnaw’s meetings sought to map pathways for collaboration spanning equipment ecosystems, materials, precision engineering and research linkages.

Artificial intelligence featured prominently in the conversations, reflecting the convergence between advanced chips and AI workloads. Executives and policymakers discussed how specialised processors, high-performance computing and data infrastructure underpin AI deployment across sectors such as healthcare, mobility, energy management and public services. Indian officials emphasised the country’s growing base of AI startups, public digital platforms and applied research, arguing that closer alignment with global technology leaders would strengthen both sides.

The endorsement referenced by Vaishnaw also reflects broader international assessments of India’s semiconductor strategy, which combines fiscal incentives with infrastructure support and regulatory facilitation. Several fabrication and assembly projects have been announced across different states, while partnerships with global firms aim to address gaps in design, packaging and testing. Industry analysts note that execution risks remain, including timelines, talent depth in specialised manufacturing and integration into mature supply networks, yet acknowledge that momentum has improved.

From the Dutch perspective, collaboration with India offers access to a fast-growing market and diversification beyond traditional hubs. European technology firms have been recalibrating their engagement with Asia, balancing commercial interests with strategic considerations. India’s emphasis on trusted partnerships and standards-based cooperation resonates in this context, particularly in areas linked to critical technologies.

Vaishnaw’s visit also included interactions with research institutions and industry representatives to understand best practices in precision manufacturing and workforce training. Officials highlighted the importance of skilling programmes that align academic curricula with industry needs, a factor seen as decisive for sustaining semiconductor operations. India has been expanding such initiatives, including specialised training for chip design and manufacturing processes.

The talks in Veldhoven are part of a broader diplomatic and industrial outreach aimed at positioning India within high-value segments of global technology chains. Previous engagements with partners in East Asia and North America have similarly stressed co-development, supply assurance and innovation partnerships rather than transactional sourcing. The Netherlands visit adds a European dimension to that strategy.

At HUAWEI CONNECT 2025, Jason Li, President of Global Marketing & Solutions from Huawei’s Electric Power Digitalization Business Unit, gave a statement.

“In the power industry, there are three key trends on the distribution side. Firstly, a massive amount of new energy will be integrated into the grid. Taking China as an example, by 2030, the installed capacity of distributed PV will reach approximately 1,000 GW. Secondly, the adoption of electric vehicles (EVs) is expected to grow rapidly, with around 110 million EVs and approximately 55 million charging piles projected by 2030. This poses significant challenges for power distribution. Thirdly, digitalization is accelerating. AI has gone from a ‘nice-to-have’ to a ‘must-have.’ Power systems cannot achieve effective protection, automation, or digitization without high-quality data and reliable communication. In medium-voltage grids, we rely on private wireless networks to achieve reliable backhaul and support endpoint control. I believe 450 MHz is the optimal solution. As the lowest band within 3GPP standards, it offers wide coverage, supports vast amounts of connections, and provides highly reliable network performance, all at a low cost. Moreover, it benefits from a mature ecosystem. This makes it perhaps the best solution for power companies undergoing digital transformation.”

At Mobile World Congress 2026 in Barcelona, Huawei will showcase more success stories in private wireless networks and 450 MHz applications, along with innovative solutions for intelligent power distribution, substations, and power plant inspections. To explore successful digital transformation in the power sector, visit the Huawei booth at stand 1H50, Fira Gran Via Hall 1. For more information, please visit https://e.huawei.com/en/industries/grid.

Hashtag: #Huawei #intelligentdistribution #electric #grid #powersystem #powerwireless

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The TRUCKAIR solution integrates road and air freight to strike an optimal balance between cost and speed. Following inland pickup in China, the goods are transported via truck to Tashkent, Uzbekistan, where they are transferred via air freight for onward delivery to Istanbul, and thereafter onwards to other European destinations via various modes of transport. While costs may vary from shipment to shipment for this tailor-made solution, customers have reported six-digit figures in savings over the two months of adopting TRUCKAIR multimodal solution over airfreight solution. Additionally, with the TRUCKAIR multimodal service, the total transit time from China to Türkiye is approximately 9 to 11 days, only 4 to 5 days longer than usual transit time of 4 to 7 days by only air freight, making this service a prime choice for companies seeking a reliable and cost-effective solution for high-volume shipments.

