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Mr Chan said Hong Kong would be stepping up support measures such as computing power, land and capital, to enhance the city’s influence as a global source of original innovation.”Hong Kong’s strengths in innovative scientific research and commercialisation of research outcomes lie in our internationalised qualities, strong research capabilities, support of financial sector and a rich pool of high-calibre talents,” Mr Chan said.

He added that the Government is pressing ahead with the industrialisation of artificial intelligence (AI) and deepening its integration across various industries, while encouraging wider AI application, referred to as AI+, with an initial focus on life and health technology and embodied AI.

“I will establish and chair the Committee on AI+ and Industry Development Strategy to formulate strategies and create favourable conditions for AI to empower the transformation and development of industries,” Mr Chan said.

“We are making proactive efforts to align with the National AI+ Initiative by promoting ‘industries for AI’ and ‘AI for industries’ through application.”

The Financial Secretary highlighted that the Hong Kong Artificial Intelligence Research and Development Institute Company Limited will come into operation in the second half of this year, to promote AI+ development and transformation of R&D outcomes and advise the Government on relevant matters.

Professor Sun Dong, Secretary for Innovation, Technology and Industry, echoed the need for holistic development of AI+ development. “When you talk about AI, you cannot just talk about AI research, or just talk about the infrastructure, we have to do it together. Actually, that is what we have been doing in the past three years. Everything is very important.”

Central to the Government’s efforts in promoting I&T is the San Tin Technopole area in the Northern Metropolis development.

“The San Tin Technopole will provide a large piece of land which can help accelerate the commercialisation of R&D results and provide industrial space for prototyping, pilot and mass production,” Mr Chan said. He proposed injecting $10 billion (US$1.28 billion) as initial capital to take forward the development, while leveraging market resources to accelerate the progress.

Mr Chan also earmarked $10 billion (US$1.28 billion) to accelerate the development of the Hetao Hong Kong Park by engaging the market to speed up the disposal of the remaining land parcels under Phase 1 development, providing key infrastructure, further strengthening support to start-ups and establishing a venture fund.

Mr Chan set aside about $220 million (US$28 million) to establish in Hong Kong the first national manufacturing innovation centre outside the Chinese Mainland. This, he said, reflects the Government’s commitment to implementing the Co-operation Agreement on the Development of New Quality Productive Forces and the Promotion of New Industrialisation signed with the Ministry of Industry and Information Technology to promote industrial collaboration.

The Budget also sets out support measures for various technology-related emerging industries. Among them is the aerospace industry. The Office for Attracting Strategic Enterprises will take the lead to identify aerospace enterprises to develop in Hong Kong. Also, the Hong Kong Exchanges and Clearing Limited would review the relevant listing requirements to facilitate and attract the listing of aerospace enterprises in Hong Kong.

Noting that low earth orbit satellites can support the development of high-end industries, Mr Chan said the Government would proactively expand telecommunications infrastructure, streamline the relevant licensing regime and promote future 6G applications.

Meanwhile, the $10 billion (US$1.28 billion) Innovation and Technology Industry-Oriented Fund, introduced by the Government to channel market capital to invest in emerging fields of strategic importance, such as life and health technology, AI and robotics, as well as future industries, is expected to commence operation within this year.

“The key is to popularise the understanding and use of AI by all levels of society,” Mr Chan said.

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Debut at startup-centric zone 4YFN, Dual-presence at World Class Tech Exhibitions in Spain

HONG KONG SAR – Media OutReach Newswire – 24 February 2026 – Hong Kong Science and Technology Parks Corporation (HKSTP), in collaboration with Hong Kong Trade Development Council (HKTDC), will lead a delegation of 21 Hong Kong tech companies and institutions to showcase at Mobile World Congress (MWC) 2026—the world’s premier connectivity event, and debut at 4 Years From Now (4YFN) 2026—a global stage for start-ups, taking place concurrently 2-5 March in Barcelona, Spain.

Building on the momentum from MWC 2025—the Delegation will be featuring solutions beyond the Connectivity category, covering focus areas across Devices and Systems, Digital Transformation and support from Ecosystem Partners. The Pavilion duet ought to give a more comprehensive picture of Hong Kong’s innovation and technology (I&T) capabilities in engaging global telecom leaders, enterprise decision-makers, industry partners, and investors, bridging cutting-edge research and development (R&D) into real-world applications and propelling Hong Kong’s I&T sector onto the international stage.

Derek Chim, Head of Startup Ecosystem and Development, HKSTP said, “MWC is a global bellwether for communications technology and tech companies at any stage, to connect with the industry and investors, to have a solid ground that validate solutions, catalyse pilot projects, accelerate commercialisation, and scale internationally.”

Iris Wong, Director, Merchandise Trade and Innovation / Director, External Relations, HKTDC, said, “The Hong Kong Tech Pavilion is an ideal platform for Hong Kong tech enterprises to present their latest R&D achievements at major international tech gatherings, support their journey to explore overseas markets, while highlighting Hong Kong’s strengths as an international innovation and technology hub.”

A series of dialogues and exchanges, spanning from networking reception and themed talks to pitching sessions, will take place throughout the events at the Pavilion to facilitate partnerships and investment opportunities for innovative solutions that are market-ready with high potential for market expansion, in particular, Asmote and Cresento under “Connectivity” make stellar examples of the notion:

• 5G & 6G for Communication, Sensing, and AI computing – Shannon & Turing, (Asmote), located at MWC, specialises in mmWave technology for Integrated Sensing and Communication (ISAC) technology—drone communications and control—rising to the occasion as the city advances its low-altitude economy initiatives, while winning favors for its efficiency in managing industrial scenarios such as smart ports and dark factories. The company previously secured the world’s first 26GHz mmWave 5G commercial communications project, demonstrating its leadership in industrial-grade applications.

• Smart Performance Insights for Sport – Cresento, located at 4YFN, focused on developing an AI-powered shin guard to deliver real-time insights—performance analytics, team leaderboards, and more—with a design that incorporates into gears that athletes already wear and creates minimal friction for, in particular, football players to adapt, will be moving from prototypes to pilot collaborations with European football clubs, academies and sport tech platforms and distributors.

HKSTP continues to join hands with HKTDC to support Hong Kong tech enterprises to “go global” by jointly organising the Hong Kong Tech Pavilion to build bridges linking tech companies with the world. This expedites the industry’s progress in internationalisation to meet the growing demand for I&T globally. This will attract talents, facilitate forward-looking investments and explore opportunities globally, realising the mission of entrepreneurs to reach out to the world and further consolidate Hong Kong’s position as an international I&T hub.

Mobile World Congress Barcelona (MWC) & 4 Years From Now (4YFN)
Date: 2-5 March 2026
Venue: Fira Gran Via, Av. Joan Carles I, 64, 08908 L’Hospitalet de Llobregat, Barcelona, Spain

Hong Kong Tech Pavilion:
MWC – Booth 6E44 at Hall 6
4YFN – Booth 8.1B31 at Hall 8.1

Please visit https://bit.ly/MWC2026HKTech for more information on Hong Kong Tech Pavilion and the exhibitors.

Appendix: Full list of 21 tech entities showcasing at Hong Kong Tech Pavilion during MWC and 4YFN 2026 (in alphabetical order)

Hashtag: #HKSTP

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HKSTP

More information about HKSTP is available at www.hkstp.org

The association is dedicated to fostering mutual understanding and friendship between Japan and China. Its mission includes supporting the social welfare of Japanese “war orphans” left behind in China—individuals who endured significant hardship during the post-war turmoil and are still facing various challenges today. The organization also seeks to preserve and transmit the memories of these experiences to younger generations and to deepen bilateral exchanges.

Following Japan’s surrender in 1945, more than 4,000 Japanese children were left behind in China and raised by Chinese families. Now advanced in age, the group has decided to undertake what they call their final “gratitude tour,” which coincides with the 80th anniversary of the victory of the Chinese People’s War of Resistance Against Japanese Aggression and the World Anti-Fascist War. Since 2009, these orphans have been traveling to China every few years to acknowledge the kindness of their Chinese foster parents and other benefactors who supported them.

Sumie Ikeda, 81, head of the association of friendship of repatriates from China, is herself one of the Japanese orphans left behind in China. In an exclusive interview with CNS, she spoke in the fluent northeastern Chinese dialect of her childhood, reminiscing about her upbringing in Heilongjiang. “How could I be Japanese?” she reflected, her early identity obscured by the war’s aftermath. Separated from her biological family as an infant, she was raised in Mudanjiang, Heilongjiang Province. “My foster mother was truly an exceptional Chinese woman,” Ikeda said, noting that memories of her foster mother’s strength continue to sustain her.