“Demand for agile and cost-efficient logistics solutions continues to rise, backed by sustained growth in China–Europe and broader Asia–Europe trade. DHL’s latest market update points to tight capacity and rate increases into Chinese New Year, with a demand peak expected in early February 2026; TRUCKAIR helps customers avoid short term volatility while maintaining predictable lead times. China’s total imports and exports of goods grew 3.6% in the first eleven months of 2025, signaling a steady recovery in trade momentum. The European Union was also China’s second-largest trading partner in 2025, with bilateral trade up 5.4% year-on-year to RMB 5.37 trillion,” said Aditi Rasquinha, CEO of DHL Global Forwarding Greater China. “TRUCKAIR was developed to meet this growing demand for greater flexibility and predictability in cross-border shipments, enabling businesses to control costs without compromising speed.”

Designed for high-volume, general cargo shipments, the TRUCKAIR solution offers customers a cost-effective alternative to traditional air freight while maintaining delivery timelines suitable for retail and other time-sensitive and high-volume industries. Customers may also integrate TRUCKAIR with DHL’s broader portfolio of forwarding services to build customized, end-to-end supply chain solutions.

“The strategic design of the TRUCKAIR route reflects China’s pivotal role as a global trade hub,” Aditi added. “With its vast network, well-developed logistics infrastructure and rapid adoption of smart technologies and automation, the country is uniquely positioned to maintain strong connectivity with international markets. Leveraging these strengths, TRUCKAIR helps businesses to navigate supply chain challenges amid evolving global trade patterns and serves as a gateway for other Asia-Pacific markets to access Europe efficiently.

Hashtag: #DHL

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DHL – The logistics company for the world

DHL is the leading global brand in the logistics industry. Our DHL divisions offer an unrivalled portfolio of logistics services ranging from national and international parcel delivery, e-commerce shipping and fulfillment solutions, international express, road, air and ocean transport to industrial supply chain management. With approximately 400,000 employees in more than 220 countries and territories worldwide, DHL connects people and businesses securely and reliably, enabling global sustainable trade flows. With specialized solutions for growth markets and industries including technology, life sciences and healthcare, engineering, manufacturing & energy, auto-mobility and retail, DHL is decisively positioned as “The logistics company for the world”.

DHL is part of DHL Group. The Group generated revenues of approximately 84.2 billion euros in 2024. With sustainable business practices and a commitment to society and the environment, the Group makes a positive contribution to the world. DHL Group aims to achieve net-zero emissions logistics by 2050.

UAE and India have elevated their strategic partnership with a sweeping set of agreements signed during the visit of Sheikh Mohamed bin Zayed Al Nahyan, signalling a calibrated push to broaden cooperation across defence, energy, space, trade, investment and food safety. The pacts, endorsed alongside Narendra Modi, reflect a shared intent to anchor bilateral ties in long-term economic and security interests while navigating a volatile global environment.

The visit culminated in the exchange of multiple memoranda of understanding that collectively aim to translate political goodwill into operational outcomes. Officials from both sides framed the agreements as an expansion of the Comprehensive Strategic Partnership, emphasising implementation timelines and institutional coordination rather than aspirational language. At the centre of the package is a defence cooperation framework that strengthens military-to-military engagement, joint exercises, training exchanges and defence industrial collaboration, an area that has gathered momentum as both countries diversify security partnerships.

Energy cooperation featured prominently, with accords spanning hydrocarbons, clean energy and grid resilience. State-linked firms and private players outlined pathways to scale joint investments in upstream oil and gas while accelerating collaboration in renewables, green hydrogen and energy storage. The emphasis on clean energy dovetails with the UAE’s net-zero ambitions and India’s drive to expand non-fossil capacity, positioning both as partners in technology transfer and project financing across third markets.

Space cooperation agreements mark another pillar of the evolving relationship. Space agencies from Abu Dhabi and New Delhi committed to deeper collaboration in satellite development, earth observation, data sharing and human spaceflight training. The arrangements are designed to support applications ranging from climate monitoring and disaster management to urban planning and agriculture, underscoring the commercial and societal dividends of space-based assets.

Trade and investment pacts seek to build on the momentum generated by the Comprehensive Economic Partnership Agreement, which has reshaped tariff structures and supply chains between the two economies. New understandings focus on easing customs procedures, aligning standards and expanding market access for small and medium-sized enterprises. Investment promotion agencies agreed to coordinate sectoral roadmaps in manufacturing, logistics, digital services and infrastructure, with sovereign investors and development funds expected to play a catalytic role.

Food safety and agricultural cooperation agreements address a strategic priority for both governments. Protocols on standards, certification and inspection aim to streamline the movement of agri-food products while safeguarding consumer interests. Joint research initiatives are set to target crop resilience, post-harvest technologies and cold-chain logistics, reflecting lessons from climate stress and supply disruptions that have sharpened the focus on food security.

Diplomatic engagements during the visit also underscored people-to-people ties, education and skills. Universities and research institutions announced partnerships in advanced materials, artificial intelligence and health sciences, while vocational training programmes were aligned to labour market needs in construction, healthcare and digital services. These measures are intended to deepen the talent pipeline that underpins commercial ties.

Officials were careful to situate the agreements within a broader regional and global context. With shipping lanes under strain and commodity markets exposed to geopolitical shocks, both sides highlighted coordination on maritime security and supply chain resilience. The defence and logistics components of the package are expected to reinforce cooperation in the Indian Ocean region, where the UAE’s ports and India’s maritime capabilities intersect.

Economists note that the breadth of the accords reduces concentration risk by spreading cooperation across multiple sectors, while governance mechanisms embedded in the agreements could improve execution. Joint working groups, periodic reviews and dispute-resolution channels were outlined to ensure progress is measurable. Business leaders welcomed the clarity on standards and compliance, arguing that predictability lowers the cost of capital and accelerates project timelines.

Critics caution that delivery will depend on regulatory alignment and the pace of domestic approvals, particularly in capital-intensive sectors such as energy and defence manufacturing. Past initiatives have sometimes faced delays linked to procurement processes and technology transfer rules. Both governments acknowledged these constraints and signalled intent to address bottlenecks through empowered committees.

Mr Chan attended a breakfast reception hosted by virtual asset enterprise Animoca Brands, headquartered in Hong Kong, yesterday (January 20). Speaking at the meeting, Mr Chan said that Hong Kong adopts a proactive yet prudent approach to the development of digital assets guided by the principle of “same activity, same risk, same regulation” to promote responsible and sustainable market development. Since 2023, Hong Kong has issued licences to 11 virtual asset trading platforms, and a licensing regime for stablecoins is expected to be launched later this year. The Financial Secretary also noted the HKSAR Government’s leadership role in promoting tokenisation, including the issuance of three batches of tokenised green bonds amounting to around US$2.1 billion.

Mr Chan also engaged with a number of officials from different economies and regional organisations attending the WEF Annual Meeting, including Deputy Prime Minister and the Minister of Finance of Thailand, Mr Ekniti Nitithanprapas; the Secretary-General of the Cooperation Council for the Arab States of the Gulf, Mr Jasem Mohamed Albudaiwi; the Minister of Investment and Foreign Trade of Egypt, Mr Hassan El Khatib; and the State Secretary for International Finance at the Federal Department of Finance of Switzerland, Ms Daniela Stoffel. They exchanged views on the global political and economic landscape and issues of mutual concern, and explored opportunities to strengthen collaboration in areas such as trade, finance, industry development and digital transformation.

During a meeting with the Director-General of the World Trade Organization (WTO), Dr Ngozi Okonjo-Iweala, Mr Chan reiterated that Hong Kong, China firmly supports free trade and multilateralism, and expressed support for the WTO’s efforts to pursue reforms in response to current global challenges, with a view to enhancing its agility in addressing emerging issues in international trade.

On arriving Davos (January 19), Mr Chan began his visit programme by meeting with the Minister of Economy of the Sultanate of Oman, H.E. Dr Said Mohammed Al-Saqri. During the meeting, the two sides discussed ways to deepen mutually beneficial cooperation in areas such as finance, trade, green transformation and industrial development.

Mr Chan said that Hong Kong’s advantages as a “super connector” could support Oman’s transitioning from an oil-driven growth model towards a more diversified economic structure. He said that Hong Kong could facilitate Chinese Mainland and Hong Kong enterprises to invest in Oman to support its infrastructure and industrial development. At the same time, Hong Kong’s status as an international financial centre in Asia could provide Omani enterprises with an ideal platform for fundraising and financing, as well as offshore Renminbi investment and risk management products.

Mr Chan will continue his programme in Davos, including participating at the 2026 Davos-Caixin CEO Luncheon and the “How to Finance Decarbonization?” session of the WEF Annual Meeting, before returning to Hong Kong on January 24 morning.

Hashtag: #hongkong #brandhongkong #WEF #internationalhub #trade #finance

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