A pivotal moment occurred when she was eight and local Chinese authorities identified her Japanese heritage. The words of her foster mother, who insisted “This child is mine,” left an indelible mark on Ikeda. As an adult, her search for biological roots in 1980s Japan ended in hardship and betrayal, leaving her destitute and suicidal until rescued by the Chinese consulate.

“My first life was given by my birth parents; my second by my adoptive parents,” she recounted. “In the most difficult times, it was always the Chinese people who reached out to us.”

Ikeda’s story reflects a broader historical experience. Official Japanese records recognize 2,818 such “war orphans.” Their lives, Ikeda stresses, are a living indictment of the catastrophes caused by war.

Yet, despite their hardships, their enduring sentiment is one of profound gratitude towards China. “Though Japanese by birth, we would not have survived without Chinese people,” Ikeda said.

Their collective narrative delivers a dual message of profound gratitude and solemn warning. It pays tribute to the extraordinary compassion of ordinary Chinese people—a love that chose nurture over vengeance. “We must never let war happen again. Situations like ours must never be repeated,” Ikeda urged.

“We are a group with the dual identity of both perpetrators and victims,” she reflected, a statement that embodies the complex legacy of history, humanity, and a plea for lasting peace.
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The twin agreements signal a coordinated push to deepen collaboration on artificial intelligence research, semiconductor supply chains and standards-setting at a time when global competition over emerging technologies is intensifying. Officials described the move as part of a broader effort to align trusted partners around open, secure and innovation-driven AI ecosystems.

The Pax Silica Initiative, framed as a platform for cooperation among governments, industry and research institutions, aims to promote responsible AI development anchored in democratic values and transparent governance. By endorsing the declaration, India has committed to work with other signatories on areas including AI safety frameworks, interoperability standards and resilient semiconductor networks. The initiative also seeks to reduce vulnerabilities in critical technology supply chains, particularly in advanced chips that underpin AI systems.

The Joint Statement on the India–U. S. AI Opportunity Partnership outlines specific areas of collaboration between New Delhi and Washington. According to officials familiar with the discussions, the partnership will prioritise joint research projects, exchanges between academic institutions and closer engagement between start-ups and venture capital ecosystems in both countries. It also envisages cooperation on workforce development, with a focus on skilling programmes to meet rising demand for AI engineers, data scientists and semiconductor specialists.

Senior representatives from both sides emphasised that the agreements build on an expanding technology agenda that has gathered pace over the past two years. The United States has identified India as a key partner in diversifying supply chains for critical technologies, while New Delhi has sought greater access to advanced know-how and investment to support its domestic manufacturing ambitions.

The semiconductor dimension is central to the Pax Silica framework. Global shortages during the pandemic exposed structural weaknesses in chip production networks, prompting governments to reassess their dependence on a limited number of manufacturing hubs. India has since launched incentive schemes to attract chipmakers and component suppliers, positioning itself as a complementary node in the global value chain. Closer coordination with U. S. firms and research laboratories is expected to support technology transfer and design capabilities.

Artificial intelligence governance is another pillar of the collaboration. Policymakers in New Delhi have been working on a regulatory architecture that balances innovation with safeguards against misuse. The partnership with the United States is expected to facilitate dialogue on standards, testing protocols and ethical guidelines. Both countries have expressed support for international cooperation to ensure AI systems are transparent, accountable and aligned with human rights principles.

Industry leaders present at the summit pointed to the commercial opportunities arising from deeper integration. India’s digital economy has expanded rapidly, driven by widespread smartphone adoption and a thriving start-up ecosystem. U. S. technology companies view the market as both a testing ground for scalable AI applications and a source of skilled talent. Joint ventures and research collaborations are likely to accelerate as policy barriers are addressed.

Analysts say the agreements also carry geopolitical significance. As rival powers invest heavily in AI and semiconductor capabilities, technology has become intertwined with national security and economic resilience. By formalising cooperation through the Pax Silica Declaration and the AI Opportunity Partnership, New Delhi and Washington are signalling intent to shape global norms rather than react to them.

The AI Impact Summit in New Delhi brought together policymakers, technologists and academics from multiple countries, underscoring the growing prominence of the city as a convening platform for debates on digital governance. Discussions ranged from generative AI applications in healthcare and education to concerns over misinformation and algorithmic bias. The signing of the declaration and joint statement provided a tangible outcome to those deliberations.

Officials indicated that working groups would be established to translate the commitments into concrete projects, with timelines and measurable targets to be announced in due course. Engagement with private sector stakeholders and research universities is expected to be formalised through memoranda of understanding and funding calls.